• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.67-72
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• 2012

In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.

• KIISE Transactions on Computing Practices
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• v.22 no.12
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• pp.663-674
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• 2016

Traditional supercomputing services suffer from limited accessibility and low utilization in that users(researchers) may perform computational executions only using terminal-based command line interfaces. To address this problem, in this paper, we provide the design and implementation details of National supercomputing service framework. The proposed framework supports all the fundamental primitive functions such as user management/authentication, heterogeneous computing resource management, HPC (High Performance Computing) job management, etc. so that it enables various 3rd-party applications to be newly built on top of the proposed framework. Our framework also provides Web-based RESTful OpenAPIs and the abstraction interfaces of job schedulers (as well as bundle scheduler plug-ins, for example, LoadLeveler, Open Grid Scheduler, TORQUE) in order to easily integrate the broad spectrum of heterogeneous computing clusters. To show and validate the effectiveness of the proposed framework, we describe the best practice scenario of high energy physics Lattice-QCD as an example application.

• Journal of Electrochemical Science and Technology
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• v.7 no.2
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• pp.132-138
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• 2016

In this study, we report the fabrication of functional complex fibers, which have been studied widely globally for numerous applications. Here, we fabricated conductive complex fibers with antibacterial properties by coating metal ions on the surface of plastic (polypropylene) fibers using the electroless and electrochemical deposition. First, we polished the polypropylene melt-blown fiber surface and obtained an absorbing Pd seed layer on its surface. Subsequently, we substituted the Pd with Cu. Bis-3-sulfopropyl-disulfide disodium salt (SPS), polyethylene glycol (PEG), and ethylene thiourea (ETU) were used as the brightener, carrier, and leveler, respectively for the electroplating. We focused on most achieving the stable plating condition to remove dendrites, which are normally during electroplating metals so that smooth layer is formed on the fiber surface. The higher the amount of SPS, the higher was the extent of irregular plate-like growth. Many irregularities in the form of round spheres were observed with increase in the amount of PEG and ETU. Hence, when the additives were used separately, a uniform coating could not be obtained. A stable coating was obtained when the three additives were combined and a uniform 5-9 μm thick copper layer with a stable morphology could be obtained around the fiber. We believe that our results can be applied widely to obtain conductive fibers with antibacterial properties and are useful in aiding research on conductive lightweight composite fibers for application in information technology and robotics.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.55-59
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• 2012

Defects such as voids or seams are frequently found in TSV via filling process. To achieve defect-free copper via filling, organic additives such as suppressor, accelerator and leveler were necessary in a copper plating bath. However, by-products stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this research, the effects of levelers on copper electrodeposition were investigated without suppressor and accelerator to lower the concentration of additives. Threelevelers(janus green B, methylene violet, diazine black) were investigated to study the effects of levelers on copper deposition. Electrochemical behaviors of these levelers were different in terms of deposition rate. Filling performances were analyzed by cross sectional images and its characteristics were different with variations of levelers.

• Journal of the Korean institute of surface engineering
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• v.55 no.4
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• pp.222-230
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• 2022

The electroplating for copper foils has many advantages in economics. During the electroplating, the selection of appropriate additives is needed to manufacture copper foils with various properties. Therefore, it is investigated the initial plating voltage and the properties of copper foil electroplated in the electrolyte with benzothiazole as additives. The addition of benzothiazole without any additives decreased effectively the initial plating voltage. However, the initial voltage increased when the additives was used in combination with an inhibitor and a leveler along with benzothiazole. Moreover, the voltage tends to increase with the concentration of benzothiazole except for 40 ppm group. The mixed additives could change not only the initial voltage but also the morphology of crystals on the surface. When benzothiazole is added at 20 ppm or less, it was observed that the clustered crystals existed on the surface, which result in ununiform surface and high roughness value. In addition, the grain size increased with the amount of benzothiazole, but the resistivity decreased. However, when the leveler was added in 20 ppm, the grain size was decreased with the amount of benzothiazole. The size of the crystals could be influenced by the mixing ratio of additives. Therefore, it is necessary to study on the effect of concentration ratio of additives in the future.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.92-92
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• 2010

