• Journal of Surface Science and Engineering
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• v.27 no.5
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• pp.273-284
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• 1994

Thermal behavior of Cu-Cr thin alloy films has been investigated by SEM, AES, and TEM. Cu-Cr alloy films containing 3wt% Cr, 8wt% Cr have been sputter-deposited onto polyimide substrates and heat treated at $400^{\circ}C$ for 2hrs in the various atmosphere. Before heat treatment, Cu and Cr content in the film are uniform through the thickness and oxygen content in the film is negligible. Redistribution of Cr, Cu, and O in the film due to heat treatment depends on the Cr content and heat treatment atmoshpere. There kinds of thermal behavior are ascribed to the formation of surface and interface oxides as well as internal oxidation. Hillocks are observed on the surface of Cu-Cr alloy films which have been heat treated in N2. The hillocks are composed of large grainss of Cu.

• Journal of the Korean Society of Safety
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• v.30 no.1
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• pp.21-27
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• 2015

In this study, interfacial characteristics between SOFC and Ag paste as current collector was estimated in the high temperature environment. The Ag paste was used to connect the unit cell of SOFC strongly with interconnector and provide the electrical conductivity between them. To confirm electrical conductivity, Ag paste was treated in the furnace at $800^{\circ}C$ for 48 hours. The sheet resistance of Ag paste was measured to compare the resistance values before and after the heat treatment. Also, the four-point bending test was performed to measure the interfacial adhesion. The unit cell of SOFC and $SiO_2$ wafer were diced and then attached by Ag paste. The $SiO_2$ wafer had the center notch to initiate a crack from the tip of the notch. The modified stereomicroscope combined with the CCD camera and system for measuring the length was used to observe the fracture behavior. To compare the characteristics before heat treatment and after heat treatment, the specimen was exposed in the furnace at $800^{\circ}C$ for 48 hours and then the interfacial adhesion was evaluated. Finally, the interfacial adhesion energy quantitatively increases $1.78{\pm}0.07J/m^2$ to $4.9{\pm}0.87J/m^2$ between the cathode and Ag paste and also increase $2.9{\pm}0.47J/m^2$ to $5.12{\pm}1.01J/m^2$ between the anode and Ag paste through the high temperature. Therefore, it is expected that Ag paste as current collector was appropriate for improving the structural stability in the stacked SOFC system if the electrical conductivity was more increased.

• Journal of Adhesion and Interface
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• v.8 no.3
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• pp.16-23
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• 2007

Polyester fabrics and knits were corona treated with different current intensity (5, 10, 15, 20 A) and feeding speed (5, 10, 15 m/min). We confirmed the surface change of polyester fabrics and knits using scanning electron microscopy (SEM) and X-ray photoelectron spectrometer (XPS). And the change of physical properties through measuring the tensile strength, dry and wet bonding strength. Thermosetting reactive polyurethane hot melt adhesive was used in the adhesion of polyester fabrics and knits. Functional groups were introduced on PET fabrics and knits surface by treating the PET fabrics and knits in air atmosphere with corona discharge, and take placed unevenness, the result adhesion was improved. When consider both dry and wet bonding strength, we think that appropriate conditions in the PET fabrics corona treatment are feeding speed 10 m/min, current intensity 15 A and appropriate conditions in the mesh type PET knits corona treatment are feeding speed 10 m/min, current intensity above 10 A.

• Journal of Korea Foundry Society
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• v.22 no.2
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• pp.89-96
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• 2002

This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at $150^{\circ}C$. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of $150^{\circ}C$. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was $Cu_6Sn_5$ phase and aged specimens showed that intermetallic layer grew in proportion to $t^{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_6Sn_5$ phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the $Cu_6Sn_5$ layer during the aging treatment.

• Journal of Adhesion and Interface
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• v.20 no.2
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• pp.66-70
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• 2019

The surface of hydrophobic polypropylene (PP) fibers (spun-bonded fabric) was treated by an atmospheric plasma treatment method. These pre-treated hydrophilic PP fabrics were dip-coated in the aqueous poly(N-vinyl pyrrolidone) (PVP) solution. PVP layers on the surface of PP fiber were crosslinked by an irradiation of electron beam. The thickness of PVP hydrogels coated on the surface was easily controlled by changing the concentration of PVP in coating solution. The stepwise surface treatment, PVP coating, and hydrogel formation via electron beam irradiation were analyzed by the measurement of contact angle, scanning electron microscopy, and optical microscopy.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.45-50
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• 2014

Effects of wet chemical treatment and thermal cycle conditions on the quantitative interfacial adhesion energy of $Cu/SiN_x$ thin film interfaces were evaluated by 4-point bending test method. The test samples were cleaned by chemical treatment after Cu chemical-mechanical polishing (CMP). The thermal cycle test between Cu and $SiN_x$ capping layer was experimented at the temperature, -45 to $175^{\circ}C$ for 250 cycles. The measured interfacial adhesion energy increased from 10.57 to $14.87J/m^2$ after surface chemical treatment. After 250 thermal cycles, the interfacial adhesion energy decreased to $5.64J/m^2$ and $7.34J/m^2$ for without chemical treatment and with chemical treatment, respectively. The delaminated interfaces were confirmed as $Cu/SiN_x$ interface by using the scanning electron microscope and energy dispersive spectroscopy. From X-ray photoelectron spectroscopy analysis results, the relative Cu oxide amounts between $SiN_x$ and Cu decreased by chemical treatment and increased after thermal cycle. The thermal stress due to the mismatch of thermal expansion coefficient during thermal cycle seemed to weaken the $Cu/SiN_x$ interface adhesion, which led to increased CuO amounts at Cu film surface.

