• Journal of the Korean Ceramic Society
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• v.43 no.6 s.289
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• pp.376-382
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• 2006

In the $Al(OH)_3-SiO_2-AlF_3$ system, leaf-shaped fluorotopaz was first formed at $800^{\circ}C$ and mullite whisker was formed at $1,100^{\circ}C$. The mass transportation of Al and Si as gas phase, the fast reaction and growth, and the absence of liquid phase existence in mullite whisker showed that the formation and growth of mullite was from the solid-vapor reaction.

• Corrosion Science and Technology
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• v.11 no.1
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• pp.1-8
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• 2012

The development of martensitic grades which can be processed in continuous galvanizing lines requires the reduction of the oxides formed on the steel during the hot dip process. This reduction mechanism was investigated in detail by means of High Resolution Transmission Electron Microscopy (HR-TEM) of cross-sectional samples. Annealing of a martensitic steel in a 10% $H_2+N_2$ atmosphere with the dew point of $-35^{\circ}C$ resulted in the formation of a thin $_{C-X}MnO.SiO_{2}$ (x>1) oxide film and amorphous $_{a-X}MnO.SiO_{2}$ oxide particles on the surface. During the hot dip galvanizing in Zn-0.13%Al, the thin $_{C-X}MnO.SiO_{2}$ (x>1) oxide film was reduced by the Al. The $_{a-X}MnO.SiO_{2}$ (x<0.9) and $a-SiO_{2}$ oxides however remained embedded in the Zn coating close to the steel/coating interface. No $Fe_{2}Al_{5-X}Zn_{X}$ inhibition layer formation was observed. During hot dip galvanizing in Zn-0.20%Al, the $_{C-X}MnO.SiO_{2}$ (x>1) oxide film was also reduced and the amorphous $_{a-X}MnO.SiO_{2}$ and $a-SiO_{2}$ particles were embedded in the $Fe_{2}Al_{5-X}Zn_{X}$ inhibition layer formed at the steel/coating interface during hot dipping. The results clearly show that Al in the liquid Zn bath can reduce the crystalline $_{C-X}MnO.SiO_{2}$ (x>1) oxides but not the amorphous $_{a-X}MnO.SiO_{2}$ (x<0.9) and $a-SiO_{2}$ oxides. These oxides remain embedded in the Zn layer or in the inhibition layer, making it possible to apply a Zn or Zn-alloy coating on martensitic steel by hot dipping. The hot dipping process was also found to deteriorate the mechanical properties, independently of the Zn bath composition.

• Journal of Powder Materials
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• v.26 no.6
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• pp.455-462
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• 2019

ZrB₂ ceramic and ZrB₂ ceramic composites with the addition of SiC, WC, and SiC/WC are successfully synthesized by a spark plasma sintering method. During high-temperature oxidation, SiC additive form a SiO₂ amorphous outer scale layer and SiC-deplete ZrO₂ scale layer, which decrease the oxidation rate. WC addition forms WO₃ during the oxidation process to result in a ZrO₂/WO₃ liquid sintering layer, which is known to improve the anti-oxidation effect. The addition of SiC and WC to ZrB₂ reduces the oxygen effective diffusivity by one-fifth of that of ZrB₂. The addition of both SiC and WC shows the formation of a SiO₂ outer dense glass layer and ZrO₂/WO₃ layer so that the anti-oxidation effect is improved three times as much as that of ZrB₂. Therefore, SiC- and WC-added ZrB₂ has a lower two-order oxygen effective diffusivity than ZrB₂; it improves the anti-oxidation performance 3 times as much as that of ZrB₂.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.265-265
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• 2007

