• Title/Summary/Keyword: line-width

Search Result 1,552, Processing Time 0.038 seconds

VCO Oscillation Characteristics by Varying the Length of the MSL of LC Resonator (LC공진기의 MSL길이에 따른 VCO 발진 특성)

  • 이동희;정진휘
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.15 no.5
    • /
    • pp.412-418
    • /
    • 2002
  • In this paper, the authors present the simulation results and the experimental considerations on the effects of the effects of the VCO oscillation characteristics caused by varying the length of the MSL and the composition capacitance of LC resonation circuity. Simulation was accomplished by nonlinear RF circuit simulator for designing and analyzing the RF characteristis of VCO. The samples with 3 different MSL lengths of which the length is 140mil, 280mil and 560mil respectively were fabricated by screen printing process. The oscillation frequency of each sample(VCO) was tuned to UHF band (750MHz~900MHz) by varying the capacitance of LC resonator circuit. The experimental results showed that the values of phase noise were -82, -93, -97[dBc/Hz] at 50[kHz] offset frequency, the pushing figures were 114, 94, 318[kHz] at applied voltage of $3\pm0.15$[V] and the harmonics were -21, -16, -13[dBc] for MSL lengths of 140mil 280mil, 560mil respectively. The frequency and output variation width were 779~898[MHz], -36~-33[dBm] for MSL with 140mil length; 818~836[MHz], -27.19~27.06[dBm] for 280mil; 751.54~751.198[MHz], -33.44~-33.31[dBm] for 560mil.

THIN FILM TECHNOLOGIES RELATED TO THE HIGH T$_{c}$ SUPERCONDUCTORS

  • Ri, Eui-Jae
    • Journal of Surface Science and Engineering
    • /
    • v.29 no.5
    • /
    • pp.415-423
    • /
    • 1996
  • Thin film technologies for fabricating SQUIDs involve etching and deposition procedures with the proper substrate materials and $YBa_2Cu_3O_{7-d}$ (YBCO) as the high $T_c$ superconductor. YBCO were prepared on various substrates of MgO, $SrTiO_3$, and $LaAlO_3$ by using off-axis magnetron sputtering methods and annealing in-situ. The parameters of film fabrication processes had been optimized to yield good quality films in terms of the critical temperature $T_c$ and the critical current density $J_c$. The optimized processes yielded $T_C$>90K along with $J_c$>$10_6A$$extrm{cm}^2$ at 77K and>$2\times10_7A/Cm^2$ at 5K. We fabricated step-edge type dc-SQUIDs and directly coupled magnetometers, producing step edges on MgO(100) substrates by etching with Ar-ion beam, depositing YBCO material on them, then patterning them by using ion-milling technique. Circuitizing washer-shape SQUIDs to possess a pair of step-edge junctions of 2-5$\mu$ line width with a high angle>$50^{\circ}C$ , we examined their I-V characteristics thoroughly and Shapiro steps clearly as we irradiate microwaves of 8-20 GHz frequency.

  • PDF

One-Cycle Control Strategy for Dual-Converter Three-Phase PWM Rectifier under Unbalanced Grid Voltage Conditions

  • Xu, You;Zhang, Qingjie;Deng, Kai
    • Journal of Power Electronics
    • /
    • v.15 no.1
    • /
    • pp.268-277
    • /
    • 2015
  • In this paper, a dual-converter three-phase pulse width modulation (PWM) rectifier based on unbalanced one-cycle control (OCC) strategy is proposed. The proposed rectifier is used to eliminate the second harmonic waves of DC voltage and distortion of line currents under unbalanced input grid voltage conditions. The dual-converter PWM rectifier employs two converters, which are called positive-sequence converter and negative-sequence converter. The unbalanced OCC system compensates feedback currents of positive-sequence converter via grid negative-sequence voltages, as well as compensates feedback currents of negative-sequence converter via grid positive-sequence voltages. The AC currents of positive- and negative-sequence converter are controlled to be symmetrical. Thus, the workload of every switching device of converter is balanced. Only one conventional PI controller is adopted to achieve invariant power control. Then, the parameter tuning is simplified, and the extraction for positive- and negative-sequence currents is not needed anymore. The effectiveness and the viability of the control strategy are demonstrated through detailed experimental verification.

