• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.253-257
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• 2003

The low temperature flip chip technique is applied to the package of the temperature-sensitive devices for LCD systems and image sensors since the high temperature process degrades the polymer materials in their devices. We will introduce the various low temperature flip chip bonding techniques; a conventional flip chip technique using eutectic Bi-Sn (mp: $138^{\circ}C$) or eutectic In-Ag (mp: $141^{\circ}C$) solders, a direct bump-to-bump bonding technique using solder bumps, and a low temperature bonding technique using low temperature solder pads.

• Nuclear Engineering and Technology
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• v.53 no.3
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• pp.833-841
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• 2021

During the postulated severe accident of nuclear reactor, eutectic reaction leads to low-temperature melting of fuel cladding and early failure of core structure. In order to model eutectic melting with the moving particle semi-implicit (MPS) method, the eutectic reaction model is developed to simulate the eutectic reaction phenomenon. The coupling of mass diffusion and phase diagram is applied to calculate the eutectic reaction with the uniform temperature. A heat transfer formula is proposed based on the phase diagram to handle the heat release or absorption during the process of eutectic reaction, and it can combine with mass diffusion and phase diagram to describe the eutectic reaction with temperature variation. The heat transfer formula is verified by the one-dimensional melting simulations and the predicted interface position agrees well with the theoretical solution. In order to verify the eutectic reaction models, the eutectic reaction of uranium and iron in two semi-infinite domains is simulated, and the profile of solid thickness decrease over time follows the parabolic law. The modified MPS method is applied to calculate Transient Reactor Test Facility (TREAT) experiment, the penetration rate in the simulations are agreeable with the experiment results. In addition, a hypothetical case based on the TREAT experiment is also conducted to validate the eutectic reaction with temperature variation, the results present continuity with the simulations of TREAT experiment. Thus the improved method is proved to be capable of simulating the eutectic reaction in the severe accident.

• Journal of the Korean Ceramic Society
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• v.56 no.4
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• pp.331-339
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• 2019

While high-temperature ceramic composites consisting of carbides, borides, and nitrides, the so-called ultra-high-temperature ceramics (UHTCs), have been commonly produced through solid-state sintering, melt-solidification is an alternative method for their manufacture. As many UHTCs are binary or ternary eutectic systems, they can be melted and solidified at a relatively low temperature via a eutectic reaction. The microstructure of the eutectic composites is typically rod-like or lamellar, as determined by the volume fraction of the second phase. Directional solidification can help fabricate more sophisticated UHTCs with highly aligned textures. This review describes the fabrication of UHTCs through the eutectic reaction and explains their mechanical properties. The use of melt-solidification has been limited to small specimens; however, the recently developed laser technology can melt large-sized UHTCs, suggesting their potential for practical applications. An example of laser melt-solidification of a eutectic ceramic composite is demonstrated.

• Journal of Advanced Marine Engineering and Technology
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• v.23 no.3
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• pp.338-345
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• 1999

The objective of this study is to developed the refrigeration vehicle system installed eutectic olu-tion plates which consists of copper tubes carrying the refrigerant between two aluminum plates and the space between the plates filled with eutectic solution. The numerical analysis for the loca-tion of plates to get the uniform low temperature distribution in storage space was carried out and the result showed that the top left-side and right-side walls were the proper places to install plates. For three different concentrations of ethylene glycol solution the temperature distribution of inside space were measured during the day time of summer and the 21% solution was found to be properto sustain the temperature of $5-10^{\circ}C$ for milk transportation. The result showed that the refrigeration truck installed eutectic plates was very efficient to keep the milk fresh during vehicle transportation.

• Korean Journal of Materials Research
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• v.23 no.10
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• pp.568-573
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• 2013

The deformation properties of a TiC-Mo eutectic composite were investigated in a compression test at temperatures ranging from room temperature to 2053 K and at strain rates ranging from $3.9{\times}10^{-5}s^{-1}$ to $4.9{\times}10^{-3}s^{-1}$. It was found that this material shows excellent high-temperature strength as well as appreciable room-temperature toughness, suggesting that the material is a good candidate for high-temperature application as a structure material. At a low-temperature, high strength is observed. The deformation behavior is different among the three temperature ranges tested here, i.e., low, intermediate and high. At an intermediate temperature, no yield drop occurs, and from the beginning the work hardening level is high. At a high temperature, a yield drop occurs again, after which deformation proceeds with nearly constant stress. The temperature- and yield-stress-dependence of the strain is the strongest in this case among the three temperature ranges. The observed high-temperature deformation behavior suggests that the excellent high-temperature strength is due to the constraining of the deformation in the Mo phase by the thin TiC components, which is considerably stronger than bulk TiC. It is also concluded that the appreciable room-temperature toughness is ascribed to the frequent branching of crack paths as well as to the plastic deformation of the Mo phase.

