• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.37-42
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• 2001

The concerns of the toxicity and health hazard of lead in solders have demanded the research to find suitable lead-free solder alloys. It was discussed that effect of the intermetallic formation and structure on the reliability of solder joints. In this study, lead-free solder alloys with compositions of Sn/3.5Ag/0.75Cu, Sn/2.0Ag/0.5Cu/2.0Bi were applied to the 48 $\mu$BGA packages. Also, the lead-free solder alloys compared with eutectic Sn/37Pb solder using shear test under various aging temperature. Common $\mu$BGA with solder components was aged at $130^{\circ}C$, $150^{\circ}C$ and $170^{\circ}C$. And the each temperature applied to 300, 600 and 900 hours. The thickness of the intermetallics was measured for each condition and the activation energy for their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS (Energy Dispersive Spectroscopy). These results for reliability of lead-free interconnections are discussed.

• Journal of Plant Biology
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• v.19 no.1
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• pp.1-6
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• 1976

This study was carried out to investigate the formation of precipitates between lead ion and the essential anions of plants, the effects of lead concentration on seed germination and plant growth in water and soil culture, and the germinating and growing recovery of inhibited seed germination and plant growth by lead. Four kinds of the seeds (Glycine max M., Triticum vulgare V., Setaria viridis (L) P. De Beauvois, and Digitoria sanguinalis (L) Scopoli var) were germinated and growth in water and soil culture included the different concentrations of lead for five days. The seeds and plants inhibited germination and growth by lead were transferred to lead free Hoagland solution and the growing recovery was observed. The precipitates of lead ion were observed in the solution of both acidity and alkalinity included each anion of $H_2PO_4^-, HPO_4^{2-}, PO_4^{3-}, SO_4^{2-} and MoO_4^{2-}$ in a room temperature, whereas the precipitates between lead ion and other anions were observed largely in the solution of alkalinity, so that it seemed that lead could be remained in the state of non-soluble in plant and soil. The inhibition of germination and growth in the water culture was observed in 100ppm of lead, whereas the inhibition in the case of the soil culture was observed in 10000ppm of lead. The difference of the effected concentration between water and soil culture in germination and the growth was 100 times. When the seed and plant inhibited the growth in 5000ppm or 10000ppm of lead for five days were transferred to lead free Hoagland solution, the recovery of germination and growth was observed in three days. This growing recovery was different according to the kinds of plant and concentrations of lead. It seemed that plant growth could be inhibited by the inhibition of the metabolism concerned with the precipitates between lead iion and other anions.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.21-50
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• 2001

EC's/Japanese environmental regulation drive the Pb-free/Halogen-free application. Most Japanese electronics companies are preparing the green products. All items concerning to Pb-free/Halogen-ree technology should be coparallely designed and developed. More works need to clear the unknowns on Pb-free materials. Need of consensus on materials and standards. EBM (Environmental Benign Manufacturing)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.39-40
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• 2006

AE sensor using lead-free ceramics should be developed for prohibiting environment protection. In this study, Langevin type AE sensor was manufactured as air backing structure. Here, the piezoelectic element was used as PZT(EC-65) and NKN, respectively. The resonant frequency of AE sensor using PZT was 143 kHz and the resonant frequency of AE sensor using NKN was 178 kHz. The waveform of AE sensor using NKN was responded more sensitively than that of AE sensor using PZT.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.3
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• pp.218-222
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• 2007

In this study, Acoustic emission(AE) sensors were fabricated using lead-free piezoelectric ceramics for prohibiting environmental pollution. Structure of AE sensors were designed as Langvin type air backing form. Here, the piezoelectic element was used as PZT(EC-65)(AE1) and NKN(AE2), respectively. The measured resonant frequency, the maximum sensitivity frequency and sensitivity of AE sensors were as follows ; 143 kHz, 29.4 kHz and 69.3 dB in AE1 and 179 kHz, 29.4 kHz and 66.3dB in AE2, respectively.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.126-129
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• 2002

