• ETRI Journal
• /
• 제13권4호
• /
• pp.42-51
• /
• 1991

MBE 성장시 기판 표면에서의 성장과정을 운동론적 지배과정과 열역학적 지배과정으로 나누어 성장모델을 제시하였으며, 화학적 평형상태에서의 열역학이 III-V compound의 성장속도와 composition 에 미치는 영향을 기존의 보고된 결과 데이터와 비교 분석하였다. 특히 miscibility gap 내에 존재하는 III-V ternary compound의 경우 박막의 성질 및 소자의 특성에 영향을 미치는 alloy clustering은 저온 성장시 surface kinetics에 의해, 고온성장시에는 열역학적 spinodal decomposition에 의해 결정됨을 알수 있었다. 열역학적 모델에서는 기판과 layer사이의 lattice mismatch와 재료의 elastic coefficient의 함수인 additive strain Gibbs free energy, 그리고 ternary solid solution의 regular behavior를 가정하여 ternary alloy의 mixing에 기인한 excess Gibbs free energy를 고려하였다.

• EDISON SW 활용 경진대회 논문집
• /
• 제5회(2016년)
• /
• pp.326-329
• /
• 2016

2차원 metal monochalchogenides(MMC) 물질들 중 lattice mismatch가 가장 적은 GaSe와 InS의 $8{\times}1$ lateral heterostructure의 계면 원자 구조와 전자 구조를 Linear combination of atomic orbital 제일원리계산을 이용하여 연구하였다. Arm-chair 와 zigzag 계면에 대해 각각 두 가지 원자 구조를 고려하여 총 네 가지 계면 구조 모델을 정립하고, 각각의 계면에 대해 GaSe-InS의 비율을 다섯 단계(2:6, 3:5, 4:4, 5:3, 6:2)로 바꾸어 가며 relax된 원자구조의 특성과 계면 형성 에너지를 구하였다. 또한, 계면 전자구조 분석을 위하여, 계면으로부터의 위치에 따른 projected density of states의 변화를 규명하였다.

• 한국표면공학회지
• /
• 제13권4호
• /
• pp.211-220
• /
• 1980

Internal stress of electrodeposited metals affect physical and mechanical characteristics of deposits. Internal stress of nickel deposits was reviewed intensively. Important outcomes are as follows. Substrate have an important effect on internal stress of electrodeposit. Origin of its internal stress could be explained mismatch of crystal lattice and coalescence of crystallites. When surface cleaning is not satisfying, instantaneous stress is low but the electrodeposited layer being thickened increasingly stress become to high and peeling phenomenon occurs. Effect of current density and temperature on internal stress is variable. Internal stress increases rapidly at pH 5 and above because of codepositing colloidal materials caused hydrolysis. Concentrations of nickel ion and $H_3BO_3$ ion affect little on internal stress and solution which contains impurities tend to increase stress. Especially impurities of $H_2O_2$ and iron ion have a great effect on internal stress. Additives are divided in two kind. One is increasing tensile stress another is increasing compressive stress. Concentrations of additives have a great effect on internal stress.

• Bulletin of the Korean Chemical Society
• /
• 제15권1호
• /
• pp.28-33
• /
• 1994

The laser-assisted chemical vapor deposition (LCVD) is described, by which the growth of single-phase GaN epitaxy is achieved at lower temperatures. Trimethylgallium (TMG) and ammonia are used as source gases to deposit the epitaxial films of GaN under the irradiation of ArF excimer laser (193 nm). The as-grown deposits are obtained on c-face sapphire surface near 700$^{\circ}$C, which is substantially reduced, relative to the temperatures in conventional thermolytic processes. To overcome the lattice mismatch between c-face sapphire and GaN ad-layer, aluminum nitride(AlN) is predeposited as buffer layer prior to the deposition of GaN. The gas phase interaction is monitored by means of quadrupole mass analyzer (QMA). The stoichiometric deposition is ascertained by X-ray photoelectron spectroscopy (XPS). The GaN deposits thus obtained are characterized by X-ray diffractometer (XRD), scanning electron microscopy (SEM) and van der Pauw method.

