• Title/Summary/Keyword: material processing

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The Area Measurement of Composite Specimen using Digital Image Processing (디지털 영상처리를 이용한 복합재료 시편의 면적 측정)

  • Son, Byung Jik;Lee, Kyu Hwan
    • Journal of the Korean Society for Advanced Composite Structures
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    • v.6 no.2
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    • pp.17-22
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    • 2015
  • In this paper, we study the calculation for the fracture area of the composite material specimens using digital image processing techniques. This study was able to calculate the area of the fracture region through the main operation step 7 on the basis of improved image. To extract the area in the original image, we have to use opening operation, close operation, the Hit-or-Miss operation and Bottom hat filter, Top hat filter, etc. In particular, to extract the area of the composite specimen discussed in this study, we have to use the combination of the operations and filters because it is non-isotropic material, or should develop a new algorithm based on it.

Pulse response characteristics and preparation of piezoelectic composite materials with 1-3 connectivity (1-3형 압전복합재료의 제조 및 펄스응답특성)

  • 김진수;김용혁;김호기;이덕출
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1989.06a
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    • pp.77-80
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    • 1989
  • The aim of the study is to develope the processing technique of PZT-Polymer piezoelectric composite materials for ultrasonic transducer application such as biomedical probe and hydrophone. Piezoelectric composite of PZT and polymer with 1-3 connectivity patterns have been fabricated by dicing-filling method and extrusion forming method. In this study processing forming method. In the study processing steps by extrusion forming method in the preperation of PZT/polymer piezoelectric composites are described. The PZT powder used in the study is commercial powder which is prepared by mixing PbO, TiO$_2$ and ZrO$_2$. The binder, water and plasticizer are mixed with the PZT powder to form a slip. It is necessary to adjust the viescosity of slip according on the PZT rod diameters to be extruded. The electromechanical properties of the piezoelectric composites are characterized in terms of the thickness resonance mode. The pulse response characteristics by the ultrasonic transducer analyzer and osciloscope are evaluated.

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Applications of Plasma Modeling for Semiconductor Industry

  • Efremov, Alexandre
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.3-6
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    • 2002
  • Plasma processing plays a significant role in semiconductor devices technology. Development of new plasma systems, such as high-density plasma reactors, required development of plasma theory to understand a whole process mechanism and to be able to explain and to predict processing results. A most important task in this way is to establish interconnections between input process parameters (working gas, pressure, flow rate, input power density) and various plasma subsystems (electron gas, volume and heterogeneous gas chemistry, transport), which are closely connected one with other. It will allow select optimal ways for processes optimization.

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Low temperature UV-assisted rapid thermal processing of (Ba,Sr)$TiO_3$ thin films (저온에서 (Ba,Sr)$TiO_3$ 박막의 UV를 이용한 RTP에 관한 연구)

  • Cho, Kwang-Hwan;Kang, Chong-Yun;Yoon, Seok-Jin;Lee, Young-Pak
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.234-234
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    • 2008
  • Chemically homogeneous $Ba_{0.6}Sr_{0.4}TiO_3$ (BST) sols were synthesized using barium acetate, strontium acetate, and titanium isoproxide as starting materials. BST thin films of thickness 340 nm were deposited on Pt/$TiO_2/SiO_2$/Si and alumina substrates using spin coating method. The technique used for the processing of these films was Ultraviolet (UV) sol-gel photoannealing, using phto-sensitivity precursor solutions and UV-assisted rapid thermal processing(UV-RTP). The crystallization behaviour of the BST sols and thin films was studied by differential thermal analysis (DTA) and X-ray diffraction (XRD). Variation of permittivity and dielectric loss were measured in LCR-meter, model HP 4394A.

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The local polishing of material surface using the $CO_2$ laser ($CO_2$ 레이저를 이용한 시료 표면의 국부 폴리싱)

  • Kim, Young-Seop;Shon, Ik-Bu;Noh, Young-Chul
    • Laser Solutions
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    • v.12 no.2
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    • pp.7-10
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    • 2009
  • In this paper, we study experimentally the local polishing of $SiO_2$ surface using the $CO_2$ laser. For laser local polishing, we polished to remove the grooves or to be reformed the surface of grooves after forming the grooves on the material surface. We measured the reflectance, transmittance, and beam profile in order to measure the roughness of polished surface. The Atom Force Microscope (AFM) is used to measure roughness of local polishing surface. We can predict that the laser polishing contribute to the removal of generated debris and surface roughness on the micro processing.

