• The Journal of Korean Institute of Communications and Information Sciences
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• v.16 no.12
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• pp.1313-1323
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• 1991

n this thesis CAM(content Addressable Memory) generator and graphic display tool for run-plot sequence in automatic generation of CAM are presented. We show that implementing the layout generation, graphic menu, mouse driver, and data structure by using the basic classes is clear and easy in modification than the conventional procedural language. For the implementation of generator which is independent of design rule or process, we use the parameterized cell so that basic cell can be changed according to user's inputs. and perform the layout by means of placement and routing using pitch mathching. Finally, the display of CIF which generated and constitution of graphic menu for total run-plot sequence are explained.

• Journal of KIISE:Computing Practices and Letters
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• v.11 no.4
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• pp.368-380
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• 2005

File systems for flash memory that is widely used as a storage device for mobile devices should provide not only high-performance data reads and writes but also a guarantee on the data integrity even on a power failure. In this paper, we explain the design and implementation of a file system for flash memory that considers flash memory's physical characteristics and the data layout in the file system to give an optimized write performance. This file system guarantees the reliability against various system failures including a power failure by using the transaction concept in write processing. In addition, the file system minimizes the memory usage by using a simple static mapping. In the paper, we also describe the implementation of the file system and compare its performance with other existing flash memory ille systems.

• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.6
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• pp.1040-1048
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• 1987

We propose a hardware architecture called Multiring which is applicable for various geometrical operations on rectilinear objects such as design rule checking in VLSI layout and many image processing operations including noise suppression and coutour extraction. It has both a fast execution speed and extremely high flexibility. The whole architecture is mainly divided into four parts` I/O between host and Multiring, ring memory, linear processor array and instruction decoder. Data transmission between host and Multiring is bit serial thereby reducing the bandwidth requirement for teh channel and the number of external pins, while each row data in the bit map stored in ring memory is processed in the corresponding processor in full parallelism. Each processor is simultaneously configured by the instruction decoder/controller to perform one of the 16 basic instructions such as Boolean (AND, OR, NOT, and Copy), geometrical(Expand and Shrink), and I/O operations each ring cycle, which gives Multiring maximal flexibility in terms of design rule change or the instruction set enhancement. Correct functional behavior of Multiring was confirmed by successfully running a software simulator having one-to-one structural correspondence to the Multiring hardware.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• Archives of design research
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• v.13 no.3
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• pp.111-122
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• 2000

To achieve the advertising objectives, we must first draw out consumer's advertisingto advertising, and then realize the data processing course from comprehension to the retention of the advertising contents. In current media environment, however, the value of advertising as the method of attracting consumer's attention is declining due to the current situation of newspaper and magazine advertising as follows. As for newspapers, competitive messages are increasing on a continuous basis; the size of advertising section and the number of newspaper pages has been increased along with the popularization of color advertising. As for magazines, more pages are allocated for advertising rather than for the actual contents. In such communication environment, it is believed that only the advertising capable of uniquely appealing to consumers can achieve the purpose of advertising. Hence, this research attempts to discuss the effective ways of promoting attention in print media through the case studies covering the design principles relating to layout and the layout format, among the visualization processes related to the consumers'memory.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.11
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• pp.152-161
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• 1996

This paper descrisbes the implementation of a 20D DCT that can be used for video conference, JPEG, and MPEG-related applications. The implemented DCT consists of two 1-D DCTs and a transposed memory between them, and uses ROM-based multipliers instead of conventional ones. As the system bit length, the minimum bit length that satisfies the accuracy specified by the ITU standard H.261 was chosen through the simulations using the C language. The proposed design uses a dual port RAM for the transposed memory, and processes two bits of input-pixel data simultaneously t ospeed up addition process using two sets of ROMs. The basic system architecture was designed using th Synopsys schematic editor, and internal modules were described in VHDL and synthesized to logic level after simulation. Then, the compass silicon compiler was used to create the final lyout with 0.8um CMOS libraries, using the standard cell approach. The final layout contains about 110, 000 transistors and has a die area of 4.68mm * 4.96mm, and the system has the processing speed of about 50M pixels/sec.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.16 no.1
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• pp.46-56
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• 1991

