• 한국안전학회지
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• 제38권2호
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• pp.1-7
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• 2023

Fiber-metal laminates (FMLs) and polymer matrix composites (PMCs) are formed in various ways. In particular, FMLs in which aluminum is laminated as a reinforced layer are widely used. Also, glass fiber-reinforced plastics (GFRPs) are generally applied as fiber laminates. The bonding interface layer between the aluminum and fiber laminate exhibits low strength when subjected to hot press fabrication in the event of delamination fracture at the interface. This study presents a simple method for strengthening the interface bonding between the aluminum metal and GFRP layer of FML composites. The surfaces of the aluminum interface layer are engraved with three kinds of patterns by using the laser machine before the hot press works. Furthermore, the effect of the laser patterns on the interfacial toughness is investigated. The interfacial toughness was evaluated by the energy release rate (G) using an asymmetric double cantilever bending specimen (ADCB). From the experimental results, it was shown that the strip type pattern (STP) has the most proper pattern shape in GFRP/Al FML composites. Therefore, this will be considered a useful method for the safety assessment of FML composite structures.

• Design & Manufacturing
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• 제14권3호
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• pp.23-30
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• 2020

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2005년도 추계학술발표대회 논문집
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• pp.26-31
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• 2005

• Journal of Oral Medicine and Pain
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• 제31권3호
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• pp.211-221
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• 2006

목적 전통적 고속 회전식 절삭기구 또는 Er:YAG 레이저로 삭제된 상아질에, 두가지 다른 접착 시스템을 적용한 후, 축조한 컴포지트 레진의 미세인장결합강도를 비교하고, 다양한 Er:YAG 레이저 에너지가 미세인장결합강도에 미치는 영향을 평가한다. 재료 및 방법 40개의 제3대구치를 사용하여, 평평한 상아질면을 만든 후 8개의 군으로 나누어, 4가지 절삭방법 (고속 회전식 절삭기구, 2 W, 3 W, 4 W 출력의 Er:YAG 레이저) 중 한 가지로 삭제하고, 2가지 접착 시스템 (Scotchbond Multipurpose Plus, Clearfil SE bond) 중 한 가지로 처리하여 컴포지트 레진을 축조하였다. 24시간의 저장 후, 각 시편을 결합면에 수직으로 자르고, 미세인장결합강도를 측정하였다. 각 군의 미세인장결합강도는 평균$\pm$표준 편차로 표현하였고, 통계분석을 위해 two-way ANOVA, one-way ANOVA, student-Newman-Keuls' multiple comparison test, 그리고 t-test가 사용되었다. 결과 및 결론 1. 접착시스템과 관계없이, 절삭방법에 따른 미세인장결합강도의 유의한 차이가 있었고, 높은 순서대로 나열하면 다음과 같다: 3 W, 2 W, Bur, 4 W (p<0.001). 2. 절삭방법과 관계없이, Scotchbond Multipurpose Plus로 처리한 군이 Clearfil SE bond로 처리한 군보다 유의하게 높은 미세인장결합강도를 나타냈다 (p<0.001). 3. Scotchbond Multipurpose Plus로 처리한 군 중에서, 3 W 레이저 절삭군이 가장 높은 미세인장결합강도를 나타냈고, 다음이 Bur, 2 W, 4 W 절삭군 순이었다 (p<0.001). 4. Clearfil SE bond로 처리한 군 중에서 3 W 레이저 절삭군이 가장 높은 미세인장결합강도를 나타냈고, 다음이 2 W, 4 W, Bur 절삭군 순이었다 (p<0.001). 5. 두 가지 접착 시스템 모두에서, 레이저로 절삭한 군의 미세인장결합강도의 차이가 있었고, 높은 순서대로 나열하면 3 W, 2 W, 4 W 순이었다 (p<0.001). :상아질에 접착된 컴포지트 레진의 미세인장결합강도는 절삭방법과 접착시스템의 상호작용에 의해 유의한 영향을 받았다. 임상에서 레진 수복시, 2 W-3 W 범위내로 Er:YAG laser를 사용한다면 전통적 핸드피스 못지않게 수복물의 우수한 결합강도를 얻을 수 있다. 특히 시술시간의 단축, 과도한 산부식에 따른 부작용의 예방을 위해 Clearfil SE bond를 포함한 self etching system을 사용하고자 한다면 bur보다 Er:YAG laser를 이용한 삭제방법이 더 유용한 결합력을 제공할 것이다.

