• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.298-298
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• 2006

There has been much interest in incorporating nanoscale voids into dielectric materials in order to reduce their k value, and thus in producing low-k porous interdielectric materials. One approach to the development of low-k dielectric materials is the templated polycondensation of organosilicate precursors in the presence of a thermally labile, organic polymeric porogen. The other is SiOCH films have low dielectric constant as well as good mechanical strength and high thermal stability through PECVD. In this article we explore the nanopore generation mechanism of organosilicate film using star-shape porogen and SiOCH film using bis-trimethylsilylmethane (BTMSM) precursor.

• Macromolecular Research
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• v.9 no.1
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• pp.1-19
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• 2001

Poly(p-phenylene pyromellitimide) and poly(4,4'-biphenylene pyromellitimide) are representatives of fully rod-like polyimides. Their structure and properties in thin films are reviewed. The polymers exhibit some excellent properties such as high molecular packing coefficient, high mechanical modulus, and low thermal expansion coefficient, and low interfacial stress, so that they are very attractive to both industry and academia. However, these polymers are very brittle and thus practically useless. Some chemical modifications to improve such drawback with a little sacrifice of the high modulus are described: i) incorporation of short side groups into the polymer backbone and ii) insertion of proper linkages into the polymer backbone.

• Journal of Sensor Science and Technology
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• v.24 no.3
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• pp.165-168
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• 2015

We demonstrated low-voltage organic thin-film transistors (OTFTs) with bilayer insulators, high-k polymer and low temperature crosslinkable polymer, on a flexible plastic substrate. Poly (vinylidene fluoridetrifluoroethylene) (P(VDF-TrFE)) and poly (2-vinylnaphthalene) are used for high-k polymer gate insulator and low temperature crosslinkable polymer insulators, respectively. The mobility of flexible OTFTs is $0.17cm^2/Vs$ at gate voltages -5 V after bending operation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.504-505
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• 2005

In this report, we demonstrate a high performance polymer thin-film transistor fabricated on a paper substrate. As a water barrier layer, parylene was coated on the paper substrate by using vacuum deposition process. Using poly (3-hexylthiophene) as an active layer, a polymer thin-film transistor with field-effect of up to 0.086 $cm^2/V{\cdot}s$ and on/off ratio of $10^4$ was achieved. The fabrication of polymer thin-film transistor built on a cheap paper substrate is expected to open a channel for future applications in flexible and disposable electronics with extremely low-cost.

• Journal of the Korean institute of surface engineering
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• v.41 no.3
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• pp.102-108
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• 2008

In this paper, the LiF and polymer thin film as passivation layer have been evaporated on green OLED devices. HDPE, polyacenaphthylene, polytetrafluoroethylene, poly(2,6-dimethyl-1,4-pheneylene oxide), poly sulfone and poly(dimer-acid-co-alkyl poly-amine) have been used as polymer materials. The optical transmittance of evaporated polymer thin film was very good as an above 90% in visible range. The morphology of polymer thin film was measured by AFM. As a result of the measurement average roughness($R_a$) value of the polysulfone was very low as 2.2 nm. The green OLED devices with a structure of ITO/HIL/HTL/EML/Buffer/Al in series of various passivation films were fabricated and analyzed. It was observed that an OLED device with LiF as first passivation film has shown the good electrical and optical property, and all kind of polymer films did not influence on the I-V-L characteristics and the life time of OLED devices. Therefore, we found that polymer layer played a key role as a buffer layer between the inorganic passivation layers to relieve the stress of the inorganic layers.