• 한국자기학회지
• /
• 제5권5호
• /
• pp.470-473
• /
• 1995

We have constructed an apparatus for in sity measurement of stress of the film prepared by sputtering using an optical noncontact displacement detector. A Change of the gap distance between the detector and the substrate, caused by stress of a deposited film, was detected by a corresponding change of the reflectivity. The sensitivity of the displacement detector was $5.9\;{\mu}V/{\AA}$ and thus, it was turned out to be good enough to detect stress caused by deposition of a monoatomic layer. The apparatus was applied to in situ stress measurements of Co/X(X=Pd or Pt) multilayer thin films prepared on the glass substrates by dc magnetron sputtering. At the very beginning of the deposition, both Co and X sublayers have subjected to their own intrinsic stresses. However, when the film was thicker than about $100{\AA}$, constant tensile stress in the Co sublayer and compressive stress in the X sublayer were observed, which is believed to be related to a lattice mismatch between the matching planes of Co and X.

• 한국광학회:학술대회논문집
• /
• 한국광학회 1989년도 제4회 파동 및 레이저 학술발표회 4th Conference on Waves and lasers 논문집 - 한국광학회
• /
• pp.172-175
• /
• 1989

1.3${\mu}{\textrm}{m}$ surface-emitting GaInAsP/InP LED was fabricated by two-phase supercooling LPE technique. The lattice mismatch of the grown DH wafer was typically 0.03%. The processes involve SiO2 CVD, lithography, Zn diffusion, lift-off, lapping, annealing, and wire bonding. The fabricated LED shows the optical power of 600㎼ at 70mA driving current, differential resistance of 4$\Omega$, the f3dB of 35MHz, and the FWHM of 1040{{{{ ANGSTROM }}. The peak wavelength of the fabricated LED was at 1.29${\mu}{\textrm}{m}$(100mA).

• 반도체디스플레이기술학회지
• /
• 제22권2호
• /
• pp.81-86
• /
• 2023

Recently, there has been an increased demand for light-emitting diode (LED) due to the growing emphasis on environmental protection. However, the use of GaN-based sapphire in LED manufacturing leads to the generation of defects, such as dislocations caused by lattice mismatch, which ultimately reduces the luminous efficiency of LEDs. Moreover, most inspections for LED semiconductors focus on evaluating the luminous efficiency after packaging. To address these challenges, this paper aims to detect defects at the wafer stage, which could potentially improve the manufacturing process and reduce costs. To achieve this, image processing and deep learning-based defect detection techniques for Sapphire Epi-Wafer used in Green LED manufacturing were developed and compared. Through performance evaluation of each algorithm, it was found that the deep learning approach outperformed the image processing approach in terms of detection accuracy and efficiency.

• 한국자기학회지
• /
• 제17권1호
• /
• pp.18-21
• /
• 2007

Pulsed laser deposition(PLD) 박막 증착법을 이용하여 hexagonal $HoMn_{1-x}-Fe_xO_3$(x=0.0, 0.05) 물질을 박막으로 $Pt/Ti/SiO_2/Si$ 기판 위에 증착하였다. 또한 x-ray diffraction(XRD), atomic force microscopy(AFM), scanning electron microscope(SEM), 및 x-ray photoelectron spectroscopy(XPS)를 통하여 박막의 결정학적 및 미세 구조를 분석하였고, conversion electron $M\"{o}ssbauer$ spectroscopy(CEMS)를 이용하여 자기적 특성에 관해 연구하였다. 결정구조는 hexagonal 구조로써 space group이 $P6_3cm$로 분석되었고, single crystal과는 달리 (110) 방향으로 우선 배향성을 가지고 증착되었다. $HoMn_{0.95}Fe_{0.05}O_3$ 박막의 경우 single crystal과 비교했을 때 hexagonal unit cell의 $c_0$ 축은 일정하나 $a_0$ 축은 다소 감소함으로 분석되었다. 이는 박막 증착에 사용된 $Pt/Ti/SiO_2/Si$ 기판과의 lattice mismatch 때문으로 해석된다. Fe가 미량 치환된 $HoMn_{0.95}Fe_{0.05}O_3$ 박막을 상온에서 CEMS 측정을 수행한 결과, $HoMn_{0.95}^{57}Fe_{0.05}O_3$ 분말의 경우 magnetic $T_N$이 72K 부근이므로, 상온에서 doublet absorption spectrum이 관측되었고, 전기사중극자 분열값(quadrupole splitting; ${\Delta}E_Q$)이 $1.62{\pm}0.01mm/s$로 비교적 큰 값을 가짐을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2010년도 하계학술대회 논문집
• /
• pp.31-31
• /
• 2010

