• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.29 no.12
• /
• pp.28-32
• /
• 2015

In this work, we reported fabrication of sealing the glass substrate using laser treatment at low temperature for electrochemical luminescence (ECL) cell. The laser treatment at temperature is using laser diode. The glass substrate sealing by laser treatment tested at 3-10W, 2-5 mm/s for build and tested. The sealing laser treatment method will allow associate coordination between the two glass substrate was enclosed. The effect of laser treatment to sealing the glass substrate was found to have cracks and air gap at best thickness of about 550-600 im for condition 3 W, 3 mm/s. The surface of sealing was roughness which was not influent to electrodes It can reduce the cracks, crevices and air gaps as well, improves the performance viscosity in butter bus bar electrodes. Therefore, it is more effective viscosity between two FTO glasses substrate.

• Journal of the Korean Society for Precision Engineering
• /
• v.30 no.4
• /
• pp.403-408
• /
• 2013

In this paper, the characteristics of ablation processing of the eagle glass by pico-second laser are investigated. The laser ablation is used to process micro forms on materials. The ablation causes little thermal effect and little burr on the surface of eagle glass. In order to examine the characteristics of panic cracks, experiments are conducted under various cutting conditions such as a frequency of 600 kHz, laser powers, scan speeds and number of scan(NS). To minimize the panic cracks, the specimens are heated at $30^{\circ}C$, $45^{\circ}C$, and $60^{\circ}C$ for ten minutes respectively and then they are broken by hands. Laser powers, NS and scan speeds have an effect on glass cutting results. The ablation depths increase with an increase in the laser power and NS whereas the panic cracks decrease with an increase in scan speed. The high temperature on processed specimens reduces the panic cracks and makes good results of laser cutting. The optimal condition for eagle glass laser cutting is found to be at 30 W of laser power, 3 mm/s of scan speed and 500 of NS, respectively.

• Journal of the Korean Ceramic Society
• /
• v.52 no.2
• /
• pp.119-122
• /
• 2015

Laser sealing with glass frits appears a promising technology for sealing various electronic devices (e.g., solar cells, displays) due to its several advantages. The purpose of this study is to understand the relationship between the composition of glasses and their laser-heating conditions. To allow glass to be sealed using laser heating, CuO was added to two different glass systems, in different amounts. The optical absorptivity of the glass samples was related directly to their CuO content. The laser-heating temperature and the CuO content exhibited a proportional relationship. Furthermore, the heating temperature increased linearly with the laser power used. From these results, we could determine the appropriate laser-heating conditions and CuO content for sealing electronic devices using laser-sealing technology.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.3
• /
• pp.382-386
• /
• 2012

A femtosecond laser with 775nm central wavelength and 150 fs of temporal pulse width was used for multi layered glass cutting applications. Ultrashort pulse was effectively used for clean glass cutting with $50{\mu}m$ depth and minimum cutting width. Laser beam was split to two stages and focused on the top surfaces of each layer. Ablation threshold of used glass was measured to be $2.59J/cm^2$. In experiments, 200mW laser power and 1mm/s scanning speed was used for preliminary experiment. Air gap was the major defect occurring parameter and laser power was less sensitive to glass cutting in the experiment. The maximum cutting speed was measured to be 60mm/min with 2kHz, however, Maximum 3m/min cutting speed can be achievable with a commercially available laser with 100kHz.

• Journal of the Semiconductor & Display Technology
• /
• v.18 no.3
• /
• pp.72-76
• /
• 2019

A Q-switched diode-pumped neodymium-doped yttrium vanadate (YVO₄, λ =1064nm) laser was used for the direct patterning of indium tin oxide (ITO) films on glass substrate. During the laser direct patterning, the laser beam was incident on the two different directions of glass substrate and the laser ablated patterns were compared and analyzed. At a low scanning speed of laser beam, the larger laser etched lines were obtained by laser beam incident in reverse side of glass substrate. On the contrary, at a higher scanning speed, the larger etched pattern sizes were found in case of the beam incidence from front side of glass substrate. Furthermore, it was impossible to find no ablated patterns in some laser beam conditions for the laser beam from reverse side at a much higher scanning speed and repetition rate of laser beam. The laser beam is expected to be transferred and scattered through the glass substrate and the laser beam energy is thought to be also dispersed and much more influenced by the overlapping of each laser beam spot.

