• 마이크로전자및패키징학회지
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• 제14권1호
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• pp.39-47
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• 2007

폴리이미드 표면에 대한 습식 개질 전처리 조건에 따른 폴리이미드와 무전해 도금 Ni 박막사이의 계면파괴에너지를 $180^{\circ}$ 필 테스트를 통해 정량적으로 구하였다. KOH 처리시간이 1분인 경우 계면파괴에너지는 24.5 g/mm에서 5분 처리 시 33.3g/mm로 증가하였고, EDA처리 시간이 1분인 경우 31.6 g/mm에서, 5분 처리 시 22.3g/mm로 저하되었다. 이러한 습식 개질전처리 조건에 따른 폴리이미드 표면 거칠기 변화는 매우 작아서, 기계적 고착 효과는 계면파괴에너지 변화에 기여하지 못했음을 알 수 있다. KOH는 carboxyl기, EDA는 amine기를 폴리이미드 표면에 형성시켜 Ni과 강한 화학적 결합을 이루어, 폴리이미드 내부의 cohesive 박리거동을 보였다. 습식 개질전처리 조건에 따른 계면파괴에너지의 거동은 파면 부근에 형성된 O=C-O 결합과 매우 밀접한 연관성이 있는 것으로 판단된다.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.191-192
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• 2002

The scuffing failure is a critical problem in modern machine components, especially for the requirement of high efficiency and small size. In this study. scuffing experiments are conducted using Acoustic Emission(AE) measurement by an indirect sensing approach to detect scuffing failure. Using AE signals we con get and indication about the state of the friction processes, about the quality of solid and liquid layers on the contacting surface in real time. The FFT(Fast Fourier Transform)analyses of the AE signal are used to understand the interfacial interaction and the relationship between the AE signal and the state of contact is presented.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1993년도 추계학술대회 논문집
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• pp.656-659
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• 1993

The failure phenomenon of Dual Basalt Fibers Reinforced Epoxy Composites(DFC) under tensile load was studied using acoustic emission(AE) technique. AE amplitude and AE energy were mainly associated with the internal microscopic failure mechanism of DFC specimen, such as fiber fracture, matrix cracking, and fiber/matrix debonding. Fiber failures in the DFC specimens were distinguishable by showing the highest AE energy amplitude. They were dependant on the fiber diameters. Matrix cracking was determined from the relatively lower AE amplitude and AE energy, whereas fiber/matrix debonding could not be successfully isolated. AE method, however, can be applicable to the fragmentation method for interfacial strength(IFSS) in DFC specimens with adjusting the threshold to isolate fiber breaks from matrix crack and debonding.

• 한국안전학회지
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• 제13권4호
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• pp.131-136
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• 1998

The creep behavior and failure mechanism of the 30 vol% hot-pressed $SiC_t/Si_3N_4$ ceramic composite was experimentally investigated at $1200^{\circ}C$ and at various stress levels in air. The creep threshold stress for zero creep rate after 100 hr was found to be approximately 60 MPa. The stress exponent was estimated to be n~1, which suggests that fiber-reinforcement reduced the stress sensitivity of the HPSN matrix with the stress exponent of 2. The tertiary stage leading to creep rupture was found at 250 MPa but was very short. The microstructure of the crept specimen showed random fiber fracture and no matrix cracking. Interfacial debonding was absent.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2003년도 봄 학술발표회 논문집
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• pp.591-596
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• 2003

Many studies have dealt with strengthening by epoxy-bonded CFRP(Carbon Fiber Reinforced Polymer) composites. However, the effects of various influencing factors have not been clarified on the behavior of strengthened RC beams. This study was performed to verify the effects of strengthening due to various bond details of externally attached CFRP Composites. In this study, major test parameters include the bond type and the anchor type. The deflections, failure load, strain of reinforcing bar, concrete and CFRP are measured at each loading step. The failure mode and debonding loads(ultimate loads) are analysed from these measured data. According to the test results, all specimens are failed by intermediate flexural crack induced interfacial debonding.