The growth of the high-quality GaN epilayers is of significant technological importance because of their commercializedoptoelectronic applications as high-brightness light-emitting diodes (LEDs) and laser diodes (LDs) in the visible and ultraviolet spectral range. The GaN-based heterostructural epilayers have the polar c-axis of the hexagonal structure perpendicular to the interfaces of the active layers. The Ga and N atoms in the c-GaN are alternatively stacked along the polar [0001] crystallographic direction, which leads to spontaneous polarization. In addition, in the InGaN/GaN MQWs, the stress applied along the same axis contributes topiezoelectric polarization, and thus the total polarization is determined as the sum of spontaneous and piezoelectric polarizations. The total polarization in the c-GaN heterolayers, which can generate internal fields and spatial separation of the electron and hole wave functions and consequently a decrease of efficiency and peak shift. One of the possible solutions to eliminate these undesirable effects is to grow GaN-based epilayers in nonpolar orientations. The polarization effects in the GaN are eliminated by growing the films along the nonpolar [$11\bar{2}0$] ($\alpha$-GaN) or [$1\bar{1}00$] (m-GaN) orientation. Although the use of the nonpolar epilayers in wurtzite structure clearly removes the polarization matters, however, it induces another problem related to the formation of a high density of planar defects. The large lattice mismatch between sapphiresubstrates and GaN layers leads to a high density of defects (dislocations and stacking faults). The dominant defects observed in the GaN epilayers with wurtzite structure are one-dimensional (1D) dislocations and two-dimensional (2D) stacking faults. In particular, the 1D threading dislocations in the c-GaN are generated from the film/substrate interface due to their large lattice and thermal coefficient mismatch. However, because the c-GaN epilayers were grown along the normal direction to the basal slip planes, the generation of basal stacking faults (BSFs) is localized on the c-plane and the generated BSFs did not propagate into the surface during the growth. Thus, the primary defects in the c-GaN epilayers are 1D threading dislocations. Occasionally, the particular planar defects such as prismatic stacking faults (PSFs) and inversion domain boundaries are observed. However, since the basal slip planes in the $\alpha$-GaN are parallel to the growth direction unlike c-GaN, the BSFs with lower formation energy can be easily formed along the growth direction, where the BSFs propagate straightly into the surface. Consequently, the lattice mismatch between film and substrate in $\alpha$-GaN epilayers is mainly relaxed through the formation of BSFs. These 2D planar defects are placed along only one direction in the cross-sectional view. Thus, the nonpolar $\alpha$-GaN films have different atomic arrangements along the two orthogonal directions ($[0001]_{GaN}$ and $[\bar{1}100]_{GaN}$ axes) on the $\alpha$-plane, which are expected to induce anisotropic biaxial strain. In this study, the anisotropic strain relaxation behaviors in the nonpolar $\alpha$-GaN epilayers grown on ($1\bar{1}02$) r-plane sapphire substrates by metalorganic chemical vapor deposition (MOCVO) were investigated, and the formation mechanism of the abnormal zigzag shape PSFs was discussed using high-resolution transmission electron microscope (HRTEM).

• 마이크로전자및패키징학회지
• /
• 제22권3호
• /
• pp.51-56
• /
• 2015

솔더 조인트의 신뢰성 강화를 위해서 다양한 pad finish material이 사용되고 있으며, 최근에는 Electroless Ni Electroless Pd Immersion Gold (이하 ENEPIG) pad가 많이 사용되고 있다. 따라서, 본 연구는 상용화 되어 사용중인 Electrolytic Ni (soft Ni) pad와 최근 이슈가 되고 있는 ENEPIG pad에 대한 신뢰성 평가에 관한 것으로, 다양한 Cu 함량에 따른 거동을 관찰 하였다. Reflow 후 솔더와 pad간의 접합층은 $Cu_6Sn_5$에 Ni이 치환된 형태의 금속간 화합물로 구성되어 있었으며, ENEPIG pad의 경우, 접합층과 Ni layer 사이에 $Ni_3P$ (dark layer) layer가 관찰 되었다. 또한, Cu 함량에 따라 Dark layer의 두께를 제어할 수 있었다. 충격 낙하 시험 후, 파괴모드를 관찰한 결과 soft Ni pad와 ENEPIG pad에서 서로 다른 파괴모드가 관찰 되었으며, soft Ni의 경우, 1차 IMC와 2차 IMC 경계에서 파괴가 관찰 되었고, ENEPIG pad의 경우, dark layer에서 파괴가 관찰 되었다. IMC와 pad material, bulk 솔더와의 lattice mismatch에 의해 불안정한 계면이 존재하며, 이는 연속적인 외부 충격에 의해 가해진 열적, 물리적 스트레스를 IMC 계면으로 전송하기 때문에, 솔더의 신뢰성 향상을 위해서는 솔더 벌크의 제어와 IMC의 두께 및 형상의 제어는 필요하다.