• Journal of the Korean Vacuum Society
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• v.7 no.s1
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• pp.118-122
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• 1998

$Al_2O_x$(0$Al_2O_3$ gradient coatings were formed by evaporating pure aluminium(99.9%) in $O_2$ environment with an IBAD facility, 12keV $Ar^+$ was used to irradiate the coatings simultaneously during the deposition. Sample's composition and depth profile were analysed by RBS and AES measurement, and their microhardness and porosity property were also measured in the experiment. Results show that, the oxygen concentration in the deposited coatings has a nearly linear relationship with the inputting gas flow before $O_2$ partial pressure in the target chamber reaches $1.2\times10^{-3}$ mbar under which stoichiometric $Al_2O_3$ could be formed; and sample's microhardness and porosity property is affected significantly by the oxygen concentration in the coatings.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1992.05a
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• pp.86-90
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• 1992

We have studied the characteristics of n-and p-channel FETs with submicron channel length fabricated by twin-well process. Threshold voltage variation and potential distribution with channel ion implantation conditions and impurity profile of n-and p-channel region wee simulated using SUPREM-II and MINIMOS 4.0 simulater, P-channel FET had buried-channel in the depth of 0.15 $\mu\textrm{m}$ from surface by counter-doped boron ion implantation for threshold voltage adjustment. As a result of device measurement, we have obtained good drain saturation characteristics for 3.3 [V] opreation, minimized short channel effect with threshold voltage shift below 0.2[V], high punchthrough and breakdown voltage above 10[V] and low subthreshold value.

• Bulletin of the Korean Chemical Society
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• v.11 no.6
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• pp.487-493
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• 1990

A complete potential profile of an electrical double layer is calculated from a distribution function of charged particles based upon a model where the effect of a charged electrode and the finite size of ion are explicitly included. Electrons which are distributed on the electrode surface are assumed not to penetrate the electrode/electrolyte boundary. Formation of the constant density regions and their effects on potential and the electrical double layer capacitances are studied in great detail. The distribution of surface electrons as well as the constant density regions are found to be essential in characterizing the electrical double layer. The introduction of the ion size into the prior electrical double layer model of an ideally polarizable electrode/point charged electrolyte system, shows a great improvement in its characteristics mostly at negative potential region.

• Journal of the Korean Vacuum Society
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• v.4 no.S2
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• pp.90-94
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• 1995

Defects introduced by Si, Ge preamorphization and their effects on the dopant diffusion and electrical characteristics. Good crystalline quality are obtained after the annealing of Ge ion double implanted samples. The defect clusters under the a/c interface are expected to extend up to the deep in the Si ion implanted samples. The dislocation loops near the junction absorb the interstitial Si atoms resolving from the defect cluster and result in the prevention of enhanced boron diffusion near the tail region of boron profile and show good reverse current charactristics.

• Journal of the Korean institute of surface engineering
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• v.34 no.5
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• pp.516-521
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• 2001

Dry etching of Si wafer and $SiO_2$ layers was performed using He/Cl$_2$ mixture plasma by diode-type reactive ion etcher (RIE) system. For Si etching, the Cl molecules react with the Si molecules on the surface and become chemically stable, indicating that the reactants need energetic ion bombardment. During the ion assisted desorption, energetic ions would damage the photoresist (PR) and produce the bad etch Si-profile. Moreover, we have examined the characteristics of the Cl-Si reaction system, and developed the new fabrication procedures with a $Cl_2$/He mixture for Si and $SiO_2$-etching. The developed novel fabrication procedure allows the RIE to be unexpensive and useful a Si deep etching system. Since the etch rate was proved to increase linearly with fHe and the selectivity of Si to $SiO_2$ etch rate was observed to be inversely proportional to fHe.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.6
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• pp.37-45
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• 1998

In this paper, we report the first three-dimensional simulation result of the transient enhanced diffusion(TED) of dopants in the ion-implanted silicon by employing our 3D semiconductor process simulator, INPROS system. In order to simulate three-dimensional TED redistribution of dopants in silicon, the dopant distributions after the ion implantation was calculated by Monte Carlo(MC) method, followed by finite element(FE) numerical solver for thermal annealing. Excellent agreement between the simulated 3D profile and the SIMS data has been obtained for ion-implanted arsenic and phosphorus after annealing the boron marker layer at 75$0^{\circ}C$ for 2 hours. Our three-dimensional TED simulation could successfully explain the reverse short channel effect(RSCE) by taking the 3D point defect distribution into account. A coupled TED simulation and device simulation allows reverse short channel effect on threshold to be accurately predicted.

