• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.95-103
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• 2021

Sn-58Bi-xRu composite solders were prepared by adding Ru nanoparticles to Sn-58Bi, a typical low-temperature solder, and the interfacial reaction and solder joint reliability were analyzed by reacting with Cu/OSP and ENIG surface treated PCB boards. The Cu₆Sn₅ IMC formed by the reaction with Cu/OSP had little change in thickness depending on the Ru content, and ductile fracture occurred inside the solder during the high-speed shear test without any significant change even after 100 hr aging. In reaction with ENIG, the Ni₃Sn₄ IMC thickness tended to decrease as the Ru content increased, and ENIG-specific brittle fracture was found in some specimens. Since Ru element is not found near the interface, it is judged not to be significantly involved in the interfacial reaction, and it is analyzed that it mainly exists together with the Bi phase.

• Composites Research
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• v.14 no.4
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• pp.15-26
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• 2001

Interfacial properties and microfailure degradation mechanisms of the bioabsorbable composites fur implant materials were investigated using micromechanical technique and nondestructive acoustic emission (AE). As hydrolysis time increased, the tensile strength, the modulus and the elongation of poly(ester-amide) (PEA) and bioactive glass fibers decreased, whereas these of chitosan fiber almost did not change. Interfacial shear strength (IFSS) between bioactive glass fiber and poly-L-lactide (PLLA) was much higher than PEA or chitosan fiber/PLLA systems using dual matrix composite (DMC) specimen. The decreasing rate of IFSS was the fastest in bioactive glass fiber/PLLA composites whereas that of chitosan fiber/PLLA composites was the slowest. AE amplitude and AE energy of PEA fiber decreased gradually, and their distributions became narrower than those in the initial state with hydrolysis time. In case of bioactive glass fiber, AE amplitude and AE energy in tensile failure were much higher than in compression. In addition, AE parameters at the initial state were much higher than those after degradation under both tensile and compressive tests. In this work, interfacial properties and microfailure degradation mechanisms can be important factors to control bioabsorbable composite performance.

• Textile Coloration and Finishing
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• v.30 no.2
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• pp.77-89
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• 2018

In the case of fiber/rubber composites for tire applications, the interfacial adhesion between fiber and rubber significantly affects the physical properties of the finished products. Generally, organic synthetic fibers used for tire cords are treated with resorcinol formaldehyde latex(RFL) primer on the surface of the fiber to improve the adhesion to rubber. Changes of adhesion between rubber and tire cords might weaken as temperature rises due to overheating of car engine and friction with road. In this study, the effects of temperature on the primer treated polyketone cord/rubber composites and the changes in interfacial adhesion were investigated. Polyketone cord/rubber composites were prepared after RFL solution treatment on the surface of polyketone fibers. After that, composites was thermally aged at different temperature conditions(60, 80, 100, $120^{\circ}C$) and times(1, 5, 10, 15days). The adhesion strength of polyketone cord/rubber composite treated with RFL primer was higher than untreated composite by more than 3 times. After heat aging, the adhesion strength of untreated polyketone cord/rubber composites increased while the RFL treated polyketone cord/rubber composites decreased somewhat.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.49-56
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• 2007

Effects of post-baking treatment conditions on the interfacial adhesion between electroless plated Ni and polyimide film were evaluated using $180^{\circ}C$ peel test. Measured peel strength values monotonically decrease from $38.6{\pm}1.1g/mm\;to\;26.8{\pm}2.2g/mm$ for the variations of post-baking treatment temperatures from $80^{\circ}C\;to\;180^{\circ}C$, respectively. Wet chemical treatment on the polyimide surface produces carboxyl and amide functional groups on the surface which is closely related to the change in interfacial adhesion between electroless Ni and polyimide films. It is speculated that interfacial adhesion seems to be controlled by carbonyl oxygen bonding near cohesive failure region during post-baking treatment.

• Nuclear Engineering and Technology
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• v.52 no.6
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• pp.1243-1251
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• 2020

Irradiation-induced damage of binderless nanoporous-isotropic graphite (NPIG) prepared by isostatic pressing of mesophase carbon microspheres for molten salt reactor was investigated by 3.0 MeV He⁺ irradiation at room temperature and high temperature of 600 ℃, and IG-110 was used as the comparation. SEM, TEM, X-ray diffraction and Raman spectrum are used to characterize the irradiation effect and the influence of temperature on graphite radiation damage. After irradiation at room temperature, the surface morphology is rougher, the increase of defect clusters makes atom flour bend, the layer spacing increases, and the catalytic graphitization phenomenon of NPIG is observed. However, the density of defects in high temperature environment decreases and other changes are not obvious. Mechanical properties also change due to changes in defects. In addition, SEM and Raman spectra of the cross section show that cracks appear in the depth range of the maximum irradiation dose, and the defect density increases with the increase of irradiation dose.