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Parallel Implementation of Nonlinear Analysis Program of PSC Frame Using MPI (MPI를 이용한 PSC 프레임 비선형해석 프로그램의 병렬화)

  • 이재석;최규천
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 2001.04a
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    • pp.61-68
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    • 2001
  • A parallel nonlinear analysis program of prestressed concrete frame is migrated on a PC cluster system and a massively parallel processing system, CRAY T3E system, using MPI. The PC cluster system is configured with Pentium Ⅲ class PCs and fast ethernet. The CRAY T3E system is composed of a set of nodes each containing one Processing Element (PE), a memory subsystem and its distributed memory interconnect network. Parallel computing algorithms are implemented on element-wise processing parts including the calculation of stiffness matrix, element stresses and determination of material states, check of material failure and calculation of unbalanced loads. Parallel performance of the migrated program is evaluated through typical numerical examples.

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Design and Fabrication of Micro Patterns on Flexible Copper Clad Laminate (FCCL) Using Imprinting Process (임프린트 공정을 이용한 연성동박적층필름(FCCL)의 마이크로 패턴 제작)

  • Min, Chul Hong;Kim, Tae Seon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.28 no.12
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    • pp.771-775
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    • 2015
  • In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with $10{\mu}m$ linewidth are fabricated on $180mm{\times}180mm$ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with $10{\sim}20{\mu}m$, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

A Study on the Deformation Characteristics of Blanking Mold by the Change of Punch Shear Angle (블랭킹 금형의 펀치 전단 각 변화에 따른 변형 특성 연구)

  • Jong-Won Song;Tae-Gun Kim
    • Design & Manufacturing
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    • v.17 no.1
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    • pp.13-19
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    • 2023
  • Blanking processing is one of the shear processing method in which the cut part becomes a product and piercing processing is a press molding process in which the cut part is discarded as a scrap. The shear angle of the punch used for blanking is determined by conditions such as the characteristics of the shear material, shear thickness and shear length. The shear angle of a punch is an important factor in determining the size of the shear load, the life of the shear punch, the deformation of the shear product and the quality of burrs In this study, blanking punches applied with four types of shear angles (i.e., 0°, 0°23", 0°46", 0°69") to the blanking punches of bracket products used in practical work were manufactured and tested. In the blanking experiment, the remaining variables except for the shear angle were the same. Experiments show that the product has the least amount of deformation in blanking punches with a shear angle equal to the material thickness, i.e., 0°46"..

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Effects of Main Shaft Velocity on Turbidity and Quality of White Rice in a Rice Processing System

  • Cho, Byeong-Hyo;Kang, Tae-Hwan;Won, Jin-Ho;Kang, Shin-Hyeong;Lee, Hee-Sook;Han, Chung-Su
    • Journal of Biosystems Engineering
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    • v.42 no.1
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    • pp.69-74
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    • 2017
  • Purpose: The purpose of this study is to analyze turbidity and quality characteristics of white rice as a function of main shaft blast velocity and to verify the optimum processing conditions in the cutting type white rice processing system (CTWRPS). Methods: Sindongjin, one of the rice varieties, which used to be produced in Gimje-si, Jeollabuk-do, in 2015, was used as the experimental material. Turbidity and quality characteristics of white rice were measured at three different main shaft blast velocities: 25, 30, and 35 m/s. The amount of test material used for a single experiment was 20 kg, and after processing, whiteness was found to be $42.5{\pm}0.5$, following which, turbidity and quality characteristics were measured. Results: Turbidity decreased with increase in the shaft blast velocity, and as a result, was lowest at 35 m/s of shaft blast velocity among all the other experiment velocities. The trend of cracked rice ratios was similar to the turbidity. Broken rice ratio turned out to be less than 2.0% in all the test conditions. In the first stage of processing, the processing pressure decreased as the main shaft blast velocity increased. Additionally, in the second stage of processing, the processing pressure was at its lowest value at the main shaft blast velocity of 35 m/s. Energy consumption, too, decreased as the main shaft blast velocity was increased. Conclusions: From the above results, it is concluded that the main shaft blast velocity of 35 m/s is best for reducing turbidity and producing high quality rice in a CTWRPS.

Finite Element Prediction of Deformation of Material due to Springback after Material Removal of a Forging (단조 후 소재 절삭에 따른 탄성회복 변형의 유한요소예측)

  • Joun, M.S.;Chung, W.J.;Jeong, S.W.
    • Transactions of Materials Processing
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    • v.26 no.4
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    • pp.205-209
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    • 2017
  • In this paper, finite element prediction of deformation of material due to springback after material removal by an axisymmetric forging fabrication at room temperature is conducted. An elastoplastic finite element method is employed considering die plastic deformation. The predictions of a springback analysis conducted after the final stroke of an axisymmetric cold forging process containing residual stresses are utilized to be mapped onto the final material after the material removal. It is assumed that material removal occurs at an instant, i.e., all the material to be removed disappears at once. The predictions are compared with experiments, revealing strong qualitative agreement.