Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame (LED 및 반도체 소자 리드프레임 패키징용 Cu/STS/Cu 클래드메탈의 기계적/열전도/전기적 특성연구)
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- Journal of Welding and Joining
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- v.30 no.3
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- pp.32-37
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- 2012