• 한국전기전자재료학회논문지
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• 제33권5호
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• pp.367-372
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• 2020

As packaging processes for atomic gyroscope vapor cells, the glass tube tip-off process, anodic bonding, and paste sealing have been widely studied. However, there are stability issues in the alkali metal which are caused by impurity elements and leakage during high-temperature processes. In this study, we investigated the applicability of a vapor cell low-temperature packaging process by depositing Au on a Pyrex cell in addition to forming an Au-Sn thin film on a cap to cover the cell, followed by laser irradiation of the Au/Au-Sn interface. The mechanism of the thin film bonding was evaluated by XRD, while the packaging reliability of an Ne gas-filled vapor cell was characterized by variation of plasma discharge behavior with time. Furthermore, we confirmed that the Rb alkaline metal inside the vapor cell showed no color change, indicating no oxidation occurred during the process.

• 전자공학회논문지A
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• 제33A권2호
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• pp.148-162
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• 1996

Bonding wires for high frequency device packaging have dominant parasitic inductances which limit the performance of semiconductor lasers. In this paper, the inductance sof bonding wires are claculated by the method of moments with incorporation of ohmic loss, and the wideband modulation characteristics are analyzed for ddifferent wire lengths and structures. We observed the modulation bandwidth for 1mm-length bonding wire lengths and structures. We observed the modulation bandwidth for 1mm-length bonding wire is 7 GHz wider than that for 2mm-length bonding wire. We also observed th estatic inductance calculation results in dispersive deviation of the parasitic inductance and the modulation characteristics from the wideband moment methods calculations. The angled bonding wire has much less parasitic inductance and improves the modulation bandwidth more than 6 GHz. This calculation resutls an be widely used for designing and packaging of high-speed semiconductor device.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• 한국광학회:학술대회논문집
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• 한국광학회 2004년도 제15회 정기총회 및 동계학술발표회
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• pp.102-103
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• 2004

• 한국진공학회지
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• 제5권1호
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• pp.1-5
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• 1996

Noncrystalline films of diamond-like carbon (DLC) have been prepared by laser ablation technique at room temperature. A Q-switched Nd-YAG laser beam with wavelength of 1064 nm and pulse duration of 10 ns was focused onto a graphite target with power densities of about $10^9 W/\textrm{cm}^2$. The physical properties of the resulting films were analyzed with density, hardness, and resistivity measurements. The surface and bonding structure were investigated by atomic force microscopy (AFM), Raman spectroscopy, electron energy loss spectroscopy (EELS).

• 한국기계가공학회지
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• 제20권2호
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• pp.51-57
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• 2021

The quality of the ceramic sintered coating on a metal surface through laser surface treatment is affected by the laser irradiation pattern. Depending on the laser irradiation pattern, the amount of residual stress and heat applied or accumulated on the surface increases or decreases, affecting the thickness attained in the ceramic sintering area. When the heat energy accumulated in the sintering area is high, the ceramic and the metal alloy melt and sufficiently mix to form a homogeneous and thick bonding interface. In this study, the thermal energy accumulation in the region sintered with zirconia was controlled using four types of laser processing patterns. The thickness of the diffusion region is analyzed by laser-induced breakdown spectroscopy of Mg-ZrO2 generated by laser sintering zirconia powder on the magnesium alloy surface. On the basis of the analysis of the Mg and Zr present in the sintered region through LIBS, the effect of the irradiation pattern on the sintering quality is confirmed by comparing and analyzing the heat and mass transfer tendency of the diffusion layer and the degree of diffusion according to the irradiation pattern. The derived diffusion coefficients differed by up to 9.8 times for each laser scanning pattern.