In the present work, we have studied low temperature sintering and microwave dielectric properties of $ZnAl_2O_4$-zinc borosilicate (ZBS, 65ZnO-$25B_2O_3-10SiO_2$) glass composites. The focus of this paper was on the improvement of sinterability, low dielectric constant, and on the theoretical proof regarding of microwave dielectric properties in $ZnAl_2O_4$-ZBS glass composites, respectively. The $ZnAl_2O_4$ with 60 vo1% ZBS glass ensured successful sintering below $900^{\circ}C$. It is considered that the non-reactive liquid phase sintering (NPLS) occurred. In addition, $ZnAl_2O_4$ was observed in the $ZnAl_2O_4$-(x)ZBS composites, indicating that there were no reactions between $ZnAl_2O_4$ and ZBS glass. $ZnB_2O_4\;and\;Zn_2SiO_4$ with the willemite structure as the secondary phase was observed in the all $ZnAl_2O_4$-(x)ZBScomposites. In terms of dielectric properties, the application of the $ZnAl_2O_4$-(x)ZBS composites sintered at $900^{\circ}C$ to LTCC substrate were shown to be appropriate; $ZnAl_2O_4$-60ZBS (${\varepsilon}_r$= 6.7, $Q{\times}f$ value= 13,000 GHz, ${\tau}_f$= -30 ppm/$^{\circ}C$). Also, in this work was possible theoretical proof regarding of microwave dielectric properties in $ZnAl_2O_4$-(x)ZBS composites.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.291-294
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• 1999

The effect of AI$_2$O$_3$+Y$_2$O$_3$additives on fracture toughness of $\beta$-SiC-ZrB$_2$composites by hot-pressed sintering were Investigated. The $\beta$-SiC-ZrB$_2$ ceramic composites were hot-presse sintered and annealed by adding 1, 2, 3wt% AI$_2$O$_3$+Y$_2$O$_3$(6:4wt%) powder as a liquid forming additives at 195$0^{\circ}C$ for 4h. In this microstructures, no reactions were observed between $\beta$-SiC and ZrB$_2$, and the relative density Is over 90.79% of the theoretical density and the porosity decreased with increasing AI$_2$O$_3$+Y$_2$O$_3$ contents. Owing to crack deflection and crack bridging of fracture toughness mechanism, the fracture toughness showed the highest of 5.5328MPa . m$^{1}$2/ for composites added with 2wt% AI$_2$O$_3$+Y$_2$O$_3$ additives at room temperature. But the standard deviation of fracture toughness of specimens decreased with increasing AI$_2$O$_3$+Y$_2$O$_3$ contents and showed the highest of 0.8624 for composite tilth 1wt%, AI$_2$O$_3$+Y$_2$O$_3$additives.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.128-128
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• 2011

Polysilicon thin-film transistors (poly-Si TFTs)는 능동행렬 액정 표시 소자(AMLCD : Active Matrix Liquid Crystal Display)와 DRAM과 같은 메모리 분야에 폭넓게 적용이 가능하기 때문에 많은 연구가 진행되고 있다. 최근 poly-Si TFTs의 우수한 특성으로 인하여 주변 driving circuits에 직접화가 가능하게 되었다. 또한 디스플레이 LCD 패널에 controller와 메모리와 같은 다 기능의 장치을 직접화 하여 비용의 절감과 소자의 소형화가 가능한 SOP (System on panels)에 연구 또한 진행 되고 있다. 이미 잘 알려진 바와 같이 비휘발성 메모리는 낮은 소비전력과 비휘발성이라는 특성 때문에 이동식 디바이스에 데이터 저장 장치로 많이 사용되고 있다. 하지만 플로팅 타입의 비휘발성 메모리는 제작공정의 문제로 인하여 SOP의 적용에 어려움을 가지고 있다. SONOS 타입의 메모리는 빠른 쓰기/지우기 효율과 긴 데이터 유지 특성을 가지고 있으나 소자의 스케일링 따른 누설전류의 증가와 10년의 데이터 보존 특성을 만족 시킬 수 가 없는 문제가 발생한다. 본 연구에서는 SOP 적용을 위하여 ELA 방법을 통하여 결정화한 poly-Si TFT memory를 SiO2/Si3N4/SiO2 Tunnel barrier와 High-k HfO2과 Al2O3을 Trapping layer와 Blocking layer로 적용, 비휘발성 메모리을 제작하여 전기적 특성을 알아보았다.