여수 국가산업단지, 삼성전자 정전사례에서 볼 수 있듯이 대규모 정전사고는 수백억 이상의 경제적 손실이 뒤따른다. 공장 내에 자체 발전소가 있지만 매번 이런 사고가 재연되어 근본적인 해결책이 필요한 상황이다. UPS 및 디젤발전기를 사용하는 경우, 정전사고로 시 UPS DC bus전압이 일정 수준 이하로 떨어지면 발전기가 기동하여 에너지를 공급하는데 발전기의 특성에 따라 전압의 변동이 심하고 초기기동실패 사례가 종종 보고되고 있다. 본 연구는 연료전지와 전력저장장치의 연계를 통해 산업설비에 안정적으로 전원을 공급하고자 하는 방법에 관한 것으로 연계 제어 로직개발과 Load Leveler, Compensator, STS 등 구성요소 개발을 주요 연구 내용으로 하고 있다. 고온형 연료전지의 열적 안정성을 유지하면서 독립전원의 부하 변동에 대응하기 위한 부가 설비가 기존 제품에 추가 장착되어야 하며, 연계 제어 알고리즘의 확보를 위하여 연료전지 모델링 및 통합시스템 시뮬레이션을 수행하였다. 본 연구에서는 이상과 같은 시뮬레이션 및 백업 모듈 설계 결과를 제시하고자 한다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.319-322
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• 2003

For the analysis of leveling process by the 3-dimensional elastic-plastic finite element method, a finite element analysis program modeling large deformation of shell has been developed. This program fur analyzing large deformation of sheet during leveling includes spring-back analysis as well as efficient contact treatment between sheet and rolls of leveler. This is verified by the simple leveling experiment with 5 rolls at laboratory. Besides the leveling examples, problems within the category of large strain and rotation, such as 3-dimensional roll-up and gutter occurrence at continuous bending-unbending process are also tested for verification of the program. The residual curvatures of strip predicted by finite element analysis are within 20% error range of the experiment. The formation and direction of anticlastic curvature or gutter during bending-unbending under tension is predicted and this agrees with the experimental results.

• Transactions of Materials Processing
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• v.24 no.4
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• pp.241-247
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• 2015

In order to prevent shape defects such as fluting and stretcher strains during press forming of aged low carbon steel sheets, roller leveling conditions for reducing yield point elongation were studied. Yield point elongations of leveled sheets were determined as a function of leveling, which is defined as the plastic fraction or the ratio of plastically deformed part in sheet thickness section to the whole thickness of the sheet. By adjusting this plastic fraction during leveling to more than 78%, yield point elongation in the leveled sheets was reduced so no fluting occurred during subsequent tangential bending. Stretcher strains can be avoided by leveling the sheet to an 84% plastic fraction condition.

• Journal of Power Electronics
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• v.10 no.5
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• pp.538-547
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• 2010

This paper deals with a stand-alone wind energy conversion system (WECS) with an isolated asynchronous generator (IAG) and voltage and frequency (VF) control feeding three-phase four-wire loads. The reference generator currents are estimated using the instantaneous symmetrical component theory to control the voltage and frequency of an IAG system. A three-leg voltage source converter (VSC) with an isolated star/delta transformer is used as an integrated VSC. An integrated VSC with a battery energy storage system (BESS) is used to control the active and reactive powers of the WECS. The WECS is modeled and simulated in MATLAB using the Simulink and the Sim Power System (SPS) toolboxes. The proposed VF controller functions as a voltage and frequency regulator, a load leveler, a load balancer and a harmonic eliminator in the WECS. A comparison is made on the rating of the VSC with and without ac capacitors connected at the terminals of an IAG. Simulation and test results are presented to verify the control algorithm.

• Journal of the Korea Society of Computer and Information
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• v.22 no.3
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• pp.1-8
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• 2017

In this paper, we propose a new hybrid wear leveling technique for NAND Flash memory, called Time-Aware Wear Leveling (TAWL). Our proposal prolongs the lifetime of NAND Flash memory by using dynamic wear leveling technique which considers the wear level of hot blocks as well as static wear leveling technique which considers the wear level of the whole blocks. TAWL also reduces the overhead of garbage collection by separating hot data and cold data using update frequency rate. We showed that TAWL enhanced the lifetime of NAND flash memory up to 220% compared with previous wear leveling techniques and our technique also reduced the number of copy operations of garbage collections by separating hot and cold data up to 45%.