• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1470-1471
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• 2008

We present a front-side micromachined thermopile with high sensitivity in the 3-5${\mu}m$ window, and discuss its application to a novel non-dispersive infrared (NDIR) $CO_2$ gas sensor with a light source emitting collimated light. The micromachined thermopile shows a measured sensitivity of 30 mV/W and a $D^*$ of $0.3{\times}10^8cm^{\surd}Hz/W$. Using this newly fabricated thermopile, we also have successfully developed a small, sensitive NDIR $CO_2$ detector module for accurate air quality monitoring systems in energy-saving building and automotive applications. The novel sample cavity comprising specular reflectors around the light bulb is configured to uniformly emit collimated light into the entrance aperture of the cavity in order to enhance the sensitivity of NDIR $CO_2$ detector.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.6
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• pp.510-514
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• 2005

We have investigated the excitation-light source dependence of photo-catalytic efficiency for the benzene removal. The photo-catalytic module for the benzene removal is fabricated by a combination of GaN-based ultraviolet light-emitting diode (UV GaN-LED) and $TiO_2$ thin film coated on an aluminum plate. The benzene reduction rates of 365 nm and 375 nm modules at 60 mA junction current are approximately $8.95\;\%/Hr$ and $9.2\;\%/Hr$, respectively, which indicates that 365 nm GaN-LED is more effective than 375 nm GaN-LED. The benzene reduction efficiency is also noticeably dependent on the excitation wavelength and excitation-light power, as well as it is increased with the shorter wavelength and higher excitation power. This result exhibits that UV GaN-LED is useful to remove the volatile organic compounds (VOCs) existing in the environment.

• Journal of IKEEE
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• v.18 no.3
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• pp.335-340
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• 2014

Recently, LED (Light Emitting Diode) becomes to be useful to apply for the lightening sources in electric systems and the lightening equipment since the power is less consumed with high efficiency, and the size and the weight of LED are small and light, respectively. The LED is controlled with constant current and SMPS (Switching Mode Power Supply). It is necessary for the LED manufacturer to secure the fundamental technology of designing LED chip, and to study the methodology to improve the power factor (PF) and to design the operational circuit for the development of LED to reduce the power loss in the application of LED lightening. The direct AC (Alternating Current) LED driving circuit, HV9910, is widely used in the industry field. In this paper, it is to evaluate the improved methodology for the power factor and efficiency through simulations when PFC (Power Factor Correction) and Noise Filter are added to HV9910.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.2
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• pp.1-7
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• 2015

The Light Emitting Diode(LED) lighting control system proposed in this thesis is made up of a sensor module, a microcontroller, Bluetooth wireless communication, LED Driver, and LED downlight. The sensor module, comprised of an infrared sensor, an illumination sensor, and a temperature sensor, was designed to one Printed Circuit board(PCB). The system is able to identify the environment information collected by the sensor, and make it possible to control lighting automatically and manually through sensors. In addition, depending on users' conditions, a color temperature can be controlled. CS-1000, a spectroradiometer, was employed to measure the changing values of a color temperature in 8 steps. According to a test, it was found that it was possible to change a color temperature from 3187K of Warm White LED to 5598K of Cool White LED. The Bluetooth based wireless communication technique makes it possible to control more lighting devices than other wireless communication techniques does.

• The Journal of the Korea institute of electronic communication sciences
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• v.14 no.1
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• pp.87-96
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• 2019

Flexible organic light-emitting diode (OLED) displays with organic thin-film transistors (OTFTs) backplanes have been studied. A gate driver is required to drive the OLED display. The gate driver is integrated into the panel to reduce the manufacturing cost of the display panel and to simplify the module structure using fabrication methods based on low-temperature, low-cost, and large-area printing processes. In this paper, pseudo complementary metal oxide semiconductor (CMOS) logic gates are implemented using OTFTs for the gate driver integrated in the flexible OLED display. The pseudo CMOS inverter and NAND gates are designed and fabricated on a flexible plastic substrate using inkjet-printed OTFTs and the same process as the display. Moreover, the operation of the logic gates is confirmed by measurement. The measurement results show that the pseudo CMOS inverter can operate at input signal frequencies up to 1 kHz, indicating the possibility of the gate driver being integrated in the flexible OLED display.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.152-158
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• 2013

The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.1
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• pp.53-57
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• 2012

In this paper, by designing 20 W class driving circuit for driving high-power LED (Light Emitting Diode), we are going to comparatively carry out the analysis of characteristics for power circuit according to each design method. In this case, 200 V 60 Hz was performed as input data. The electrical characteristics such as voltage, current and ripple are checked for constant current circuit and constant voltage circuit in the LED module. In addition, as the ripple has an influence on illumination of LED light, low temperature working (-20 [$^{\circ}C$]) and high temperature working(80 [$^{\circ}C$]) are measured to make sure the ripple characteristics in accordance with temperature. In low temperature operation -20 [$^{\circ}C$] measurements, both constant current circuit and constant-voltage circuit were less impacted on input fluctuation, whereas in the high temperature operation 80 [$^{\circ}C$], current voltage in constant voltage circuit was surge after 430 [hour]. Voltage current ripple of constant current circuit was much less than constant voltage circuit, therefore we can show that constant current circuit is more stable.

• Korean Journal of Optics and Photonics
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• v.20 no.4
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• pp.236-240
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• 2009

LED modules, based on MCPCB with a hard barrier oxide layer and an improved thermal dissipation property, are presented. Reflecting cups were also formed on the surface of the MCPCB such that optical coupling between neighboring chips was minimized for improving the photon absorption loss. LED chips were directly attached on the MCPCB by using the COB (Chip On Board) scheme. The LED modules showed significantly enhanced light outputs, compared to the LED modules based on conventional MCPCBs.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.95-100
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• 2010

LED (Light Emitting Diode) is 85% of the applied energy is converted into heat that is already well known. Lately, LED chips increasing the capacity as result delivered to increase the heat of the LED products and module that directly related to life span and degradation. Thus, in industry the high-power LED chip to control the heat generated during the course of the study and the existing aluminum, copper adhesives, and uses MLC (Metal clad laminate) structures using low-cost FR4 and copper CCL (Copper Clad Laminate) to reduce costs by changing to a study being carried out. In this study, using low-cost CCL Class, mounted 1W LED chip to analyze changes in the thermal resistance. In addition, heat dissipation in the CCL to facilitate a variety of thermal via design outside of the heat generated by the LED chip to control and facilitate the optimal structure of the heat dissipation is suggested.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.3
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• pp.517-526
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• 2008

A one-chip DC-DC converter circuit for OLED(Organic Light-Emitting Diode) display module of automotive clusters is newly proposed. OLED panel driving voltage circuit, which is a charge-pump type, has improved characteristics in miniaturization, low cost and EMI(Electro-Magnetic Interference) compared with DC-DC converter of PWM(Pulse Width Modulator) type. By using bulk-potential biasing circuit, charge loss due to parasitic PNP BJT formed in charge pumping, is prevented. In addition, the current dissipation in start-up circuit of band-gap reference voltage generator is reduced by 42% and the layout area of ring oscillator is reduced by using a logic voltage VLP in ring oscillator circuit using VDD supply voltage. The driving current of VDD, OLED driving voltage, is over 40mA, which is required in OLED panels. The test chip is being manufactured using $0.25{\mu}m$ high-voltage process and the layout area is $477{\mu}m{\times}653{\mu}m$.