• Journal of Welding and Joining
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• 제18권2호
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• pp.227-227
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• 2000

Pressure vessels usually consist of main body and pipes which are connected with the main body. And as joining method of such main body and pipes, welding is carried out. After welding, welding residual stresses inevitably occur around welded joints. As residual stresses act harmfully on fatigue strength, corrosion and buckling strength of structure, PWHT is carried out for the purpose of removing the residual stress. But, during PWHT process, 2 ¼Cr-1Mo steels are frequently apt to generate reheat crack. For this reason, it is strongly needed to analyze and examine the mechanical behavior of welded joints before and after PWHT process. So, in this study, welded nozzle parts of pressure vessel where reheat cracks frequently occur are selected for examining the mechanism of crack-occurrence. (Received December 2, 1999)

• Journal of Welding and Joining
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• 제18권2호
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• pp.100-104
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• 2000

Pressure vessels usually consist of main body and pipes which are connected with the main body. And as joining method of such main body and pipes, welding is carried out. After welding, welding residual stresses inevitably occur around welded joints. As residual stresses act harmfully on fatigue strength, corrosion and buckling strength of structure, PWHT is carried out for the purpose of removing the residual stress. But, during PWHT process, $2\frac{1}{4}Cr-1Mo$ steels are frequently apt to generate reheat crack. For this reason, it is strongly needed to analyze and examine the mechanical behavior of welded joints before and after PWHT process. So, in this study, welded nozzle parts of pressure vessel where reheat cracks frequently occur are selected for examining the mechanism of crack-occurrence.

• Journal of Welding and Joining
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• 제33권5호
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• 한국정밀공학회지
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• 제28권10호
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• pp.1204-1209
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• 2011

In this study, fatigue life is evaluated by comparing with lighter car body through the experiment on SPR joints. An experimental activity on sheet metal samples of Aluminum 5J32 and Steel SPRC440 has been conducted to achieve better understanding of the process. In addition, SPR joint used less than the existing Spot Welding improves joint strength and fatigue life is evaluated by using SPR and adhesive joining Hybrid. Joining(bonding) strength and fatigue life on SPR and Hybrid (SPR + adhesive) are evaluated throughout the experiment. With joining strength than 20 % of the aluminum material, dissimilar materials has improved over 2 times as large as the strength In case of dissimilar materials, the fatigue life of aluminum is increased by 1.6 to 2.5 times as large as the life.

• Journal of Welding and Joining
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• 제22권4호
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• pp.50-58
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• 2004

In this study, high temperature tensile properties of high strength steels(POSTEN60, POSTEN80) were investigated. The three-dimensional thermal elastic-plastic analyses were conducted to investigate the characteristics of welding residual stresses in welds of high strength steels on the basis of thermal and mechanical properites at high temperature obtained from the experiment. According to the results, high temperature tensile strength of POSTEN60 steel deteriorated slowly to 10$0^{\circ}C$. As the temperature went up, the tensile strength became better because of blue shortness, and it deteriorated radically after reaching to the maximum value around 30$0^{\circ}C$. For the POSTEN80 steel, high temperature tensile strength deteriorated slowly to 20$0^{\circ}C$. As the temperature went up the tensile strength became better and it deteriorated slowly to $600^{\circ}C$ after reached to the maximum value around 30$0^{\circ}C$. Strain of high strength steels at the elevated temperature increased radically after the mercury rose to $600^{\circ}C$. The strain hardening ratio of POSTEN60 steel was larger then that of POSTEN80 steel at the elevated temperature as in the case at the room temperature and it became smaller radically after the mercury rose to 40$0^{\circ}C$. And, in the welding of high strength steels, increasing tensile strength of the steel (POSTEN60

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1998년도 특별강연 및 추계학술발표 개요집
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• pp.216-218
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• 1998

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2000년도 특별강연 및 추계학술발표대회 개요집
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• pp.311-313
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• 2000

• 한국재료학회지
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• 제21권12호
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• pp.650-654
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• 2011

In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.

• 한국기계가공학회지
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• 제21권2호
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• pp.87-93
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• 2022

The demand for metal-polymer joining technology have been increasing, especially in the industrial fields of automotive and aerospace, which require the manufacturing of various lightweight parts. Conventional joining processes have technical hurdles on aspects such as thermal degradation, need for chemical surface treatment, or complicated process settings. These issues can be alleviated by employing interlocking structures for the metal-polymer joined interface. In this study, we joined 3D-printed metal and polymer parts, which were featured with 3D-printed interlocking structures at their interface. By using high frequency induction heating, the joined region could be locally heated to reduce the thermal degradation and distortion of polymer parts. In addition, through the adjustment of interface morphologies and compression conditions, the polymer flow could be optimized to completely fill the interlocking grooves on metal parts, thereby achieving high joining strength. This suggests feasible guidelines for manufacturing metal-polymer joined structures involving 3D-printed architectures.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2000년도 특별강연 및 추계학술발표대회 개요집
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• pp.192-195
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• 2000

This paper describes a fundamental investigation of the friction welding condition for pure copper/pure titanium and the effect of friction time, upset pressure on the mechanical and metallurgical properties of friction welding. Under the constant upset pressure, the tensile strength make a little difference with an increase in friction time. At the constant friction time, the tensile strength increased with an increase in upset pressure. The tensile fracture of Cu to Ti joint occurred in Cu base material near interface.