In this paper, 16word X 8bit Content Addressable and Reentrant Memory(CARM) is described. This device has 4 operation modes(read, write, match, reentrant). The read and write operation of CARM is like that of static RAM, CARM has the reentrant mode operation where the on chip garbage collection is accomplished conditionally. Thus function can be used for high speed matching unit of dynamic data flow computer. And CARM also can encode matching address sequentially according to therir priority. CARM consists of 8 blocks(CAM cell, Sequential Address Encoder(S.A.E). Reentrant operation. Read/Write control circuit, Data/Mask Register, Sense Amplifier, Encoder. Decoder). Designed DARM can be used in data flow computer, pattern, inspection, table look-up, image processing. The simulation is performed using the QUICKSIM logic simulator and Pspice circuit simulator. Having hierarchical structure, the layout was done using the 3{\;}\mu\textrm{m} n well CMOS technology of the ETRI design rule.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.6
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• pp.742-750
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• 2018

In this paper, in order to enable zero-layer FTP cell using only 5V MOS devices on the basis of $0.13{\mu}m$ BCD process, the tunnel oxide thickness is used as the gate oxide thickness of $125{\AA}$ of the 5V MOS device at 82A. The HDNW layer, which is the default in the BCD process, is used. Thus, the proposed zero layer FTP cell does not require the addition of tunnel oxide and DNW mask. Also, from the viewpoint of memory IP design, a single memory structure which is used only for trimming analog circuit of PMIC chip is used instead of the dual memory structure dividing into designer memory area and user memory area. The start-up circuit of the BGR (Bandgap Reference Voltage) generator circuit is designed to operate in the voltage range of 1.8V to 5.5V. On the other hand, when the 64-bit FTP memory IP is powered on, the internal read signal is designed to maintain the initial read data at 00H. The layout size of the 64-bit FTP IP designed using the $0.13-{\mu}m$ Magnachip process .is $485.21{\mu}m{\times}440.665{\mu}m$($=0.214mm^2$).

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.8
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• pp.1734-1740
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• 2012

In this paper, we propose a FSOURCE circuit which requires such a small switching current that an eFuse OTP memory can be programmed in the post-package state of the PMIC chips using a single power supply. The proposed FSOURCE circuit removes its short-circuit current by using a non-overlapped clock and reduces its maximum current by reducing the turned-on slope of its driving transistor. Also, we propose a DOUT buffer circuit initializing the output data of the eFuse OTP memory with arbitrary data during the power-on reset mode. We design a 24-bit differential paired eFuse OTP memory which uses Magnachip's $0.35{\mu}m$ BCD process, and the layout size is $381.575{\mu}m{\times}354.375{\mu}m$($=0.135mm^2$).

• Journal of Korea Multimedia Society
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• v.13 no.7
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• pp.1023-1043
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• 2010

As main memory get cheaper, it becomes increasingly affordable to load entire index of DBMS and to access the index. Since speed gap between CPU and main memory is growing bigger, many researches to reduce a cost of main memory access are under the progress. As one of those, cache conscious trees can reduce the cost of main memory access. Since cache conscious trees reduce the number of cache miss by compressing data in node, cache conscious trees can reduce the cost of main memory. Existing cache conscious trees use only fixed one compression technique without consideration of properties of data in node. First, this paper proposes the DC-tree that uses various compression techniques and change data layout in a node according to properties of data in order to reduce cache miss. Second, this paper proposes the level of compression locality that describes properties of data in node by formula. Third, this paper proposes Forced Partial Decomposition (FPD) that reduces the nutter of cache miss. DC-trees outperform 1.7X than B+-tree, 1.5X than simple prefix B+-tree, and 1.3X than pkB-tree, in terms of the number of cache misses. Since proposed DC-trees can be adopted in commercial main memory database system, we believe that DC-trees are practical result.