• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.125-125
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• 2015

Ti-Al-Cr-N thin layer was prepared on Fe-Si thin sheet by arc ion plating to improve corrosion and mechanical properties. The compositions ratios of Fe : Cr : Al : Ti : Si : N of the thin layers at $500^{\circ}C$ was 1.24 : 0.56 : 36.82 : 32.72 : 0.59 : 28.07 [wt.%], respectively. The higher arc ion plating temperature was, the higher corrosion resistance and nano-hardness were observed due to chromium content. Corrosion potential and corrosion rate in artificial sea water of the coating layer were in the range of $-39mV_{SHE}$ and $2mA/cm^2$, respectively. Passivity was not observed in the artificial sea water. Nano-hardnesses of the thin layers was increased by adding Cr from 23.6 to 25.8 [GPa]. The friction coefficients and fatigue limits of the layers were 0.388, 0.031, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.154-154
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• 1999

금속산화막은 전자부품 및 광학적 응용에 널리 사용되고 있다. 특히 알루미늄의 산화막은 유전체의 재료로 커패시터에 많이 사용되고 있다. 이러한 알루미늄 산화막을 plasma를 이용한 ion plating에 의해 형성하였다.Activated Reactive Evaporation은 화합물의 증착율을 높이는데 좋은 증착법이다. 이러한 증착법에는 reactive ion plating와 ion-assisted deposition 그리고 ion beam sputtering 등이 있다. 본 연구에서는 알루미늄 산화막을 증착시키기 위해 plasma를 이용한 electron-beam법을 사용하였다. Turbo molecular pump로 챔버 내의 진공을 약 10-7torr까지 낸린 후 5$\times$10-5torr까지 O2와 Ar을 주입시켰다. 각 기체의 분압은 RGA(residual gas analyzer)로 조사하여 일정하게 유지시켰다. plasma를 발생시키기 위해 filament에서 열전자를 방출시키고 1kV 정도의 electrode에 의해 가속시켜 이들 기체들과 반응시켜 plasma를 발생시켰다. 금속 알루미늄을 5kV정도의 고전압과 90mA의 전류로 electron beam에 의해 증발시켰다. 기판의 흡착율을 높ㅇ기 위해 기판에 500V로 bias 전압을 걸어 주었다. 증발된 금속 알루미늄 증기들이 plasmaso의 산소 이온들과 활성 반응을 이루어 알루미늄 기판 위에 Al2O3막을 형성하였다. 알루미늄 산화막을 분석하기 위해 XPS(X-ray Photoelectron Spectroscopy)로 화학적 조성을 조사하였는데, 알루미늄의 2p전자의 binding energy가 76.5eV로 측정되었다. 이는 대부분 증착된 알루미늄이 산소 이온과 반응하여 Al2O3로 형성된 것이다. SEM(Scanning electron Microscopy)과 AFM(Atomim Force microscopy)으로 증착박 표면의 topology와 roughness를 관찰하였다. grain의 크기는 10nm에서 150nm이었고 증착막의 roughness는 4.2nm이었다. 그리고 이 산화막에 전극을 형성하여 유전 상수와 손실률 등을 측정하였다. 이와 같이 plasma를 이용한 3-beam에 의한 증착은 금속의 산화막을 얻는데 유용한 기술로 광학 재료 및 유전 재료의 개발 및 연구에 많이 사용될 것으로 기대된다.