Microprocess of silicon using focused Ar$^+$ llaser and estimates (집속된 아르곤 이온 레이저에 의한 실리콘의 미세가공 및 평가)

  • Cheong, Jae-Hoon;Lee, Cheon;Hwang, Kyoung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1997.11a
    • /
    • pp.473-476
    • /
    • 1997
  • Focused Ar ion laser beam can be utilized to fabricate microstructures on silicon substrate as well as other materials(e.g. such as ceramic). The laser using in this study is an argon ion laser with maximum power of 6 W, wavelength of 514 nm. This laser beam is focused by objectives with a high numerical aperture, a long working distance. We have achieved line width about 1 ${\mu}{\textrm}{m}$ with high scan speed. The resolution for Si machining is determined by the selectivity of the chemical reaction rather than the laser spot size. In this study, we have obtained the maximum etch rate of 434.7 ${\mu}{\textrm}{m}$/sec with high aspect ratio. The characteristics of etched groove was investigated by scanning electron microscope(SEM) and auger electron spectroscopy(AES). It is assumed that the technique using arson ion laser is applicab1e to fabricate microstructures.

  • PDF

Characteristics of Gold and Silver Bimetallic Surface Plasmon Resonance Chip in Intensity Measurement Mode and Calculation of Refractive Index using Critical Angle (반사광 측정 모드에서 금과 은의 쌍금속 표면 플라즈몬 공명 칩의 특성과 임계각을 이용한 굴절률 계산)

  • Kim, Hyungjin;Lee, Sung-Youp;Kim, Hong Tak;Yang, Ki-Won;Sohn, Young-Soo
    • Journal of Sensor Science and Technology
    • /
    • v.24 no.6
    • /
    • pp.423-428
    • /
    • 2015
  • A bimetallic chip made of gold and silver was investigated in intensity interrogation mode to confirm enhancement of the SPR sensor resolution. Both reflectance curves of the bimetallic chip and the conventional gold chip was acquired and compared. The line width of the reflectance curve of the bimetallic chip was narrower than that of the conventional Au chip, resulting in steeper tangential slope. The reflectance was monitored at the angle related to the steepest tangential slope. The change in reflectance of the bimetallic chip was larger than that of the Au chip. The critical angle was analyzed by differentiating the reflectance with respect to incident angle twice. Acquiring the critical angle regarding to the sample informs the refractive index of the sample. Using various concentration of Bovine Serum Albumin, we confirmed that refractive index was linearly related to variation of reflectance of the bimetallic chip.

A Study of Growth and Properties of GaN films on Si(111) by MOCVD (Si(111) 기판을 이용한 crack-free GaN 박막 성장과 PL특성)

  • Kim, Deok-Kyu;Jin, Hu-Jie;Song, Min-Jong;Park, Choon-Bae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2005.07a
    • /
    • pp.187-188
    • /
    • 2005
  • The characteristics of GaN epitaxial layers grown on silicon (111) substrates by metalorganic vapor phase epitaxy have been investigated. The only control of AlN thickness was found to decrease the stress sufficiently for avoiding crack formation in an overgrown thick ($2.6{\mu}m$) GaN layer. X-ray diffraction and photoluminescence measurements are used to determine the effect of AlN thickness on the strain in the subsequent GaN layers. Strong band edge photoluminescence of GaN on Si(111) was observed with a full width at half maximum of the bound exciton line as low as 17meV at 13K.

  • PDF

Front Surface Grid Design for High Efficiency Solar Cells

  • Gangopadhyay Utpal;Kim, Kyung-Hae;Basu Prabir Kanti;Dhungel Suresh Kumar;Jung, Sung-Wook;Yia, Jun-Sin
    • Transactions on Electrical and Electronic Materials
    • /
    • v.6 no.2
    • /
    • pp.78-84
    • /
    • 2005
  • Standard crystalline solar cells are generally fabricated with the front grid pattern of silver paste contact. We have reported a detailed theoretical analysis of the proposed segmented cross grid line pattern in this paper. This work was carried out for the optimization of spacing and width of grid finger, main busbar and sub-busbar. The overall electrical and optical losses due to front contact were brought down to $10\%$ or even less as compared to the usual loss of $15\%$ or more in the conventional screen printed silver paste technology by choosing proper grid pattern and optimizing the grid parameters. The total normalized power loss for segmented mesh grid with plated metal contact was also observed and the total power loss could be brought down to $10.04\%$ unlike $11.57\%$ in the case of continuous grid and plated contact. This paper is able to outline the limitations of conventional screen printed contact.

