• 제목/요약/키워드: ion beam sputtering

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이중 이온빔 스퍼터링 방식을 사용한 보조 이온빔의 Ar/O2가스 유량에 따른 Ta2O5 박막의 제조 및 특성분석 (Characteristics Analysis and Manufacture of Ta2O5 Thin Films Prepared by Dual Ion-beam Sputtering Deposition with Change of Ar/O2Gas Flow Rate of Assist Ion Beam)

  • 윤석규;김회경;김근영;김명진;이형만;이상현;황보창권;윤대호
    • 한국세라믹학회지
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    • 제40권12호
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    • pp.1165-1169
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    • 2003
  • 이중 이온빔 스퍼터링(Dual ion-beam sputtering)을 사용하여 보조이온건의 Ar/O$_2$가스유량 변화에 따라 Si-(III) 기판과 glass에 Ta$_2$O$_{5}$ 박막을 증착시켰다. 보조 이온총의 산소 가스량의 비가 감소함에 따라서 증착되는 Ta$_2$O$_{5}$ 박막의 성장속도는 감소하였으며, 굴절률은 $O_2$ 가스의 양이 0∼12sccm인 범위에서 2.09(at 1550nm)로 일정한 값을 나타내었다. Ar:O$_2$가 3: 12인 조건에서 화학양론 조성인 Ta$_2$O$_{5}$를 형성하였으며, 표면 거칠기도 가장 작은 값을 나타내었다.나타내었다.

FIB를 이용한 마이크로 플라즈마 전극 개발 (Development of Micro Plasma Electrode using Focused Ion Beam)

  • 최헌종;강은구;이석우;홍원표
    • 한국정밀공학회지
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    • 제22권5호
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    • pp.175-180
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    • 2005
  • The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. In this research, fabrication of micro plasma electrode was carried out using FIB. The one of problems of FIB-sputtering is the redeposition of material including Ga+ ion source during sputtering process. Therefore the effect of the redeposition was verified by EDX. And the micro plasma electrode of copper was fabricated by FIB.

Nano Patterning on Graphite by Ion-Beam Sputtering

  • Yoon, Sun Mi;Kim, J.S.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.214-214
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    • 2013
  • Ion beam sputtering (IBS) by collision of energetic ions at surfaces is one of the representative methods for physical self-assembly. It is in spotlight as an easy tool to make nano structures in various sizes and shapes by controlling physical variablesWe investigate nano patterning on graphite. We found well-ordered nano ripple patterns after sputtering under the oblique angle and mean wavelengths of these ripples could be controlled as ion fluence increases from sub-10 nm to 80 nm. Each nano ripple is terminated by nano buds, which look like a cotton bud. We also examined the formation of various patterns on graphite by sputtering during swinging the sample at a constant angular velocity that have been never reported.

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'아마데우스' 이온빔 나노 패터닝 소프트웨어와 나노 가공 특성 ('AMADEUS' Software for ion Beam Nano Patterning and Characteristics of Nano Fabrication)

  • 김흥배
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.322-325
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    • 2005
  • The shrinking critical dimensions of modern technology place a heavy requirement on optimizing feature shapes at the micro- and nano scale. In addition, the use of ion beams in the nano-scale world is greatly increased by technology development. Especially, Focused ion Beam (FIB) has a great potential to fabricate the device in nano-scale. Nevertheless, FIB has several limitations, surface swelling in low ion dose regime, precipitation of incident ions, and the re-deposition effect due to the sputtered atoms. In recent years, many approaches and research results show that the re-deposition effect is the most outstanding effect to overcome or reduce in fabrication of micro and nano devices. A 2D string based simulation software AMADEUS-2D $(\underline{A}dvanced\;\underline{M}odeling\;and\;\underline{D}esign\;\underline{E}nvironment\;for\;\underline{S}putter\;Processes)$ for ion milling and FIB direct fabrication has been developed. It is capable of simulating ion beam sputtering and re-deposition. In this paper, the 2D FIB simulation is demonstrated and the characteristics of ion beam induced direct fabrication is analyzed according to various parameters. Several examples, single pixel, multi scan box region, and re-deposited sidewall formation, are given.

