• Title/Summary/Keyword: memory interface

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Data Protocol and Air Interface Communication Parameters for Radio Frequency Identification (RFID의 프로토콜 및 인터페이스 파라미터)

  • Choi, Sung-Woon
    • Proceedings of the Safety Management and Science Conference
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    • 2007.11a
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    • pp.323-328
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    • 2007
  • This paper introduces radio frequency identification(RFID) information technologies for item management such as application interface of data protocol, data encoding rules and logical memory functions for data protocol, and, unique identification for RF tags. This study presents reference architecture and definition of parameters to be standardized, various parameters for air intreface communications, and, application requirements profiles.

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Memory Circuit of Nonvolatile Single Transistor Ferroelectric Field Effect Transistor (비휘발성 단일트랜지스터 강유전체 메모리 회로)

  • 양일석;유병곤;유인규;이원재
    • Proceedings of the IEEK Conference
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    • 2000.11b
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    • pp.55-58
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    • 2000
  • This paper describes a single transistor type ferroelectric field effect transistor (1T FeFET) memory celt scheme which can select one unit memory cell and program/read it. To solve the selection problem of 1T FeEET memory cell array, the row direction common well is electrically isolated from different adjacent row direction column. So, we can control voltage of common well line. By applying bias voltage to Gate and Well, respectively, we can implant IT FeEET memory cell scheme which no interface problem and can bit operation. The results of HSPICE simulations showed the successful operations of the proposed cell scheme.

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Development of a Nano-Electro-Mechanical Memory Simulator (나노전기기계 메모리 시뮬레이터의 개발)

  • Choi, Woo Young
    • Journal of the Institute of Electronics and Information Engineers
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    • v.49 no.10
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    • pp.122-127
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    • 2012
  • A nano-electro-mechanical (NEM) memory simulator has been developed by using Matlab. The simulator can be used for the prediction of hysterisis curves, applied forces, steady- or transient-state behavior, program/erase energy consumption and potential energy. Predicting NEM memory behavior by simple user interface, the simulator will make the design of NEM memory cells simpler.

Investigation on the Memory Traps in the Scaled MONOS Nonvolatile Semoconductor Memory Devices (Scaled MONOS 비휘발성 반도체 기억소자의 기억트랩 조사)

  • 이상은;김선주;이상배;서광열
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1994.11a
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    • pp.46-49
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    • 1994
  • In this paper we investigate the characteristics of switching and memory traps in sealed MONOS nonvolatile memory devices with different nitride thicknesses. We have demonttrated flatband voltage shift of 1V with 5V programming voltage. By fitting the experimental observations with theoretical calculations, trap density and capture cross section of memory trap at the nitride-blocking oxide interface are estimated to be 1.0${\times}$10$\^$13/ cm$\^$-2/ and 8.0${\times}$10$\^$14/ cm$\^$-2/

Development of Highly Stable Organic Nonvolatile Memory

  • Baeg, Kang-Jun;Kim, Dong-Yu;You, In-Kyu;Noh, Yong-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.904-906
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    • 2009
  • Organic field-effect transistor (OFET) memory is an emerging device for its potential to realize light-weight, low cost flexible charge storage media. Here we report on a solution-processed poly[9,9-dioctylfluorenyl-2,7-diyl]-co-(bithiophene)] (F8T2) nano floating-gate memory (NFGM) with top-gate/bottom-contact device configuration. A reversible shift in the threshold voltage ($V_{Th}$) and the reliable memory characteristics were achieved by incorporation of thin Au nanoparticles (NPs) as charge storage sites for negative electrons at the interface between polystyrene and cross-linked poly(4-vinylphenol).

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DMAC implementation On $Excalibur^{TM}$ ($Excalibur^{TM}$ 상에서의 DMAC 구현)

  • Hwang, In-Ki
    • Proceedings of the KIEE Conference
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    • 2003.11c
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    • pp.959-961
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    • 2003
  • In this paper, we describe implemented DMAC (Direct Memory Access Controller) architecture on Altera's $Excalibur^{TM}$ that includes industry-standard $ARM922T^{TM}$ 32-bit RISC processor core operating at 200 MHz. We implemented DMAC based on AMBA (Advanced Micro-controller Bus Architecture) AHB (Advanced Micro-performance Bus) interface. Implemented DMAC has 8-channel and can extend supportable channel count according to user application. We used round-robin method for priority selection. Implemented DMAC supports data transfer between Memory-to-Memory, Memory-to-Peripheral and Peripheral-to-Memory. The max transfer count is 1024 per a time and it can support byte, half-word and word transfer according to AHB protocol (HSIZE signals). We implemented with VHDL and functional verification using $ModelSim^{TM}$. Then, we synthesized using $LeonardoSpectrum^{TM}$ with Altera $Excalibur^{TM}$ library. We did FPGA P&R and targeting using $Quartus^{TM}$. We can use implemented DMAC module at any system that needs high speed and broad bandwidth data transfers.

