• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.230-234
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• 2000

Bi$_2$Sr$_2$Ca$_{n}$Cu$_{n+1}$ O$_{y}$(n$\geq$0; BSCCO)thin film is fabricated via two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-law growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.on.n.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.8 no.3
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• pp.91-99
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• 2009

Development of high-speed Internet services and the increased supply of mobile devices have become the key factor for the acceleration of ubiquitous technology. WiBro system, formed with lP backbone network, is a MBWA technology which provides high-speed multimedia service in a possibly broader coverage than Wireless LAN can offer. Wireless telecommunication environment needs not only mobility support in Layer 2 but also mobility management protocol in Layer 3 and has to minimize handover latency to provide seamless mobile services. In this paper, we propose a fast cross-layer handover scheme based on signal strength prediction in WiBro environment. The signal strength is measured at regular intervals and future value of the strength is predicted by Exponential Smoothing Method. With the help of the prediction, layer-3 handover activities are able to occur prior to layer-2 handover, and therefore, total handover latency is reduced. Simulation results demonstrate that the proposed scheme predicts that future signal level accurately and reduces the total handover latency.

• Journal of the Korean Graphic Arts Communication Society
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• v.10 no.1
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• pp.35-54
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• 1992

Direct electrostatic coating method is simple, low cost and environmentally useful method. We are investigated on the coating of carrier transfer polymer layer on the carrier generate inorganic pigment layer using direct electrostatic coating method. The sample was obtained electrostatic deposite layer by fusing and calendering on the copper phthalocyanine. we could be found several polymer thin film shows good bond properties between film and pigment layer.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.4
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• pp.470-480
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• 2016

The reversal of a silicon chip to find out its security structure is common and possible at the present time. Thanks to reversing, it is possible to use a probing attack to obtain useful information such as personal information or a cryptographic key. For this reason, security-related blocks such as DES (Data Encryption Standard), AES (Advanced Encryption Standard), and RSA (Rivest Shamir Adleman) engines should be located in the lower layer of the chip to guard against a probing attack; in this regard, the addition of a silicon-surface-protection layer onto the chip surface is a crucial protective measure. But, for manufacturers, the implementation of an additional silicon layer is burdensome, because the addition of just one layer to a chip significantly increases the overall production cost; furthermore, the chip size is increased due to the bulk of the secure logic part and routing area of the silicon protection layer. To resolve this issue, this paper proposes a practical silicon-surface-protection method using a metal layer that increases the security level of the chip while minimizing its size and cost. The proposed method uses a shift register for the alternation and variation of the metal-layer data, and the inter-connection area is removed to minimize the size and cost of the chip in a more extensive manner than related methods.

• Progress in Superconductivity and Cryogenics
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• v.12 no.1
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• pp.1-5
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• 2010

Silver stabilizing layer of coated conductor has been prepared by dip coating method using organic silver complexes containing 10 wt% silver as a starting material. Coated silver complex layer was dried in situ with hot air and converted to crystalline silver by post heat treatment in flowing oxygen atmosphere. A dense continuous silver layer with good surface coverage and proper thickness of 230 nm is obtained by multiple dip coatings and heat treatments. The film heat treated at $500^{\circ}C$ showed good mechanical adhesion and crystallographic property. The interface resistivity between superconducting YBCO layer and silver layer prepared by dip coating was measured as $0.67\;{\times}\;10^{-13}\;{\Omega}m^2$. Additional protecting copper layer with the thickness of $20\;{\mu}m$ was successfully deposited by electroplating. The critical current measured with the specimen prepared by dip coating and sputtering on same quality YBCO layer showed similar value of ~140 A and proved its ability to replace sputtering method for industrial production of coated conductor.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.506-508
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• 2007

We studied the nematic liquid crystal (NLC) alignment capability with a new alignment method utilizing an inkjet printed polyimide (PI) layer. A good, uniform LC alignment was achieved by the good PI printing using a new alignment method. The pretilt angle generated on the printed PI layer using the alignment method was almost the same as that on printed PI layer using rubbing alignment method. In addition, the good electro-optical performances of the new aligned twisted nematic (TN) cell with printed PI surface was obtained

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.529-530
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• 2006

$Bi_2Sr_2CuO_x$ thin films have been fabricated by atomic layer-by-layer deposition using the ion beam sputtering method. During the deposition, 10 and 90 wt%-ozone/oxygen mixture gas of typical pressure of $1{\sim}9{\times}10^{-5}\;Torr$ are supplied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal out that a buffer layer with some different compositions is formed at the early deposition stage of less than 10 units cell and then Bi-2201 oriented along the c-axis is grown.

• Structural Engineering and Mechanics
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• v.77 no.1
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• pp.47-56
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• 2021

This paper deals with damage detection using a Gapped Smoothing Method (GSM) combined with deep learning. Convolutional Neural Network (CNN) is a model of deep learning. CNN has an input layer, an output layer, and a number of hidden layers that consist of convolutional layers. The input layer is a tensor with shape (number of images) × (image width) × (image height) × (image depth). An activation function is applied each time to this tensor passing through a hidden layer and the last layer is the fully connected layer. After the fully connected layer, the output layer, which is the final layer, is predicted by CNN. In this paper, a complete machine learning system is introduced. The training data was taken from a Finite Element (FE) model. The input images are the contour plots of curvature gapped smooth damage index. A free-free beam is used as a case study. In the first step, the FE model of the beam was used to generate data. The collected data were then divided into two parts, i.e. 70% for training and 30% for validation. In the second step, the proposed CNN was trained using training data and then validated using available data. Furthermore, a vibration experiment on steel damaged beam in free-free support condition was carried out in the laboratory to test the method. A total number of 15 accelerometers were set up to measure the mode shapes and calculate the curvature gapped smooth of the damaged beam. Two scenarios were introduced with different severities of the damage. The results showed that the trained CNN was successful in detecting the location as well as the severity of the damage in the experimental damaged beam.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1395-1398
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• 2007

MgO thin films were deposited by e-beam evaporator using the 2-step method for alternate current plasma display panels (AC-PDPs). Glancing angle deposition (GLAD) method was employed to produce various surface geometry of the thin film; the bottom layer was deposited on a substrate by normal e-beam evaporation method and the top layer was deposited on bottom layer with $85^{\circ}$ by GLAD method. Results show that firing and sustain voltages improved as the sharpness of surface and isolated columnar structures increases, respectively.

• Journal of applied mathematics & informatics
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• v.36 no.3_4
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• pp.331-348
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• 2018

In this paper, an initial value method for solving a class of singularly perturbed delay differential equations with layer behavior is proposed. In this approach, first the given problem is modified in to an equivalent singularly perturbed problem by approximating the term containing the delay using Taylor series expansion. Then from the modified problem, two explicit Initial Value Problems which are independent of the perturbation parameter, ${\varepsilon}$, are produced: the reduced problem and boundary layer correction problem. Finally, these problems are solved analytically and combined to give an approximate asymptotic solution to the original problem. To demonstrate the efficiency and applicability of the proposed method three linear and one nonlinear test problems are considered. The effect of the delay on the layer behavior of the solution is also examined. It is observed that for very small ${\varepsilon}$ the present method approximates the exact solution very well.