• Journal of the Korean institute of surface engineering
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• v.55 no.2
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• pp.120-132
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• 2022

In the non-cyanide-based electroless Au plating solution using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent, analysis of each component constituting the plating solution is essential for the analysis of the reaction mechanism. And component analysis in the plating solution is important for monitoring component changes in the plating process and optimizing the management method. Capillary Electrophoresis (CE) method is rapid, sensitive and quantitative and could be readily applied to analysis of Auⁿ⁺ ion, complexing agent and reducing agent in electroless Au plating solution. In this study, the capillary electrophoresis method was used to analyze each component in the electroless Au plating solution in order to elucidate the complex bonding form and the plating mechanism of the non-cyanide-based electroless Au plating bath. The purpose of this study was to establish data for optimizing the monitoring and management method of plating solution components to improve the uniformity of precipitation and stability. As a result, it was confirmed that the analysis of thiomalic acid as a complexing agent and Auⁿ⁺ ions and the analysis of aminoethanethiol as a reducing agent were possible by capillary electrophoresis. In the newly developed non-cyanide-based electroless Au plating solution, it was confirmed that Auⁿ⁺ ions exist in the form of Au⁺ having a charge of +1, and that thiomalic acid and Au⁺ are combined in a molar ratio of 2 : 1. In addition, it was confirmed that aminoethanethiol can form a complex by combining with Au⁺ ions depending on conditions as well as acting as a reducing agent.

• Polymer(Korea)
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• v.27 no.1
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• pp.61-68
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• 2003

In this study, we have investigated the preparation of mixed bead and fiber type hybrid ion-exchanger for recovering nickel ion from plating rinse water. There was little dependence of adsorption capacity for nickel ion on the mixing ratio of resin type and fiber type of ion exchangers. However, it increased with increasing the resin content in the mixed bed. It was shown that the data Langmuir and Freundlich's adsorption isotherm model were well fitted to the linear. Affinity between the functional groups in the ion exchanger and nickel ion in the process was confirmed. The pressure drop decreased with increasing the number of stage in the multistage bed, but it increased with increasing the resin content in the mixing bed. The initial breakthrough time in the multistage bed was short due to the increase of number of stage in the continuous process. It was found that the final breakthrough time of the multistage bed was little changed. The breakthrough time decreased with increasing the amount of fibrous ion exchanger in the mixed bed. The maximum adsorption capacities of the mixed and multistage beds were 2.51 meq/g and 2.69 meq/g, respectively. The desorption time for the nickel ion with $1N H_2SO_4$ solution was lower than 10 minutes and the yield of desorption was greater than 98 percent.

• Proceedings of the Korean Vacuum Society Conference
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• 2001.02a
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• pp.176-176
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• 2001

• Proceedings of the Korean Ceranic Society Conference
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• 1986.12a
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• pp.269-286
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• 1986

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.96-97
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• 2003

• Clean Technology
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• v.9 no.2
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• pp.63-69
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• 2003

The metal finishing industry generates a variety of pollutants such as acidic or alkaline wastewater, chromic compounds, cyanide, heavy metals, and toxic materials. Especially, zinc plating process is one of the processes which cause serious environmental problems. In this study, we applied the proven optimum technology to important unit processes in terms of implement effects through the process diagnosis and analysis. This study aimed to improve the working environment and the environmental pollutions in zinc plating process.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.11-11
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• 2003

Electroplated hexavalent chromium coatings have been used in many technical applications since it was invented by G.J. Sargent in 1920. Because of the environmental problems and health risks associated with the use of hexavalent chromium, there has been an extensive search for alternative coatings with properties such as corrosion resistance and wear resistance, at a reasonable cost. However there is no single substitute that meets all the desirable performance characteristics of chromium. Advanced techniques, such as alloy plating, electroless plating, trivalent chromium plating, plasma and thermal spray coating, PVD and ion implantation, have been applied for replacing hexavalent chromium plating.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1589-1592
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• 1994

We developed the ion plating system, consisted of the Facing Target Magnetron Sputtering System and the r.f, electrode of the coil type, which was available to control the reactive and the adhesion between thin film and substrate, and studied about the discharge characteristics and the optimum condition in order to form the high quality thin film. The characteristics of discharge and plasma was measured as Double Probe and Electrostatic Retarding Grid Analyzer. The incident ion energy on the substrate was increased as the increasing r.f power, bias voltage. By the r.f electrode, the ionization rate of the sputtered particles was about 75%, and the mean incident ion energy depend on the value which was difference between the plasma potential and biased substrate potential.