• Bulletin of the Korean Chemical Society
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• v.34 no.11
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• pp.3340-3344
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• 2013

The fabrication of polymer field-effect transistors with good electrical properties requires the minimization of molecular defects caused by low molecular weight (MW) fractions of a conjugated polymer. Here we report that the electrical properties of a narrow bandgap conjugated polymer could be dramatically improved as a result of dipping a thin film into a poor solvent. The dipping time in hexanes was controlled to efficiently eliminate the low molecular weight fractions and concomitantly improve the molecular ordering of the conjugated polymer. The correlation between the structural order and the electrical properties was used to optimize the dipping time and investigate the effects of the low MW fraction on the electrical properties of the resulting thin film.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.509-514
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• 1999

Interest in the integrated capacitors, which make it possible to reduce the size of and to obtain improved electrical performance of an electronic system, is expanding. In this study, $Ta_2$O\ulcorner thin film capacitors for MCM integrated capacitors were fabricated on a Upilex-S polymer film by DC magnetron reactive sputtering and the effects of low temperature annealing at various atmospheres and substrate surface morphology on the capacitor characteristics were discussed. The low temperature($150^{\circ}C$) annealing produced improved capacitor yield irrespective of the annealing at mosphere. But the leakage current of the $O_2$-annealed film was larger than that of any other films. This is presumably mosphere. But the leakage current of the $O_2$-annealed film was larger than that of any other films. This is presumably due to the change of the $Ta_2$O\ulcorner film surface by oxygen, which was explained by conduction mechanism study. Leakage current and breakdown field strength of the capacitors fabricated on the Upilex-S film were 7.27$\times$10\ulcornerA/$\textrm{cm}^2$ and 1.0 MV/cm respectively. These capacitor characteristics were inferior to those of the capacitors fabricated on the Si substrate but enough to be used for decoupling capacitors in multilayer package. Roughness Analysis of each layer by AFM demonstrated that the properties of the capacitors fabricated on the polymer film were affected by the surface morphology of the substrate. This substrate effect could be classified into two factors. One is the surface morphology of the polymer film and the other is the surface morphology of the metal bottom electrode determined by the deposition process. Therefore, the control of the two factors is important to obtain improved electrical of capacitors deposited on a polymer film.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.12
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• pp.759-763
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• 2016

We demonstrate the utilization of ion gel gate dielectrics for operating non-volatile transistor memory devices based on polymer semiconductor thin films. The gating process in typical electrolyte-gated polymer transistors occurs upon the penetration and escape of ionic components into the active channel layer, which dopes and dedopes the polymer film, respectively. Therefore, by controlling doping and dedoping processes, electrical current signals through the polymer film can be memorized and erased over a period of time, which constitutes the transistor-type memory devices. It was found that increasing the thickness of polymer films can enhance the memory performance of device including (i) the current signal ratio between its memorized state and erased state and (ii) the retention time of the signal.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05a
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• pp.202-205
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• 2004

We investigated the electro-optical(EO) performances of the super twisted nematic liquid crystal display(STN-LCD) on the polyimide(PI) surface using polymer film. The NLC pretilt angles generated are about $18^{\circ}$ by the rubbing alignment method on thin plastic substrates. However, the pretilt angle are at about $13^{\circ}$ lower on the glass substrate than on thin plastic substrate. Monodomain alignment of the plastic STN-LCD can be observed. A stable voltage-transmittance(V-T) curve of the plastic STN-LCD was observed on the polyimide(PI) surfaces using polymer film. Also, a faster response time for the plastic STN-LCD on the polyimide(PI) surfaces using polymer film can be achieved.

• Journal of the Korean Ceramic Society
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• v.48 no.6
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• pp.499-503
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• 2011

Recently, variety of organic and inorganic hybrid materials have recently investigated as alternative routes to SiOC, $SiO_2$ thin film formation at low temperatures for applications in electronic ceramics. Specially, silicon based polymers, such as polycarbosilane, polysilane and polysilazane derivatives have been studied for use in electronic ceramics and have been applied as dielectric or insulating materials. In this study, Polycarbosilane(PCS), which Si-$CH_2$-Si bonds build up the backbone of the polymer, has been investigated as low-k materials using a solution process. After heat treatment at 350$^{\circ}C$ under $N_2$ atmosphere, chemical composition and dielectric constant of the thin film were $SiO_{0.27}C_{1.94}$ and 1.2, respectively. Mechanical property measured using nanoindentor shows 1.37 GPa.