• The Journal of Natural Sciences
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• v.8 no.1
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• pp.53-59
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• 1995

Effects of sintering additives and sintering temperatures on the sintering behavior and mechanical properties of SiC whisker reinforced alumina composites have been investigated in this study. Dense (>95% TD) composites were obtained by using 2 wt% $Y_2O_3$ as liquid phase sintering additive. But only porous composite could be obtained when the sintering additives were MgO and $TiO_2$, which were known as the sintering additives for solid state sintering of alumina. Bending strength and fracture toughness were enhanced by reinforcement of SiC whisker. It is belived from the microstructure investigation that the enhanced by strength and toughness could be attribute to the reinforcing and grain growth inhibition effects of SiC whisker. After HIP treatment, fully dense composites were obtained and further enhanced mechanical properties achieved.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.1
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• pp.19-24
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• 2007

The effects of $B_2O_3-SiO_2-R(R;CaO,\;BaO,\;ZnO,\;Bi_2O_3)$ borosilicate glass system on the sintering behavior and microwave dielectric properties of ceramic/glass composites were investigated as functions of modifier, glass addition ($30{\sim}50\;vol%$) and sintering temperature ($500{\sim}900^{\circ}C$ for 2 hrs). The addition of 50 and 45 vol% glass ensured successful sintering below $900^{\circ}C$. Sintering characteristics of the composites were well described in terms of modifier. Borosilicate glass enhanced the reaction with $Al_{2}O_{3}$ to form pores, second phases and liquid phases, which was responsible to component of modifier. Dielectric constant (${\varepsilon}_{r},\;Q{\times}f_{o}$) and temperature coefficient of resonant frequency (${\tau}_{f}$) of the composite with 50 and 45 vol% glass contents($B_{2}O_{3}:SiO_{2}:R=25:10:65$) demonstrated A-CaBS(7.8, 2,560 GHz, -81ppm/$^{\circ}C$), A-BaBs(5.8, 3.130 GHz, -64 ppm/$^{\circ}C$), A-ZnBS(5.7, 17,800 GHz, -21 ppm/$^{\circ}C$), A-BiBs(45 vol% glass in total)(8.3, 2,700 GHz, -45 ppm/$^{\circ}C$) which is applicable to substrate requiring an low dielectric properties.

• Proceedings of the KIEE Conference
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• 2007.11a
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• pp.124-125
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• 2007

The composites were fabricated $\beta$-SiC and $TiB_2$ powders with the liquid forming additives of 8, 12, 16[wt%] $Al_2O_3+Y_2O_3$ as a sintering aid by pressureless annealing at $1,650[^{\circ}C]$ for 4 hours. Reactions between SiC and transition metal $TiB_2$ were not observed in the microstructure and the phase analysis of the pressureless annealed SiC-$TiB_2$ electroconductive ceramic composites. The relative density, the flexural strength, the Young's modulus and the Vicker's hardness showed the highest value of 82.29[%], 189.5[MPa], 54.60 [GPa] and 2.84[GPa] for SiC-$TiB_2$ composites added with 16[wt%] $Al_2O_3+Y_2O_3$ additives at room temperature. The relative density of SiC-$TiB_2$ composites was lowered due to gaseous products of the result of reaction between SiC and $Al_2O_3+Y_2O_3$. The electrical resistivity showed the lowest value of 0.012[${\Omega}{\cdot}cm$] for 16[wt%] at 25[$^{\circ}C$]. The electrical resistivity was all negative temperature coefficient resistance (NTCR) in the temperature ranges from 25[$^{\circ}C$] to 700[$^{\circ}C$].

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.751-757
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• 2003

Rapid densification of a SiC-30 wt% TiC powder with additive 10 wt% A1$_2$O$_3$-Y$_2$O$_3$-CaO was conducted by Spark Plasma Sintering(SPS). The fully-densified materials can be obtain through the SPS process with very fast heating rate and short holding time. In the present work, the heating rate and applied pressure were kept to be $100^{\circ}C$/min and 40 MPa, while sintering temperature varied from $1600^{\circ}C$ to $1800^{\circ}C$ for 10 min. The full densification of SiC-30 wt% TiC composites with the addition of $Al_2$O$_3$, $Y_2$O$_3$ and CaO was achieved at the temperature above $1700^{\circ}C$ by spark plasma sintering. The XRD found that 3C-SiC and TiC were maintained the entire SPS process temperature, without phase transformation of SiC and formation of YAG phase to $1800^{\circ}C$. The microstructures of the rapidly densified SiC-30 wt% TiC composites consisted of smaller equiaxed SiC grains and larger TiC grains. The biaxial strength of 635.2 MPa and fracture toughness of 6.12 MPaㆍ$m^{1/2}$ were found for the specimen prepared at $1750^{\circ}C$.