• The Transactions of the Korean Institute of Power Electronics
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• v.18 no.1
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• pp.26-36
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• 2013

This paper presents a simple and cost-effective stand-alone rapid battery charging system of 30kW for electric vehicles. The proposed system mainly consists of active front-end rectifier of neutral point clamped 3-level type and non-isolated bi-directional dc-dc converter of multi-phase interleaved half-bridge topology. The charging system is designed to operate for both lithium-polymer and lithium-ion batteries. The complete charging sequence is made up of three sub-interval operating modes; pre-charge mode, constant-current mode, and constant-voltage mode. The pre-charge mode employs the stair-case shaped current profile to accomplish shorter charging time while maintaining the reliable operation of the battery. The proposed system is specified to reach the full-charge state within less than 16min for the battery capacity of 8kWh by supplying the charging current of 78A. Owing to the simple and compact power conversion scheme, the proposed solution has superior module-friendly mechanical structure which is absolutely required to realize flexible power expansion capability in a very high-current rapid charging system.

• Journal of the Korean Vacuum Society
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• v.12 no.3
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• pp.162-167
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• 2003

To find the concentration according to the depth-direction of ions implanted in the sample, with sputtering of the sample surface, one needs the depth profiling of ion implanted in the sample. On measuring of depth profiling, the sputtering rate to affect depth direction, is calculated by SRIM simulation. When ion is implanted in the sample, the atomic density of the sample rises up a little, and it alters sputtering yield. This alteration then causes differences of sputtering rate to affect depth-direction, on measuring of depth profiling. With the usage of SRIM Monte Carlo simulation code, one calculates sputtering rate, with sputtering yield by the alteration of atomic density of the sample through ion implantation. As a result, it goes to prove that its difference affects depth distribution, on measuring of depth profiling.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.4
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• pp.47-50
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• 2006

SCM415 alloy was implanted with nitrogen ions using plasma source ion implantation (PSII), at a dose range of $1{\times}10^{17}\;to\;6{\times}10^{17}\;N^+cm^{-2}$ Auger electron spectrometry (AES) was used to investigate the depth profile of the implanted layer. Friction and wear tests were carried out on a block-on-ring wear tester. Scanning electron microscopy (SEM) was used to observe the micro-morphology of the worn surface. The results revealed that after being implanted with nitrogen ions, the frictional coefficient of the surface layer decreased, and the wear resistance increased with the nitrogen dose. The tribological mechanism was mainly adhesive, and the adhesive wear tended to become weaker oxidative wear with the increase in the nitrogen dose. The effects were mainly attributed to the formation of a hard nitride precipitate and a supersaturated solid solution of nitrogen in the surface layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.21-24
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• 2000

Ferroelectric YMnO$_3$ thin films are excellent dielectric materials for high integrated ferroelectric random access memory (FRAM) with metal-ferroelectric-silicon field effect transistor (MFSFET) structure. In this study, YMnO$_3$ thin films were etched with C1$_2$/Ar gas chemistries in inductively coupled plasma (ICP). The maximum etch rate of YMnO$_3$ thin films is 285 $\AA$/min under C1$_2$/Ar of 10/0, 600 W/-200 V and 15 mTorr. The selectivities of YMnO$_3$ over CeO$_2$ and $Y_2$O$_3$ are 2.85, 1.72, respectively. The results of x-ray photoelectron spectroscopy (XPS) reflect that Y is removed dominantly by chemical reaction between Y and Cl, while Mn is removed more effective by Ar ion bombardment than chemical reaction. The results of secondary ion mass spectrometer (SIMS) were equal to these of XPS. The etch profile of the etched YMnO$_3$ film is approximately 65$^{\circ}$and free of residues at the sidewall.