Investigation into the fabrication of scaffolds using bio-compatible polymer (생체 적합성 고분자 재료를 이용한 다공성 지지체 제작에 관한 연구)

  • Park S.H.;Kim H.C.;Yang D.Y.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2005.10a
    • /
    • pp.231-235
    • /
    • 2005
  • Most tissue engineering strategies for creating functional replacement tissues or organs rely on the application of temporary three-dimensional scaffolds to guide the proliferation and spread of seeded cells in vitro and in vivo. Scaffolds should be satisfied following requirements; macrostructure to promote cell proliferation, pore interconnectivity, pore size ranging from 200 to $400{\mu}m$, surface chemistry and mechanical properties. Rapid prototyping techniques have often been used as an useful process that fabricates scaffolds with complex structures. In this study, a new process to fabricate a three-dimensional scaffolds using bio-compatible polymer has been developed. It employs a highly accurate three-dimensional positioning system with pressure-controlled syringe to deposit biopolymer structures. The pressure-activated microsyringe is equipped with fine-bore nozzles of various inner-diameters. In order to examine relationships between line width and process parameters such as nozzle height, applied pressure, and speed of needle, experiments were carried out. Based on the experimental results, three-dimensional scaffold was fabricated using the apparatus. It shows the validity of the proposed process.

  • PDF

A Study on Wearing Behavior & Design Preference for Saenghwal Hanbok - Focusing on Daegu - (생활한복(生活韓服)의 착용실태(着用實態) 및 디자인 선호도(選好度)에 관(關)한 연구(硏究) - 대구(大邱) 지역(地域)을 중심(中心)으로 -)

  • Kim, Young-Mi;Boo, Ae-Jin;Hong, Jung-Min
    • Journal of Fashion Business
    • /
    • v.7 no.5
    • /
    • pp.54-65
    • /
    • 2003
  • To accomplish the above goal of this study, I have taken the statistics about wearing behavior and design preference for Saenghwal Hanbok. This is surveyed by 354 women having jobs 20-50years old-in Daegu. The result of the study is summarized as follows. People prefer to put on Saenghwal Hanbok same as the Korea Traditional Dress in the traditional holidays and the active style that they can dress as casual clothes having the Korea Traditional Dress's characteristics as well. Form a viewpoint of appearance, people prefer Jugori have a bit spare width, the length comes near to the waist line, the type of Korean Traditional Dress's sleeve, and the round type that is linked body and sleeve in waist section and length is between knee and the calf of leg.

Fabrication of DLC Micro Pattern Roll Mold by Photolithography Process (포토 리소그래피 공정을 이용한 DLC 마이크로 패턴 원통 금형 제작)

  • Ha, T.G.;Kim, J.W.;Lee, T.D.;Yoon, S.J.;Kim, T.G.
    • Journal of the Korean Society for Heat Treatment
    • /
    • v.31 no.2
    • /
    • pp.63-67
    • /
    • 2018
  • Recent mold industry uses many roll-to-roll processes that can produce high production speed and precision machining and automation process. In the circular cylinder mold, however, patterns of less than $10{\mu}m$ are difficult to manufacture and maintain. In this study, we fabricated a circular cylindrical mold with a DLC thin film which have high hardness, low coefficient of friction and high releasability by using lithography and lift-off process. The height, line width, and pitch of the fabricated DLC macro pattern are $3.1{\mu}m$, $9.1{\mu}m$ and $20.2{\mu}m$, respectively. The pattern size is finer than the current applied to the aluminum cylinder type, and this shows the possibility of practical use of DLC micro pattern roll mold.