• Laser Solutions
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• v.15 no.4
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• pp.16-19
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• 2012

Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.12
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• pp.176-183
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• 2013

We propose a rolled fingerprint merging algorithm that effectively merges plain fingerprints in consecutive frame units that are fed through rolling and detects more fingerprint minutiae in order to increase the fingerprint recognition rate. The proposed rolled fingerprint merging algorithm uses a adaptive projection mask; it contains a detector that separates plain fingerprints from the background and a projection mask generator that sequentially projects the detect ed images. In addition, in the merging unit, the pyramid-shaped projection method is used to detect merged rolled fingerprints from the generated variable projective mask, starting from the main images. Simulations show that the extracted minutia e are 46.79% more than those from plain fingerprints, and the proposed algorithm exhibits excellent performance by detecting 52.0% more good fingerprint minutiae that are needed for matching.

• Journal of the Korean Graphic Arts Communication Society
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• v.5 no.1
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• pp.25-32
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• 1987

Following results about Y, M, C mask are obtained by the Indirect-Screen Color Separation Method. We mark use of experimental system which are in use for the student education. In the All-Projection Method of transparency Copy, the results are summerized as follows; (omitted)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.361-362
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• 2012

• Laser Solutions
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• v.16 no.3
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• pp.27-31
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• 2013

To engrave high-density circuit-line patterns in IC substrates, we applied a projection ablation technique in which a dielectric ($ZrO_2/SiO_2$) mask, a DPSS UV laser instead of an excimer laser, a refractive beam shaping optics and a galvo scanner are used. The line/space dimension of line patterns of the dielectric mask is $10{\mu}m/10{\mu}m$. Using a ${\pi}$ -shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam; and a telecentric f-${\theta}$ lens focuses it to a $115{\mu}m{\times}105{\mu}m$ flat-top beam on the mask. The galvo scanner before the f-${\theta}$ lens moves the beam across the scan area of $40mm{\times}40mm$. An 1:1 projection lens was used. Experiments showed that the widths of the engraved patterns in a buildup film ranges from $8.1{\mu}m$ to $10.2{\mu}m$ and the depths from $8.8{\mu}m$ to $11.7{\mu}m$. Results indicates that it is required to increase the projection ratio to enhance profiles of the engraved patterns.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.167-170
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• 2010

In this paper, we proposed a novel algorithm to detect the center of pupil in frontal view face. This algorithm, at first, extract an eye region from the face image using integral projection function and variance projection function. In an eye region, detect the center of pupil positions using circular hough transform with sobel edge mask. The experimental results show good performance in detecting pupil center from FERET face image.

• Laser Solutions
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• v.17 no.3
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• pp.19-23
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• 2014

To directly engrave circuit-line patterns as wide as $6{\mu}m$ in a buildup film to be used as an IC substrate, we applied a projection ablation technique in which an 8 inch dielectric ($ZrO_2/SiO_2$) mask, a DPSS 355nm laser instead of an excimer laser, a ${\pi}$-shaper and a galvo scanner are used. With the ${\pi}$-shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam. The galvo scanner before the $f-{\theta}$ lens moves the flat-top beam ($115{\mu}m{\times}105{\mu}m$) across the 8 inch dielectric mask whose patterned area is $120mm{\times}120mm$. Based on the results of the previous research by the authors, the projection ratio was set at 3:1. Experiments showed that the average width and depth of the engraved patterns are $5.41{\mu}m$ and $7.30{\mu}m$, respectively.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.2
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• pp.33-39
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• 2003

A new microlens fabrication technique, the excimer laser lithography is developed. This bases on the pulsed laser irradiation and the transfer of a chromium-on-quartz reticle on to the polymer surface with a proper projection optics system. An excimer laser lithography system with 1/4 and 1/20 demagnification ratios was constructed first, and the photoablation characteristics of the PMMA and Polyimide were experimentally examined using this system. For two different shapes of microlenses, a spherical lens and a cylindrical lens, fabrication techniques were investigated. One for the spherical lens is a combination of the mask pattern projection and fraction effect. The other for the cylindrical lens is a combination of the mask pattern projection and the relative movement of a specimen. The result shows that various shapes of micro optical components can be easily fabricated by the excimer laser lithography.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.8 s.197
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• pp.138-143
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• 2007

Microstereolithography technology is similar to the conventional stereolithography process and enables to fabricate a complex 3D microstructure. This is divided into scanning and projection type according to aiming at precision and fabrication speed. The scanning MSL fabricates each layer using position control of laser spot on the resin surface, whereas the projection MSL fabricates one layer with one exposure using a mask. In the projection MSL, DMD used to generate dynamic pattern consists of $1024{\times}768$ micromirrors which have $13.68{\mu}m$ per side. The fabrication range and resolution are determined by the field of view of the DMD and the magnification of the projection lens. If using the projection lens with high power, very fine microstructures can be fabricated. In this paper, the projection MSL system adapted to a large surface for array-type fabrication is presented. This system covers the meso range, which is defined as the intermediate range between micro and macro, with a resolution of a few ${\mu}m$. The fabrication of array-type microstructures has been demonstrated to verify the performance of implemented system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.61-61
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• 2003