• Polymer(Korea)
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• v.27 no.3
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• pp.189-194
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• 2003

Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermo setting composite with different curing processes were investigated using electro-micromechanical test. After curing, the residual stress was monitored by measurement of electrical resistance and then compared to various curing processes. In thermal curing case, matrix tensile strength, modulus and interfacial shear strength were higher than those of ultraviolet curing case. The shrinkage measured during thermal curing occurred significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient. The apparent modulus measured in the thermal curing indicated that mechanical and interfacial properties were highly improved. The reaching time to the same stress of thermal curing was faster than that of UV curing case.

• Carbon letters
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• v.4 no.2
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• pp.69-73
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• 2003

In this work, the effect of a direct oxyfluorination on surface and mechanical interfacial properties of PAN-based carbon fibers is investigated. The changes of surface functional groups and chemical composition of the oxyfluorinated carbon fibers are determined by FT-IR and XPS measurements, respectively. ILSS of the composites is also studied in terms of oxyfluorination conditions. As a result, FT-IR exhibits that the carboxyl/ester groups (C=O) at 1632 $cm^{-1} and hydroxyl group (O-H) at 3450 $cm^{-1} are observed in the oxyfluorinated carbon fibers. Especially, the oxyfluorinated carbon fibers have a higher O-H peak intensity than that of the fluorinated ones. XPS result also shows that the surface functional groups, including C-O, C=O, HO-C=O, and C-$F_x$ after oxyfluorination are formed on the carbon fiber surfaces, which are more efficient and reactive to undergo an interfacial reaction to matrix materials. Moreover, the formation of C-$F_x$ physical bonding of the carbon fibers with fluorine increases the surface polarity of the fibers, resulting in increasing ILSS of the composites. This is probably due to the improvement of interfacial adhesion between fibers and matrix resins.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.6
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• pp.578-586
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• 2010

This paper describes a theoretical model and acoustic analysis of hysteresis of contacting surfaces subject to compression pressure. Contacting surfaces known to be nonlinear and hysteretic is considered as a simple spring that has a complex stiffness connecting discontinuous displacements between two solid contact boundaries. Mathematical formulation for 1-D interfacial wave propagation between two contacting solids is developed using the complex spring model to derive the dispersion relation between the interface wave speed and the complex interfacial stiffness. Existence of the interface wave propagating along the hysteretic interface is studied in theory and discussed by investigating the solution to the dispersion equation. Unlike the linear interface without hysteresis, there can exist only one distinct mode of interface waves for the hysteretic interface, which is anti-symmetric motion. The anti-symmetric mode of interface wave propagates with the velocity faster than the Rayleigh surface wave but less than the shear wave depending on the interfacial stiffness. If the contacting surfaces are compressed so much that the linear interfacial stiffness is very high, the hysteretic stiffness does not affect the interface wave velocity. However, it has an effect on the speed of interface wave for a loosely contact surfaces with a relatively low linear stiffness. It is also found that the phase velocity of anti-symmetric wave mode converges to the shear wave velocity in despite of the linear stiffness value if the hysteretic stiffness approaches 0.5.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.873-877
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• 2007

In order to apply a complex multilayer chip LC filter, this study has estimated the interfacial reaction and coupling properties of dielectric materials $Pb(Fe_{1/2}Nb_{1/2})O_3$ and Ni-Zn-Cu ferrite materials through low-temperature co-sintering (LTCS). PFN powders were fabricated using double calcinated at $700^{\circ}C$ and then $850^{\circ}C$. While the perovskite phase rate was found to be 91 %, after heat treatment at $900^{\circ}C$ for 6h, the perovskite phase rate and density exhibited a value of 100 % and 7.46$g/cm^3$, respectively. The PFN/Ni-Zn-Cu ferrite, PFN/CUO (or $Pb_2Fe_2O_5$) and ferrite/CuO (or $Pb_2Fe_2O_5$) were mechanically coupled through interfacial reactions after the specimen was co-sintered at $900^{\circ}C$ for 6 h. No intermediate layer exists for the mutual coupling reaction. This result indicates the possibility of low-temperature co-sintering without any interfacial reaction layer for a multilayer chip LC filter.

