• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2165-2170
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• 2007

At nanoscales, the Boltzmann transport equation (BTE) can best describe the behavior of phonons which are energy carriers in crystalline materials. Through this study, the phonon transport in some micro/nanoscale problems was simulated with the Monte Carlo method which is a kind of the stochastic approach to the BTE. In the Monte Carlo method, the superparticles of which the number is the weighted value to the actual number of phonons are allowed to drift and be scattered by other ones based on the scattering probability. Accounting for the phonon dispersion relation and polarizations, we have confirmed the one-dimensional transient phonon transport in ballistic and diffusion limits, respectively. The thermal conductivity for GaAs was also calculated from the kinetic theory by using the proposed model. Besides, we simulated the electrostatic discharge event in the NMOS transistor as a two-dimensional problem by applying the Monte Carlo method.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1652-1657
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• 2004

Model for the dynamic simulation of dynamic behaviors of a solid oxide fuel cell (SOFC) is provided. This model is based upon (1) coupled mass and heat transfer characteristics and (2) important chemical reactions such as electrochemical and reforming reaction in high temperature fuel cells such as SOFC. It is found that the thermal inertia of solid materials in SOFC plays an important role to the dynamic behavior of cell temperature. Dynamic characteristics of cell voltage, power and chemical compositions with different levels of load changes are investigated.

• Journal of Powder Materials
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• v.15 no.3
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• pp.204-209
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• 2008

Aluminum alloys are not only lightweight materials, but also have excellent thermal conductivity, electrical conductivity and workability, hence, they are widely used in industry. It is important to control and enhance the densification behavior of metal powders of aluminum. Investigation on the extrusion processing combined with equal channel angular pressing for densification of aluminum powders was performed in order to develop a continuous production process. The continuous processing achieved high effective strain and full relative density at $200^{\circ}C$. Optimum processing conditions were suggested for good mechanical properties. The results of this simulation helped to understand the distribution of relative density and effective strain.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.847-852
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• 2001

A thorough understanding of the transient behavior during load following and start-up is essential in the design and operation of an heat recovery steam generator(HRSG). During this period of time, material that is exposed to high temperature and experiences a large temperature variation is subject to high thermal stress. APESS(Advanced Plant Engineering & Simulation System) is a dynamic simulation software for power plant which is under being developed by Doosan Heavy Industries & Construction Co., Ltd. This paper present the introduction of APESS and the result of simulation for an heat recovery steam generator.

• Coupled systems mechanics
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• v.7 no.1
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• pp.5-25
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• 2018

A fully-coupled thermodynamic-based transient finite element formulation is proposed in this article for electric, magnetic, thermal and mechanic fields interactions limited to the linear case. The governing equations are obtained from conservation principles for both electric and magnetic flux, momentum and energy. A full-interaction among different fields is defined through Helmholtz free-energy potential, which provides that the constitutive equations for corresponding dual variables can be derived consistently. Although the behavior of the material is linear, the coupled interactions with the other fields are not considered limited to the linear case. The implementation is carried out in a research version of the research computer code FEAP by using 8-node isoparametric 3D solid elements. A range of numerical examples are run with the proposed element, from the relatively simple cases of piezoelectric, piezomagnetic, thermoelastic to more complicated combined coupled cases such as piezo-pyro-electric, or piezo-electro-magnetic. In this paper, some of those interactions are illustrated and discussed for a simple geometry.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1995.10a
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• pp.60-63
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• 1995

The behavior of the work materials in the chip-tool interface in extremely high strain rates and temperatures is more that of viscous liquids than that of normal solid metals. In these circumstances the principles of fluid mechanics can be invoked to describe the metal flow in the neighborhood of the cutting edge. In the present paper an Eulerian finite element model is presented that simulates metal flow in the vicinity of the cutting edge when machining a low carbon steel with carbide cutting tool. The work material is assumed to obey visco-plastic (Bingham solid) constitutive law and Von Mises criterion. Heat generation is included in the model, assuming adiabatic conditions within each element. the mechanical and thermal properties of the work material are accepted to vary with the temperature. The model is based on the virtual work-stream function formulation, emphasis is given on analyzing the formation of the stagnant metal zone ahead of the cutting edge. The model predicts flow field characteristics such as material velocity effective stress and strain-rate distributions as well as built-up layer configuration

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.228-232
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• 2003

It has recently been shown that the instability of thin film of a nanoscale can be used in the processes of building nano-size structures, which have potential practical importance in nanotechnology. Molecular dynamics simulation is conducted to probe the thin fluid film of a nano-size and its dynamic behavior during destabilization and structure formation. Non-continuum characteristics are shown in the properties like pressure tensor, viscosity, and thermal conductivity. The thermocapillary force induces a slow growth of long waves in the scale considered. A long-range interaction with the solid wall induces vertical structures, whose formation time and space between neighbors are proportional to the strength of the interaction.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.3
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• pp.243-249
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• 2005

The present study has been conducted to simulate dynamics of a gas engine-driven heat pump(GHP) for design of control algorithm. The dynamic modeling of a GHP was based on conservation laws of mass and energy. For automatic control of refrigerant pressures, actuators such as engine speed, outdoor fan, coolant three-way valves and liquid injection valve were PI or P controlled. The simulation results showed physical behavior that is realistic enough to apply for control algorithm design.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2298-2303
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• 2008

The increasing demands for the recently released CPU which has had higher heat density, the confined space of desktop PCs, and so on are the main drive for continuously improving PC cooling systems. In order to meet number of demands, this paper describes the flow and thermal behavior of the heat sink combined with heat pipes, and a fan through the numerical analysis by using the computational fluid dynamics(CFD) code and discusses how to extend the cooling capability.