• Journal of Adhesion and Interface
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• v.6 no.3
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• pp.1-9
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• 2005

This study investigated the influence of atmospheric plasma factors such as RF power, treatment time, the gap distance between discharge and sample, and the gas flow rate of Ar on the surface property by using the design of experiment (DOE) method. The plasma treatment time (s), plasma power (W), gap distance (mm) between discharge and sample, and flow rate of Ar gas were in order of important factors for changing the surface free energy of PMMA plates. As a result, the most effective factor for improving the surface free energy of PMMA plates is the distance (mm) from discharge glow to sample plate. Because of the interaction between plasma power (W) and treatment time (s), the power dose (J) factor which multiply plasma power (W) by treatment time (s) should be significantly considered. The optimum condition for maximizing the surface free energy of PMMA plate was found at 1500J of power dose. Through XPS and AFM analysis, we also observed the change of chemical composition, surface morphology and roughness before and after plasma treatment. It is considered that the change of surface free energy of PMMA plate with plasma treatment is influenced by the introduction of polar functional group as well as the increase of surface roughness.

• Journal of Adhesion and Interface
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• v.13 no.1
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• pp.45-50
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• 2012

Recently developed polyketone fiber has various applications in the mechanical rubber goods as reinforcement because of its good mechanical properties. However, its surface is not suitable for good adhesion with the rubber matrix. Thus, a surface modification is essential to obtain the good interfacial adhesion. Plasma treatment, in this study, has been conducted to modify the surface of the polyketone fiber. The morphological changes of the fibers by oxygen plasma treatment were observed by using SEM and AFM. The chemical composition changes of PK fiber surface treated with oxygen plasma were investigated using an XPS (X-ray photoelectron spectroscopy). Finally, the effect of these changes on the interfacial adhesion between fiber and rubber was analyzed by using a microdroplet debonding test. By the plasma treatment, oxygen moieties on the fiber surface increased with processing time and power. The surface RMS roughness increases until the proper processing condition, but a long plasma processing time resulted in a rather reduced roughness because of surface degradation. When the treatment time and power were 60 s and 80 W, respectively, the highest interfacial shear strength (IFSS) was obtained between the PK fiber and natural rubber. However, as the treatment time and power were higher than 60 s and 80 W, respectively, the IFSS decreased because of degradation of the PK fiber surface by severe plasma treatment.

• Journal of the Korean Institute of Landscape Architecture
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• v.28 no.6
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• pp.114-126
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• 2001

The purpose of this study is to establish the databases of pollutant sources and water quality measurement data by utilizing GIS, and making the user interface for the management of pollutant sources. Yeongsan Estuarine Lake was formed of a huge levee of 4.35 km constructed by an agricultural reclamation project. Water quality of the reservoir has been degraded gradually, which mainly attributes to increase of point and non-point source pollutant loads from the lake's watershed of 33,374.3 $\textrm{km}^2$ into it. Application of GIS to establishment of the database was researched of pint source such as domestic sewage, industrial wastewater, farm wastes, and fishery wastes, and non-pont source such as residence, rice and upland field, and forest runoffs of the watershed of the lake. NT Acr/Info and ArcView were mainly utilized for the database formation. Land use of the watershed using LANDSAT image data was analyzed for non-point source pollutant load estimation. Pollutant loads from the watershed into the reservoir were calculated using the GIS database and BOD, TN, TP load units of point and non-point sources. Total BOD, TN, TP loads into it reached approximately to 141, 715, 2,094 and 4,743 kg/day respectively. The loads can be used as input parameters for water quality predicting model of it. A user-friendly interface program was developed using Dialog Designer and Avenue Script of AcrView, which can perform spatial analysis of point and non-point sources, calculate pollutant inputs from the sources, update attribute data of them, delete and add point sources, identify locations and volumes of water treatment facilities, and examine water quality data of water sampling points.

• Journal of Adhesion and Interface
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• v.3 no.3
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• pp.22-29
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• 2002

UV curable coating system described here consists of double layers, namely under layer and top laser coatings. The former consists of organic-inorganic conductive materials and the latter consists of multifunctional acrylates. Transparent double layer coatings were prepared on the transparent substrates i.e. PMMA, PC, PET etc. by the wet and wet coating procedure. Their surface resistances and film properties were measured as a function of the top layer thickness and relative humidity. As the thickness of the top layer was less than $10{\mu}m$, the surface resistance in the range of $10^8{\sim}10^{10}{\Omega}/cm^2$ was obtained. The surface properties of the two-layer coating were remarkably improved compared with the single layer coating. The effects of migration of conducting materials on the film properties of multilayer coating were investigated by using contact angle and Fourier transform infrared/attenuated total reflection(FT-IR/ATR). It was found that the migration of dopant(dodecyl benzenesulfonic acid, DBSA) molecules were occurred from film-substrate interface to film-air interface in the organic conductive coating system but not in the inorganic one.