• Advanced Composite Materials
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• v.16 no.4
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• pp.315-334
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• 2007

In the present study, chopped henequen natural fibers without and with surface modification by electron beam (E-beam) treatment were incorporated into a polypropylene matrix. Prior to composite fabrication, a bundle of raw henequen fibers were treated at various E-beam intensities from 10 kGy to 500 kGy. The effect of E-beam intensity on the interfacial, mechanical and thermal properties of randomly oriented henequen/polypropylene composites with the fiber contents of 40 vol% was investigated focusing on the interfacial shear strength, flexural and tensile properties, dynamic mechanical properties, thermal stability, and fracture behavior. Each characteristic of the material strongly depended on the E-beam intensity irradiated, showing an increasing or decreasing effect. The present study demonstrates that henequen fiber surfaces can be modified successfully with an appropriate dosage of electron beam and use of a low E-beam intensity of 10 kGy results in the improvement of the interfacial properties, flexural properties, tensile properties, dynamic mechanical properties and thermal stability of henequen/polypropylene composites.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.31-35
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• 2002

It is hard to expect excellent electrical, mechanical and chemical properties from most of the composite materials presently used as insulators due to insufficient wettability property caused by the difference of interfacial properties between the matrix material and the reinforcer. Therefore, various interfacial coupling agents have been developed to improve the interfacial properties of composite materials. But if the wettable coupling agents are used outdoor for a long time, change in quality takes place in the coupling agents themselves, bringing about deterioration of the properties of the composite materials. In this study, composite materials were put to dry interfacial treatment by use of plasma technology. It has been presented that the optimum parameters for the best wettability of the samples at the time of generation of plasma were oxygen atmosphere, 0.1 torr of system pressure, 100 W of discharge power, and 3 minutes of discharge time. Also, the surface resistance rate and dielectric property were improved.

• Journal of the Korean Society of Clothing and Textiles
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• v.24 no.7
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• pp.1065-1072
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• 2000

The molecular areas and the interfacial tension behavior of ten nonionic surfactants, i.e., Span 20 and Tween 20, 40, 60. 80, 21, 61, 81, 65, & 85 are tested to assay their effects on the wetting and liquid retention properties of hydrophilic and hydrophobic fibrous materials. The molecular areas at water/air interface are derived from Gibbs’adsorption equations. The following conclusions are drawn from the results: 1) Span 20 is efficient in lowering the interfacial tension and effective in adsorption at the water/air interface, resulting in the low interfacial tension at critical micelle concentration (${\gamma}$$_{CMC}$) and a small molecular area($\omega$), 2) when the hydrophiles of the surfactants are constant, $\omega$’s increase as hydrophobe carbon numbers of the surfactants increase, 3) when the hydrophobes are constant, ${\gamma}$$_{CMC}$’s and $\omega$’s increase as the hydrophile ethylene oxide units increase, indicating effectiveness and efficiency is parallel in this case, 4) the ethylene oxide unit length as a hydrophile has greater influence on u than the hydrophobe chain length.han the hydrophobe chain length.gth.

• Textile Coloration and Finishing
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• v.9 no.4
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• pp.47-53
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• 1997

To improve the interfacial bonding of carbon fiber-nylon 6 composite, carbon fiber(CF) were oxidized by nitric acid treatment, and two types of graft polymer(GP) of nylon 6-g-polyacrylamide (PAAm) -water dispersable GP(WDGP) and m-cresol solu ble GP(CSGP) were treated as coupling agents. Introduction of polar groups such as -COOH, -OH, etc, on the surface of the oxidized CF was confirmed by IR spectra. The stem polymer of nylon 6 in the coupling agent (GP) could be compatible with'matrix nylon 5, and the grafted branch of PAAm on GP could react to the polar groups on the oxidized CF in composite. The interfacial strength was measured by the transverse tensile test to the fiber direction for single CF embedded nylon 6 film especially prepared and by the pull-out test method. The interfacial strength of the composite reinforced with oxidized CF is greater than that reinforced with unoxidized CF. The interfacial strength of the composite was increased by treatment of coupling agents(GPs) considerably, and the increasing tendency by the WDGP is greater than that by the CSGP. The optimum conditions of coupling agent treatment are as follows: the concentration, adsorption tlme of GP, and curing temperature are 2%, 20 minutes, and $170^{\circ}$, respectively.

• Journal of Korea Foundry Society
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• v.17 no.3
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• pp.245-251
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• 1997

Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at $100^{\circ}C$, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of $Cu_6Sn_5$.

• Korean Journal of Materials Research
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• v.17 no.4
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• pp.215-221
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• 2007

The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.