• 한국레이저가공학회지
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• 제15권4호
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• pp.16-19
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• 2012

Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

• 전자공학회논문지
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• 제50권12호
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• pp.176-183
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• 2013

본 논문에서는 회전을 통해 입력되는 연속 프레임 단위의 평면지문을 효과적으로 정합하여 보다 많은 지문의 특징점 정보를 취득함으로써, 지문 인식율을 높일 수 있는 회전지문 정합 알고리즘을 제안한다. 본 논문에서 제안한 가변 투영마스크를 이용한 회전지문 정합 알고리즘은 배경과 평면지문을 분리하는 검출부와 검출된 영상을 순차적으로 투영할 수 있는 투영 마스크 생성부를 갖는다. 또한 정합부에서는 생성된 가변 투영마스크를 중심영상부터 피라미드 형태의 투영법을 이용하여 정합된 회전지문을 취득하였다. 모의실험 결과 평면지문에서 추출되는 특징점수 평균 46.79%, 매칭을 위한 좋은 정보를 포함한 GOOD특징점의 개수는 52.0% 많이 검출됨을 보였다.

• 한국인쇄학회지
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• 제5권1호
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• pp.25-32
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• 1987

Following results about Y, M, C mask are obtained by the Indirect-Screen Color Separation Method. We mark use of experimental system which are in use for the student education. In the All-Projection Method of transparency Copy, the results are summerized as follows; (omitted)

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.361-362
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• 2012

• 한국레이저가공학회지
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• 제16권3호
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• pp.27-31
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• 2013

To engrave high-density circuit-line patterns in IC substrates, we applied a projection ablation technique in which a dielectric ($ZrO_2/SiO_2$) mask, a DPSS UV laser instead of an excimer laser, a refractive beam shaping optics and a galvo scanner are used. The line/space dimension of line patterns of the dielectric mask is $10{\mu}m/10{\mu}m$. Using a ${\pi}$ -shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam; and a telecentric f-${\theta}$ lens focuses it to a $115{\mu}m{\times}105{\mu}m$ flat-top beam on the mask. The galvo scanner before the f-${\theta}$ lens moves the beam across the scan area of $40mm{\times}40mm$. An 1:1 projection lens was used. Experiments showed that the widths of the engraved patterns in a buildup film ranges from $8.1{\mu}m$ to $10.2{\mu}m$ and the depths from $8.8{\mu}m$ to $11.7{\mu}m$. Results indicates that it is required to increase the projection ratio to enhance profiles of the engraved patterns.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2010년도 추계학술대회
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• pp.167-170
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• 2010

본 논문에서는 프로젝션 함수와 허프 변환을 이용하여 영상에서 눈동자를 찾는 방법을 제안한다. 먼저, 영상으로부터 얼굴영역을 추출한 다음, 눈썹과 눈동자의 밝기변화의 특징을 이용할 수 있는 integral projection function과 variance projection function을 사용하여 눈 영역을 검출한다. 검출된 눈 영역에서 눈동자 중심좌표를 구하기 위해 원형 허프 변환을 이용한다. 원형 허프 변환에 사용된 좌표는 sobel edge mask를 사용하여 구한다. FERET database의 정면 얼굴 영상을 이용하여 제안된 방법으로 실험한 결과 만족할 만한 결과가 나왔다.

• 한국레이저가공학회지
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• 제17권3호
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• pp.19-23
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• 2014

To directly engrave circuit-line patterns as wide as $6{\mu}m$ in a buildup film to be used as an IC substrate, we applied a projection ablation technique in which an 8 inch dielectric ($ZrO_2/SiO_2$) mask, a DPSS 355nm laser instead of an excimer laser, a ${\pi}$-shaper and a galvo scanner are used. With the ${\pi}$-shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam. The galvo scanner before the $f-{\theta}$ lens moves the flat-top beam ($115{\mu}m{\times}105{\mu}m$) across the 8 inch dielectric mask whose patterned area is $120mm{\times}120mm$. Based on the results of the previous research by the authors, the projection ratio was set at 3:1. Experiments showed that the average width and depth of the engraved patterns are $5.41{\mu}m$ and $7.30{\mu}m$, respectively.

• 한국정밀공학회지
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• 제20권2호
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• pp.33-39
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• 2003

A new microlens fabrication technique, the excimer laser lithography is developed. This bases on the pulsed laser irradiation and the transfer of a chromium-on-quartz reticle on to the polymer surface with a proper projection optics system. An excimer laser lithography system with 1/4 and 1/20 demagnification ratios was constructed first, and the photoablation characteristics of the PMMA and Polyimide were experimentally examined using this system. For two different shapes of microlenses, a spherical lens and a cylindrical lens, fabrication techniques were investigated. One for the spherical lens is a combination of the mask pattern projection and fraction effect. The other for the cylindrical lens is a combination of the mask pattern projection and the relative movement of a specimen. The result shows that various shapes of micro optical components can be easily fabricated by the excimer laser lithography.

• 한국정밀공학회지
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• 제24권8호통권197호
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• pp.138-143
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• 2007

Microstereolithography technology is similar to the conventional stereolithography process and enables to fabricate a complex 3D microstructure. This is divided into scanning and projection type according to aiming at precision and fabrication speed. The scanning MSL fabricates each layer using position control of laser spot on the resin surface, whereas the projection MSL fabricates one layer with one exposure using a mask. In the projection MSL, DMD used to generate dynamic pattern consists of $1024{\times}768$ micromirrors which have $13.68{\mu}m$ per side. The fabrication range and resolution are determined by the field of view of the DMD and the magnification of the projection lens. If using the projection lens with high power, very fine microstructures can be fabricated. In this paper, the projection MSL system adapted to a large surface for array-type fabrication is presented. This system covers the meso range, which is defined as the intermediate range between micro and macro, with a resolution of a few ${\mu}m$. The fabrication of array-type microstructures has been demonstrated to verify the performance of implemented system.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 추계학술대회 논문요약집
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• pp.61-61
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• 2003