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Memory BIST Circuit Generator System Design Based on Fault Model (고장 모델 기반 메모리 BIST 회로 생성 시스템 설계)

  • Lee Jeong-Min;Shim Eun-Sung;Chang Hoon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.42 no.2 s.332
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    • pp.49-56
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    • 2005
  • In this paper, we propose a memory BIST Circuit Creation System which creates BIST circuit based on user defined fault model and generates the optimized march test algorithm. Traditional tools have some limit that regenerates BIST circuit after changing the memory type or test algorithm. However, this proposed creation system can automatically generate memory BIST circuit which is suitable in the various memory type and apply algorithm which is required by user. And it gets more efficient through optimizing algorithms for fault models which is selected randomly according to proposed nile. In addition, it support various address width and data and consider interface of IEEE 1149.1 circuit.

A New Programming Method of Scaled SONOS Flash Memory Ensuring 1$\times$10$^{6}$ Program/Erase Cycles and Beyond (1x10$^{6}$ 회 이상의 프로그램/소거 반복을 보장하는 Scaled SONOS 플래시메모리의 새로운 프로그래밍 방법)

  • 김병철;안호명;이상배;한태현;서광열
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.54-57
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    • 2002
  • In this study, a new programming method, to minimize the generation of Si-SiO$_2$ interface traps of scaled SONOS flash memory as a function of number of program/erase cycles has been proposed. In the proposed programming method, power supply voltage is applied to the gate, forward biased program voltage is applied to the source and the drain, while the substrate is left open, so that the program is achieved by Modified Fowler-Nordheim (MFN) tunneling of electron through the tunnel oxide over source and drain region. For the channel erase, erase voltage is applied to the gate, power supply voltage is applied to the substrate, and the source and drain are open. A single power supply operation of 3 V and a high endurance of 1${\times}$10$\^$6/ prograss/erase cycles can be realized by the proposed programming method. The asymmetric mode in which the program voltage is higher than the erase voltage, is more efficient than symmetric mode in order to minimize the degradation characteristics of scaled SONOS devices because electrical stress applied to the Si-SiO$_2$ interface is reduced by short programming time.

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The Improved Electrical Endurance(Program/Erase Cycles) Characteristics of SONOS Nonvolatile Memory Device (SONOS 비휘발성 기억소자의 향상된 프로그램/소거 반복 특성)

  • 김병철;서광열
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.1
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    • pp.5-10
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    • 2003
  • In this study, a new programming method to minimize the generation of Si-SiO$_2$interface traps of SONOS nonvolatile memory device as a function of number of porgram/erase cycles was proposed. In the proposed programming method, power supply voltage is applied to the gate. forward biased program voltage is applied to the source and the drain, while the substrate is left open, so that the program is achieved by Modified Fowler-Nordheim(MFN) tunneling of electron through the tunnel oxide over source and drain region. For the channel erase, erase voltage is applied to the gate, power supply voltage is applied to the substrate, and the source and dram are left open. Also, the asymmetric mode in which the program voltage is higher than the erase voltage, is more efficient than symmetric mode in order to minimize the degradation characteristics or SONOS devices because electrical stress applied to the Si-SiO$_2$interface is reduced due to short program time.

Analysis of Trap Dependence on Charge Trapping Layer Thickness in SONOS Flash Memory Devices Based on Charge Retention Model (전하보유모델에 기초한 SONOS 플래시 메모리의 전하 저장층 두께에 따른 트랩 분석)

  • Song, Yu-min;Jeong, Junkyo;Sung, Jaeyoung;Lee, Ga-won
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.4
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    • pp.134-137
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    • 2019
  • In this paper, the data retention characteristics were analyzed to find out the thickness effect on the trap energy distribution of silicon nitride in the silicon-oxide-nitride-oxide-silicon (SONOS) flash memory devices. The nitride films were prepared by low pressure chemical vapor deposition (LPCVD). The flat band voltage shift in the programmed device was measured at the elevated temperatures to observe the thermal excitation of electrons from the nitride traps in the retention mode. The trap energy distribution was extracted using the charge decay rates and the experimental results show that the portion of the shallow interface trap in the total nitride trap amount including interface and bulk trap increases as the nitride thickness decreases.