• Computers and Concrete
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• 제33권2호
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• pp.147-162
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• 2024

This study presents a random-aggregate mesoscale model integrating the random distribution of the coarse aggerates and the damage mechanics of the mortar and interfacial transition zone (ITZ). This mesoscale model can generate the random distribution of the coarse aggregates according to the prescribed particle size distribution which enables the automation of the current methodology with different coarse aggregates' distribution. The main innovation of this work is to propose the "correction factor" to eliminate the dimensionally dependent mesh sensitivity of the concrete damaged plasticity (CDP) model. After implementing the correction factor through the user-defined subroutine in the randomly meshed mesoscale model, the predicted fracture resistance is in good agreement with the average experimental results of a series of geometrically similar single-edge-notched beams (SENB) concrete specimens. The simulated cracking pattern is also more realistic than the conventional concrete material models. The proposed random-aggregate mesoscale model hence demonstrates its validity in the application of concrete fracture failure and statistical size effect analysis.

• 한국재료학회지
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• 제3권6호
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• pp.668-677
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• 1993

Cu-P계, 4종의 Cu-P-Pn계 및 3종의 Cu-P-Sn-Ag계 용가재를 사용해 Ar분위기 하에서 1003 및 1033K로 1.2Ks동안 노브레이징한 ST304, STS430 및 저탄소강과 동 접합체들을 전단시험 및 조직시험하였다. 계면에서의 미세조직은 제 종류 즉 첫째,균열을 포함하는 반응층 둘째, 분산층 세째, 균열을 포함하는 반응층과 분산층으로 분류된다. 분산층만이 존재할때 40-60MPa 이상의 상대적으로 높은 전단강도가 얻어지며, 동모재파단을 일으킨다. 이 반응층이 형성되었을때는 반드시 균열이 형성되며, 낮은 전단강도를 나타내고 접합부파단을일으킨다. 이 반응층은 Fe-P계의 화합물이다. 이러한 미소조직 및 강도 경향은 용가재내 Sn의 존재 및 모재내 Ni(또한 Cr)의 존재 유무에 따라 변화한다.

• Journal of Welding and Joining
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• 제31권1호
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• pp.43-50
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• 2013

The spot welds of Transformation Induced Plasticity (TRIP) steels are prone to interfacial failure and narrow welding current range. Hard microstructures in weld metal and heat affected zone arenormally considered as one of the main reason to accelerate the interfacial failure mode. There fore, detailed observation of weld microstructure for TRIP steels should be made to ensure better weld quality. However, it is difficult to characterize the microstructure, which has similar color, size, and shape using the optical or electron microscopy. The atomic force microscope (AFM) can help to analyze microstructure by using different energy levels for different surface roughness. In this study, the microstructures of resistance spot welds for AHSS are analyzed by using AFM with measuring the differences in average surface roughness. It has been possible to identify the different phases and their topographic characteristics and to study their morphology using atomic force microscopy in resistance spot weld TRIP steels. The systematic topographic study for each region of weldments confirmed the presence of different microstructures with height of 350nm for martensite, 250nm for bainite, and 150nm for ferrite, respectively.

• Restorative Dentistry and Endodontics
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• 제28권3호
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• pp.222-231
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• 2003

The purpose of this study was to compare shear bond strength and interfacial pattern of composite bond-ed to dentin using self-etching adhesive systems. Sixty extracted human molars with exposed occlusal dentin were divided into four groups and bonded with four adhesives and composites. Single Bond/Filtek Z 350(SB), Tyrian SPE-One-Step Plus/Aelitefil(TY), Prompt L-Pop/Filtek Z 250(LP), and One-Up Bond F/palfique Toughwell(OU). The results of this study were as follows; 1 Shear bond strength for OU was significantly lower than that of other groups(p＜0.05). No significant difference was founded among SB, TY, and LP. 2. Failure modes to dentin showed adhesive and mixed for SB TY and LP, but them for OU showed adhesive in all spceimens. 3. Dentin-resin interface showed close adaptation for SB, TY, and LP, but it showed gap for OU. 4. The hybrid layers for TY, LP OU were thinner than that of SB. Adhesive layers were observed between composite and hybrid layer, which were 5 $\mu\textrm{m}$ thick for TY and 10 $\mu\textrm{m}$ thick for OU.

• 대한금속재료학회지
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• 제47권3호
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.