• The Transactions of the Korean Institute of Electrical Engineers
• /
• v.36 no.10
• /
• pp.741-747
• /
• 1987

The high-power Nd:glass system with five-stage amplifier was designed and its amplification characteristics was studied for developing high-power Nd:glass laser system as an energy driver of inertial confinement fusion(ICF). In order to study the amplification characteristics of remporal and spacial Gaussian laser beam, the dependence of them on pumping efficiency and rod loss were studied and discussed. The output energy of this system using phosphate Nd glass rod(LHG-7,LHG-8) and silicate Nd glass rod(LSG-91H), respectively, was calculated by the computer simulation using Avizonis-Grotbeck and Frantz Nodvik equations. As results of this simulation, it was found that the shorter the risetime of laser pulse, the larger the amplification factor and that the larger peak value of laser pulse, the lower the amplification factor. The output inergies of 179J, 344J, and 7J were obtained by the designed five-stage amplified high-power Nd:glass laser system using glass rods of LHG-7,LHG-8, and LSG-91H, respectively. From the results it was found that the laser system using the LHG-8 glass rod was the most excellent one among the systems and the cross section for stimulated emission of the gain coefficient was essentially important parameter for the amplification characteristics.

• Laser Solutions
• /
• v.9 no.1
• /
• pp.9-16
• /
• 2006

Glass is one of brittle materials. Generally, brittle material is weak for tensile stress but strong for compression stress. Laser breaking of glass used this brittle characteristics. Laser breaking of glass was simulated to optimize breaking condition by using commercial FEM code MARC which is applicable to thermo-mechanical coupling analysis. Various shapes of heat sources were applied to the analysis and the distance between heating and cooling source were varied for each simulation. The shapes of heat sources were circle, single and double ellipse and the distance was varied from 0mm to 30mm. Moving heat sources were designed on the basis of experimental condition. As a result, double elliptic shape of heat source was the most suitable among them in laser breaking of glass. And it should be useful to determine optimal condition of laser breaking for glass.

• Laser Solutions
• /
• v.4 no.3
• /
• pp.40-44
• /
• 2001

Microbump formation during CO$_2$ laser texturing of glass substrates is examined in this paper. Experimental results show that different bump shapes (dome-shaped, with a central dimple, and with a peripheral rim) are generated depending on the laser fluence. A theoretical model for the process is suggested based on thermoelastic behavior but limited only to the dome-shaped bump. The dimensions (maximum height and base area) of the bump shows a logarithmic dependence on laser fluence as expected from the theory. Numerical computation reveals that the effect of thermal diffusion is not negligible for relatively long laser pulses.

• Korean Journal of Optics and Photonics
• /
• v.3 no.4
• /
• pp.227-233
• /
• 1992

The simulation code was developed for the development of the split-disk geometry glass amplifier, which could design the laser apparatus and analyze the properties of the laser system. The flashlamp emission energy at the short wavelength region must be reduced, while maintaining a current density between 2000 and 4000 A/$\textrm{cm}^{2}$, in order to reduce the thermal loading in the laser glass and to raise the coupling efficiency between the emission spectrum of the flashlamps and the absorption spectrum of the laser glass. By cutting the laser glass into three equal pieces, the temperature rise in the laser glass dropped by 70% due to the efficient removal of the heat in the laser glass. It was found that the $Nd^{3+}$ doping rate of each laser glass should be properly selected and the optimum value of the product of the absorption coefficient $\alpha$ and the thickness d of the laser glass is about 0.26 in the split-disk geometry.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.2
• /
• pp.53-57
• /
• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.