• Title/Summary/Keyword: lateral process

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A Novel z-axis Accelerometer Fabricated on a Single Silicon Substrate Using the Extended SBM Process (Extended SBM 공정을 이용하여 단일 실리콘 기판상에 제작된 새로운 z 축 가속도계)

  • Ko, Hyoung-Ho;Kim, Jong-Pal;Park, Sang-Jun;Kwak, Dong-Hun;Song, Tae-Yong;Cho, Dong-Il;Huh, Kun-Soo;Park, Jahng-Hyon
    • Journal of Sensor Science and Technology
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    • v.13 no.2
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    • pp.101-109
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    • 2004
  • This paper presents a novel z-axis accelerometer with perfectly aligned vertical combs fabricated using the extended sacrificial bulk micromachining (extended SBM) process. The z-axis accelerometer is fabricated using only one (111) SOI wafer and two photo masks without wafer bonding or CMP processes as used by other research efforts that involve vertical combs. In our process, there is no misalignment in lateral gap between the upper and lower comb electrodes, because all critical dimensions including lateral gaps are defined using only one mask. The fabricated accelerometer has the structure thickness of $30{\mu}m$, the vertical offset of $12{\mu}m$, and lateral gap between electrodes of $4{\mu}m$. Torsional springs and asymmetric proof mass produce a vertical displacement when an external z-axis acceleration is applied, and capacitance change due to the vertical displacement of the comb is detected by charge-to-voltage converter. The signal-to-noise ratio of the modulated and demodulated output signal is 80 dB and 76.5 dB, respectively. The noise equivalent input acceleration resolution of the modulated and demodulated output signal is calculated to be $500{\mu}g$ and $748{\mu}g$. The scale factor and linearity of the accelerometer are measured to be 1.1 mV/g and 1.18% FSO, respectively.

The Silylation Photo Resist Process and the Enhanced-Inductively Coupled Plasma (E-ICP) (Silylation Photo resist 공정과 Enhanced-Inductively Coupled Plasma (E-ICP))

  • 정재성;박세근;오범환
    • Proceedings of the IEEK Conference
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    • 1999.06a
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    • pp.922-925
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    • 1999
  • The Silylation photo-resist etch process was tested by Enhanced-ICP dry etcher. The comparison of the two process results of micro pattern etching with 0.25${\mu}{\textrm}{m}$ CD by E-ICP and ICP reveals that E-ICP has better quality than ICP The etch rate and the microloading effect was improved in E-ICP Especially, the problem of the lateral etch was improved in E-ICP.

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A Study on the Fabrication of the Lateral Accelerometer using SOG(Silicon On Glass) Process (SOG(Silicon On Glass)공정을 이용한 수평형 미소가속도계의 제작에 관한 연구)

  • Choi, Bum-Kyoo;Chang, Tae-Ha;Lee, Chang-Kil;Jung, Kyu-Dong;Kim, Jong-Pal
    • Journal of Sensor Science and Technology
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    • v.13 no.6
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    • pp.430-435
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    • 2004
  • The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

Estimation of Stellate Ganglion Block Injection Point Using the Cricoid Cartilage as Landmark Through X-ray Review

  • Park, Jeong-Soo;Kim, Ki-Jun;Lee, Youn-Woo;Yoon, Duck-Mi;Yoon, Kyung-Bong;Han, Min-Young;Choi, Jong-Bum
    • The Korean Journal of Pain
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    • v.24 no.3
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    • pp.141-145
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    • 2011
  • Background: Stellate ganglion block is usually performed at the transverse process of C6, because the vertebral artery is located anterior to the transverse process of C7. The purpose of this study is to estimate the location of the transverse process of C6 using the cricoid cartilage in the performance of stellate ganglion block. Methods: We reviewed cervical lateral neutral-flexion-extension views of 48 patients who visited our pain clinic between January and June of 2010. We drew a horizontal line at the surface of the cricoid cartilage in the neutral and extension views of cervical lateral x-rays. We then measured the change in the shortest distance from this horizontal line to the lowest point of the transverse process of C6 between the neutral and extension views. Results: There was a statistically significant difference in the shortest distance from the horizontal line at the surface of the cricoid cartilage to the lowest point of transverse process of C6 between neutral position and neck extension position in both males and females, and between males and females in both neutral position and neck extension position. The cricoid cartilage level was 4.8 mm lower in males and 14.4 mm higher in females than the lowest point of transverse process of C6 in neck extension position. Conclusions: Practitioners should recognize that the cricoid cartilage has cephalad movement in neck extension. In this way, the cricoid cartilage can be still useful as a landmark for stellate ganglion block.