This article presents that the affecting factors to solderability and initial reliability. It was discussed that effect of the solder ball hardness and composition on the reliability of solder joints. In this study, lead free solder alloys with compositions of Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi were applied to the $\muBGA$ packages. As a result of experiments, the high degree of hardness with the displacement of 0.22mm was obtained Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of lead free solder was higher than of Sn-37Pb solder, and it was increased about 150% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Journal of Nutrition and Health
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• v.29 no.9
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• pp.958-970
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• 1996

This study was performed to investigate the effect of dietary calcium level on cadmium and lead toxicity in rats. Fifty-four male rats of Sprague-Dawely strain weighing 152$\pm$12g were blocked into 9 groups according to body weight, and were raised for 30 days. Nine experimental diets different with cadmium(0%, 0.04%), lead (0%, 0.071%) and calcijm(0.5%, 1.0%, 1.5%) levels were prepared. The results are summarized as follow. Weight gain, F.E.R.(food efficiency ratio), and weights of liver, kidney and femur were lower in cadmium exposed groups than those of heavy metal free groups. Weight gain F.E.R. and ash weight of lead groups were lower than those of heavy metal free groups. But, these were increased with increasing dietary calcium level. Cadmium and lead concentrations in blood, liver, kidney and femur were lower in rats fed 1.5% calcium than 0.5% calcium diet. Fecal cadmium and lead excretions were remarkably increased in 1.5% calcium groups, and cadmium and lead retention rates were decreased in 1.5% calcium groups. Metallothionein concentrations in liver, kidney and small intestine were higher in rats exposed to cadmium and lead. Calcium content in blood, femur and daily urinary and fecal calcium excretion were decreased by cadmium and lead additions, and increased in 1.5% calcium groups. Creatinine clearance were decreased with cadmium administratino and calcium addition. In conclusion, weight gain and organ weights were decreased with cadmium or lead administration. But, cadmium administration was more toxic than lead adminstration. Cadmium or lead toxicity was alleviated by increasing dietary calcium level. Especially, lead toxicity was alleviated in proportion to dietary calcium level.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.1
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• pp.322-328
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• 2012

This paper deals with a digital Desoldering system for removing lead-free solder. We proposed a Desoldering system that is to cope with the changed work environment of the solder materials changing from lead solder to lead-free solder, we can be quickly stable to the set temperature, and continuous operation is possible. Proposed system consists of a Desoldering station and a Desoldering gun. For the PID temperature control, we designed the 8bit MCU peripheral circuit. We had a few experiments to confirm the performance of the proposed system, and compared with the specification of same kind of imports. As a result, proposed system than the imported products showed good performance as follows: the time to reach operating temperature is 11 seconds faster, ripple temperature variation is $1.5^{\circ}C$ lower, temperature recovery rate is about $0.14^{\circ}C$/sec faster.

• Journal of Welding and Joining
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• v.26 no.5
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• pp.43-48
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• 2008

Characteristics of Sn-1.7%Bi-0.7%Cu-0.6%In (hereafter, SBIC) lead-free solder was investigated in this study. The results from SBIC were compared to other lead-free solders such as Sn-3.5%Ag-0.7%Cu (hereafter, SAC), Sn-0.7%Cu (hereafter, SC), and lead-bearing Sn-37%Pb (hereafter, SP) alloy. Tensile properties of bulk solder, wettability, spreading index, bridge and dross were evaluated. As experimental results, tensile strength and elongation of SBIC was 62.5MPa and 21.5%, respectively. The tensile strength was comparable to that of SP solder. The wetting time of SBIC was 1.2 sec at $250^{\circ}C$, and its wetting properties including wetting force were as good as the SAC alloy. However, wettability of the SC was not so good as the SBIC and SAC. The spreading index of SBIC at $250^{\circ}C$ was 71 %, and it was similar level to those of SAC and SC solders. Bridging was not found for all solders of SBIC, SAC and SC in the range from 240 to $260^{\circ}C$. In dross test at $250^{\circ}C$ for an hour, the amount of dross produced from SBIC was about 57% compared to that from SAC.