• Current Photovoltaic Research
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• v.1 no.1
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• pp.63-68
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• 2013

We investigated the effects of Au eutectic reaction on Si thin film growth by hot wire chemical vapor deposition. Small SiC and Si nano-particles fabricated through a wet etching process were coated and biased at 50 V on micro-textured Si p-n junction solar cells. Au thin film of 10 nm and a Si thin film of 100 nm were then deposited by an electron beam evaporator and hot wire chemical vapor deposition, respectively. The Si and SiC nano-particles and the Au thin film were structurally embedded in Si thin films. However, the Au thin film grew and eventually protruded from the Si thin film in the form of Au silicide nano-balls. This is attributed to the low eutectic bonding temperature ($363^{\circ}C$) of Au with Si, and the process was performed with a substrate that was pre-heated at a temperature of $450^{\circ}C$ during HWCVD. The nano-balls and structures showed various formations depending on the deposited metals and Si surface. Furthermore, the samples of Au nano-balls showed low reflectance due to surface plasmon and quantum confinement effects in a spectra range of short wavelength spectra range.

• Journal of Korea Foundry Society
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• v.10 no.5
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• pp.399-407
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• 1990

The effect of thermal cycling and isothermal exposure on the high temperature microstructural stability of unidirectionally solidified $Al-CuAl_2$ eutectic composite has been studied. A coarsening procedures of lamellar eutectic structures were initiated at growth fault region because of diffusion through low angle boundary at this region. It was considered that thermally induced residual stresses produced by thermal cycling were high enough to increase the dislocation density in Al-rich matrix phase. However, it was also considered that dislocations generated by these high thermal stresses were annihilated at high temperature by stress relaxation. Consequently, the thermal cycling up to 1440 cycles between 20 and $520^{\circ}C$ did not affect the microstructural stability.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.2
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• pp.186-190
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• 2023

We studied the various characteristics of Sn-In (wt%) Pb-free solders for photovoltaic ribbon application. The solders near the eutectic composition of Sn₄₈In₅₂ (wt%) existed in InSn₄ and In₃Sn alloy phases, and in In crystal phase, but not in Sn crystal phase. In addition, the InSn₄ phase (γ-alloy) existed separately from the In₃Sn (β-alloy) and the In phase confirmed by an SEM-EDS-mapping. The melting temperature of the eutectic solder of Sn₄₈In₅₂ (wt%) was 119.2℃, and when the Sn content decreased in reference to the eutectic composition, it slightly increased to 121.4℃, but when the Sn content increased, it remained almost constant at 119.1℃. The peel strength of the ribbon plated with the Sn₄₂In₅₈ (wt%) solder was 38.7 N/mm², and it tended to increase when the Sn content increased. The peel strength of the eutectic Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₅₁In₄₉ (wt%) solder was 61.6 N/mm² that was the highest.

• Journal of the Korean Society of Safety
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• v.32 no.1
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• pp.9-14
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• 2017

Diffusion bonding is a technique that has the ability to join materials with minimum change in joint micro-structure and deformation of the component. The quality of the joints produced was examined by metallurgical characterization and the joint micro-structure developed across the diffusion bonding was related to changes in mechanical properties as a function of the bonding time. An increase in bonding time also resulted in an increase in the micro-hardness of the joint interface from 55 VHN to 180 VHN, The increase in hardness was attributed to the formation of intermetallic compounds which increased in concentration as bonding time increased.

• Journal of Institute of Convergence Technology
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• v.5 no.2
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• pp.43-48
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• 2015

Deep eutectic solvents (DESs) are now broadly understood as a new kind of ionic liquid (IL) because they exhibit many characteristics and properties similar with ILs. The DESs made of quaternary ammonium salt blended with one of hydrogen bonding donor (HBD) compounds behave as ILs even at very low temperature. In this study, properties such as density, viscosity, surface tension, conductivity, and electrochemical behavior of DESs were reported and their applications were reviewed. Study on DESs has been drawn attention on application in metal finishing, but these solvents can be used in a variety of synthesis, and their potentials have been demonstrated in various areas. DESs are expected to offer applicability by extending the types of salts and hydrogen bond donor mixtures.