Using a Kirschner wire as an internal splint at nasal fractures accompanied fracture of frontal process of maxilla or perpendicular plate of ethmoid (상악골 전두돌기 골절 및 사골 수직판 골절을 동반한 비골 골절에서 K 강선을 이용한 내고정)

  • Rho, Kyoung Hwan;Yoon, Eul Sik;Yoon, Byung Min;Dhong, Eun Sang
    • Archives of Plastic Surgery
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    • v.36 no.5
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    • pp.623-628
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    • 2009
  • Purpose: In cases where nasal fractures involve frontal process of maxilla or perpendicular plate of ethmoid, 4 - 5 days of nasal packing may not provide sufficient support for avoiding displacement after packing removal. Therefore a single Kirschner - wire(K - wire) is used as an internal splint when nasal fractures involve the above two areas. Methods: Thirty five patients during the last 3 practical years were treated with a K -wire pinning according to the anatomic locations of nasal fractures. We performed a retrospective study using 13 nasal fractures out of total 35 patients. Among 13 cases, 10 patients involved frontal process of maxilla, and 3 patients were diagnosed as bilateral nasal side wall fractures accompanied with fractures of perpendicular plate of ethmoid. One patient of the last three cases had been augmented with dorsal silicone implant long before the trauma. We analyzed the anteroposterior displacement of key stone area and the width between both lateral walls by comparing immediate postoperative radiographs with 2 month follow - ups. To reduce the errors, the same measurements were taken by two different inspectors, and the mean of each inspector's measurements was compared. Patient satisfaction was analyzed using a questionnaire regarding the esthetic and functional outcomes. Results: Ten patients underwent a longitudinal K - wire fixation in submucoperiosteal plane underneath the frontal process of maxilla. And three patients underwent a transverse K - wire fixation from the one side of lateral wall to the perpendicular plate of ethmoid and to the other side of lateral wall. The mean postoperative anteroposterior displacement of the key stone area measured by two inspectors were 1.84% and 3.06%; mean narrowing of bony pyramid were 1.33% and 1.48%, respectively. Subjective satisfaction scores regarding the esthetic appearance and the maintenance of nasal shape compared with immediate post - operative state with the long term ones were not different (p>0.05). Conclusion: K - wire pinning after closed reduction is a reliable and useful method for the treatment of nasal fractures involving frontal process of maxilla or perpendicular plate of ethmoid. This is because it achieves longer intranasal support after reduction. This method also leaves conspicuous external scar, and minimal soft - tissue injury.

Evaluation and Adjustment of Lateral Displacement of Complex-shaped RC Tall Buildings Considering the Displacement by Tilt Angle of Each Floor (층경사각에 의한 횡변위를 고려한 비정형 고층건물의 횡변위 평가/보정)

  • Kim, Yungon
    • Journal of the Korea Concrete Institute
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    • v.27 no.5
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    • pp.551-558
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    • 2015
  • Lateral displacement in the most complex-shaped tall buildings is caused by eccentric gravity loads which are induced by the difference in location between a center of mass and a center of stiffness. The lateral displacements obtained from analysis, using conventional procedures, are prone to overestimate the actual values because much of realignment efforts made during construction phase are ignored. In construction sequence analysis, the self-leveling of slab and the verticality of columns/walls could be considered at each construction stage. Moreover, the displacement compensation can be achieved by manual process such as re-centering - locating to global coordinates through surveying. Because the lateral displacement increases with the building height, it is necessary to set up adjustment plan through construction stage analysis in advance in order to result in displacements less than the allowable limits. Because analytical solution includes lots of assumptions, the pre-adjusting displacement should be reasonably controlled with considerations for the uncertainty due to these assumptions.

Validity of Paramedian Tangential Approach to L5-S1 Far-Lateral Lesions

  • Baek, Seung-Jin;Kim, Joo-Seung;Moon, Byung-Gwan;Lee, Seung-Jin;Kang, Hee-In
    • Journal of Korean Neurosurgical Society
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    • v.39 no.5
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    • pp.366-369
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    • 2006
  • Objective : There are various surgical approaches to far-lateral lesions in the L5-S1 intervertebral space. Of these is the validity of a paramedian tangential approach is being investigated in this study. Methods : A retrospective study was conducted on 25 patients who had been diagnosed as having a far-lateral L5-S1 disc herniations, osteophyte, costal process hypertrophy, and had undergone a paramedian tangential approach from November 1999 through December 2003. The degree of symptoms and improvement were compared via the visual analog pain scale, before and after surgery. Results : This study included 4 males and 21 females with a mean age of $62{\pm}11.8$ years old. The average follow-up period after surgery was $8.2{\pm}2.7$ months. The visual analog pain scale taken before surgery was $6.7{\pm}1.1$ points, while the post-surgical scale was $2.4{\pm}0.9$ points showing a significant degrease [p < 005]. There were no complications that developed during surgery. Conclusion : A paramedian tangential approach is less invasive in the soft tissue than that of the median approach. This approach may effectively reduce nerve root compression and expand intervertebral foramens, and is devoid of the risk of spinal instability after surgery. The authors suppose that a paramedian tangential approach is quite an effective technique to relive compression in the far-lateral L5-S1 intervertebral space.