• Composites Research
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• v.16 no.2
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• pp.62-67
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• 2003

Interfacial properties and damage sensing for the carbon fiber/epoxy-amine terminated (AT)-polyetherimide (PEI) composite were performed using microdroplet test and electrical resistance measurements. As AT-PEI content increased, the fracture toughness of epoxy-AT-PEI matrix increased, and interfacial shear strength (IFSS) increased due to the improved fracture toughness by energy absorption mechanisms of AT-PEI phase. The microdroplet in the carbon fiber/neat epoxy composite showed brittle microfailure mode. At 15 phr AT-PEI content ductile microfailure mode appeared because of improved fracture toughness. After curing, the change in electrical resistance $\Delta\textrm{R}$) with increasing AT-PEI content increased gradually because of thermal shrinkage. Under cyclic stress, in the neat epoxy case the reaching time until same stress was faster and their slope was higher than those of 15 phr AT-PEI. The result obtained from electrical resistance measurements under curing process and reversible stress/strain was correspondence well with matrix toughness properties.

• Korean Journal of Metals and Materials
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• v.50 no.2
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• pp.136-145
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• 2012

Resistance spot welding of TRIP780 steels was investigated to enhance understanding of weld fracture mode after tensile shear testing (TST) and L-shape tensile testing (LTT). The main failure mode for spot welds of TRIP780 steels was partial interfacial fracture (PIF). Although PIF does not satisfy the minimum button diameter (4${\surd}$t) for acceptable welds, it shows enough load carrying capacity of resistance spot welds for advanced high strength steels. In the analysis of displacement controlled L-shape tensile test results, cracks initiated at the notch of the faying surface and propagated through the interface of weldments, and finally, cracks change path into the sheet thickness direction. Use of the ductility ratio and CE analysis suggested that the occurrence of PIF is closely related to high hardness and brittle welds, which are caused by fast cooling rates and high chemical compositions of TRIP steels. Analysis of the hold time and weld time in a welding schedule demonstrated that careful control of the cooling rate and the size of a weld nugget and the HAZ zone can reduce the occurrence of PIF, which leads to sound welds with button fractures (BFs).

• Composites Research
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• v.21 no.4
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• pp.15-21
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• 2008

Interfacial shear strength between epoxy and carbon fiber was analyzed utilizing a hemi-spherical microbond specimens adhered onto single carbon fiber. The hemi-spherical microbond specimen showed high regression coefficient and small standard deviation in the measurement of interfacial strength as compared with a droplet and an inverse hemi-spherical one. This seemed to be caused by the reduced meniscus effects and the reduced stress concentration In the region contacting with a pin-hole loading device. Finite element analysis showed that the stress distributions along the fiber/matrix interface in the hemi-spherical specimen had a stable shear stress distribution along the interface without any stress mode change. The experimental data was also different according to the kinds of loading device such as the microvise-tip and the pin-holed plate.

• Journal of Mechanical Science and Technology
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• v.16 no.11
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• pp.1477-1484
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• 2002

Various characteristics of a thin liquid film in its vapor-phase are investigated using the molecular dynamics technique. Local distributions of the temperature, density, normal and tangential pressure components, and stress are calculated for various film thicknesses and temperature levels. Distributions of local stresses change considerably with respect to film thicknesses, and interracial regions on both sides of the film start to overlap with each other as the film becomes thinner. Integration of the local stresses, i.e., the surface tension, however, does not vary much regardless of the interfacial overlap. The minimum thickness of a liquid film before rupturing is estimated with respect to the calculation domain sizes and is compared with a simple theoretical relation.

• Journal of Industrial Technology
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• v.28 no.A
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• pp.195-198
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• 2008

Graphite and $MoS_2$ were added respectively to the Cu/Sn bond materials of the same composition as a lubricant in order to find out the effect of lubricants on the mechanical properties and the increase in density of the sintered products for microblades. The addition of $MoS_2$ as a lubricant was more beneficial to strength, fracture toughness, and hardness as well as densification than graphite. $MoS_2$ seemed to be more effective in reducing the friction between the metallic powders and die wall during hot pressing process. Due to the better wettability of MoS2 with bond metal alloy, less amount of interfacial defects which is detrimental to mechanical properties use observed.