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다구찌 기법을 이용한 FIB-Sputtering 가공 특성 분석 (Analysis on FIB-Sputtering Process using Taguchi Method)

  • 이석우;최병열;강은구;홍원표;최헌종
    • 한국공작기계학회논문집
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    • 제15권6호
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    • pp.71-75
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    • 2006
  • The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its usage in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. The target of this paper is the analysis of FIB sputtering process according to tilt angle, dwell time and overlap for application of 3D micro and pattern fabrication and to find the effective beam scanning conditions using Taguchi method. Therefore we make the conclusions that tilt angle is dominant parameter for sputtering yield. Burr size is reduced as tilt angle is higher.

MgO Sputtering in the AC-PDPs with Monte Carlo Methods

  • Gill, Doh-Hyun;Kim, Hyun-Sook;Joh, Dae-Guen;Kim, Young-Guon;Choi, Eun-Ha;Cho, Guang-Sup
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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    • pp.109-110
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    • 2000
  • Sputtering yield of MgO film in the AC-PDPs has been calculated by Monte Carlo simulation of ion scattering. In the ion energy range less than 50 eV, the sputtering yield is 4 ${\times}$ $10^{-4}$ for Xe ions and it is between 0.1 and 0.01 for He, Ne, and Ar ions. The erosion rate is estimated about $25{\AA}$ per hour for Xe ions in an actual PDP plasma for sustain and full white mode.

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이온빔 스퍼터링 방법으로 증착한 NiFe/Ag 박막의 확산 거동 (A Study on Diffusion Behavior in NiFe/Ag Bilayer Films deposited by ion Beam Sputtering Methods)

  • 지재범;이성래;문대원
    • 한국표면공학회지
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    • 제35권2호
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    • pp.107-112
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    • 2002
  • We have studied diffusion behavior of NiFe/Ag bilayer deposited by on silicon Ion Beam Sputtering methods. The diffusion behavior of NiFe and Ag in NiFe/Ag thin film is analyzed by Medium Energy Ion Scattering Spectroscopy. For samples without Ta underlayer, silicides such as Ni-Si or Fe-Si were formed at Si substrate and NiFe interface. In contrast, Ag predominantly diffused into the NiFe layer probably through their grain boundaries for Ta underlayered samples.

Phase Stability of Bi2212 and Bi2223 Thin Films Fabricated by Ion Beam Sputtering

  • Lee, Hee-Kab;Park, Yong-Pil;Kim, Jeong-Ho
    • 한국항해항만학회:학술대회논문집
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    • 한국항해항만학회 2000년도 추계학술대회논문집
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    • pp.108-111
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    • 2000
  • Bi2212 and Bi2223 thin films are fabricated by ion beam sputtering method. Three phases of Bi2201, Bi2212 and Bi2223 appear as stable ones in spite of the condition for thin film fabrication of Bi2212 and bi2223 compositions, depending on substrate temperature(T$\sub$sub/) and ozone pressure (PO$_3$). It is found out that these phases show similar T$\sub$sub/ and PO$_3$dependence, and that the stable regions of these phases are limited within very narrow temperature.

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The Effect of Ion-Beam Treatment on TiO2 Coatings Deposited on Polycarbonate Substrates

  • Park, Jung-Min;Lee, Jai-Yeoul;Lee, Hee-Young;Park, Jae-Bum
    • Transactions on Electrical and Electronic Materials
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    • 제11권6호
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    • pp.266-270
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    • 2010
  • The effect of an Ar plasma treatment on polycarbonate substrates was investigated using $TiO_2$ coatings produced by reactive ion-beam assisted sputtering. The typical pressure used during sputtering was about $10^{-4}$ Torr. After the Ar plasma treatment, the contact angle of a water droplet was reduced from $88^{\circ}$ to $52^{\circ}$ and then further decreased to $12^{\circ}$ with the addition of oxygen into the chamber. The surface of the polycarbonate substrate hanged from hydrophobic to hydrophilic with these treatments and revealed its changing nano-scale roughness. The $TiO_2$ films on the treated surface showed various colors and periodic ordering dependant on the film thickness due to optical interference.