Fabrication and Characteristics of Lateral Type Field Emitter Arrays

  • Lee, Jae-Hoon;Kwon, Ki-Rock;Lee, Myoung-Bok;Hahm, Sung-Ho;Park, Kyu-Man;Lee, Jung-Hee
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.2 no.2
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    • pp.93-101
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    • 2002
  • We have proposed and fabricated two lateral type field emission diodes, poly-Si emitter by utilizing the local oxidation of silicon (LOCOS) and GaN emitter using metal organic chemical vapor deposition (MOCVD) process. The fabricated poly-Si diode exhibited excellent electrical characteristics such as a very low turn-on voltage of 2 V and a high emission current of $300{\;}\bu\textrm{A}/tip$ at the anode-to-cathode voltage of 25 V. These superior field emission characteristics was speculated as a result of strong surface modification inducing a quasi-negative electron affinity and the increase of emitting sites due to local sharp protrusions by an appropriate activation treatment. In respect, two kinds of procedures were proposed for the fabrication of the lateral type GaN emitter: a selective etching method with electron cyclotron resonance-reactive ion etching (ECR-RIE) or a simple selective growth by utilizing $Si_3N_4$ film as a masking layer. The fabricated device using the ECR-RIE exhibited electrical characteristics such as a turn-on voltage of 35 V for $7\bu\textrm{m}$ gap and an emission current of~580 nA/l0tips at anode-to-cathode voltage of 100 V. These new field emission characteristics of GaN tips are believed to be due to a low electron affinity as well as the shorter inter-electrode distance. Compared to lateral type GaN field emission diode using ECR-RIE, re-grown GaN emitters shows sharper shape tips and shorter inter-electrode distance.

Crystallization of amorphous silicon films below $450^{\circ}C$ by FALC ($450^{\circ}C$ 이하에서 FALC 공정에 의한 비정질 실리콘의 결정화)

  • 박경완;유정은;최덕균
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.12 no.4
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    • pp.210-214
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    • 2002
  • The crystallization behavior of amorphous silicon (a-Si) film was investigated by using Cu-field aided lateral crystallization (Cu-FALC) process below $450^{\circ}C$. The lateral crystallization was induced from the Cu deposited region outside of pattern toward the Cu-free region inside of the pattern by applying an electric field during heat treatment. As expected, the lateral crystallization toward Cu-free region proceeded from negative toward positive electrode side. The occurrence of Cu-FALC phenomenon was interpreted in terms of dominant diffusing species in the reaction between Cu and Si. Even at the annealing temperature of $350^{\circ}C$, the large dendrite-shaped branches were formed in the crystallized region and the polarity in the lateral crystallization was clearly observed. Consequently, we could successfully crystallize the a-Si at the temperature as low as $350^{\circ}C$ by an electric field of 30 V/cm with fast crystallization velocity of 12 $\mu$m/h.

Analysis of Lateral Behavior of Steel Pile embedded in Basalt (암반에 근입된 강관말뚝의 수평방향 지지거동 연구)

  • Kim, Khi-Woong;Park, Jeong-Jun;Kim, Jin-Woo
    • Journal of the Korean Geosynthetics Society
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    • v.15 no.1
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    • pp.1-10
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    • 2016
  • Recently, offshore wind farms are increasingly expected, because there are huge resource and large site in offshore. Jeju island has optimum condition for constructing a wind energy farm. Unlike the mainland, Jeju island has stratified structure distribution between rock layers sediments due to volcanic activation. In these case, it can be occur engineering problems in whole structures as well as the safety of foundation as the thickness and distribution of sediment under top rock layer can not support sufficiently the structure. In this study, field lateral load test of the pile for analyzing lateral behavior of the offshore wind turbine which is embedded in basalt. After calculating the subgrade resistance and the horizontal deflection from the measured strain to derive p-y curve from the lateral load test results, the subgrade resistance amplifies the error in the process of differentiation and the error of piecewise polynomial curve fitting is the smallest. In order to calculate the horizontal deflection from the measured strain, the six-order polynomial was used.