• Journal of Mechanical Science and Technology
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• v.20 no.2
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• pp.271-277
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• 2006

A numerical study is made of the spin-up from rest of a three-layer fluid in a closed, vertically-mounted cylinder. The densities in the upper layer $\rho_1$, middle layer $\rho_2$ and lower layer $\rho_3\;are\;\rho_3\;>\;\rho_2\;>\;\rho_1$, and the kinematic viscosities are left arbitrary. The representative system Ekman number is small. Numerical solutions are obtained to the time-dependent axisymmetric Navier-Stokes equations, and the treatment of the interfaces is modeled by use of the Height of Liquid method. Complete three-component velocity fields, together with the evolution of the interface deformations, are depicted. At small times, when the kinematic viscosity in the upper layer is smaller than in the middle layer, the top interface rises (sinks) in the central axis (peripheral) region. When the kinematic viscosity in the lower layer is smaller than in the middle layer, the bottom interface rises (sinks) in the periphery (axis) region. Detailed shapes of interfaces are illustrated for several cases of exemplary viscosity ratios.

• Progress in Superconductivity
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• v.3 no.1
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• pp.87-90
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• 2001

We designed a high temperature superconducting rapid single flux quantum(RSFQ) T flip-flop(TFF) circuit using Xic and WRspice. According to the optimized circuit parameters, we fabricated the TFF circuit with $Y_1$$Ba_2$Cu$_3$$O_{7-x}$(YBCO) interface-controlled Josephson junctions. The whole circuit was comprised of five epitaxial layers including YBCO ground plane. The interface-controlled Josephson junction was fabricated with natural junction barrier that was formed by interface-treatment process. In addition, we report second design for a new flip-flop without ground palne.e.

• Journal of Technologic Dentistry
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• v.35 no.2
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• pp.137-142
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• 2013

Purpose: This study was to observe the surface and interfacial characteristic of Zirconia by surface treatment. And it was observed the roughness and contact angle according to processing, and the interfacial properties by surface treatment on zirconia. Methods: The oxide formation and ion diffusion between core and veneer ceramic were determined by the X-ray Dot Mapping of EPMA(Electron probe micro analyzer). The roughness was measured by 3D Digital microscope and the contact angle according to processing of zirconia was observed using distilled water on the surface. Results: The surface roughness of the specimens Z04, Z12, Z15 was measured $0.67({\pm}0.03){\mu}m$, $0.50({\pm}0.12){\mu}m$, $0.35({\pm}0.09){\mu}m$, respectively. As results of contact angle test, Z04, Z12, Z15 of specimen group without binder treatment was measured $46.79({\pm}3.17)^{\circ}$, $57.47({\pm}4.83)^{\circ}$, $56.19({\pm}2.66)^{\circ}$, respectively. but, L04, L12, L15 of specimen group without binder treatment was measured $63.84({\pm}2.20)^{\circ}$, $66.08({\pm}0.16)^{\circ}$, $65.10({\pm}1.01)^{\circ}$, respectively. Average contact angle of L15 was measured $65.10({\pm}1.01)^{\circ}$. In X-ray Dot Mapping results, thickness of binder including Al element was measured that each of L04, L12, L15 were $20{\mu}m$, $15{\mu}m$, $10{\mu}m$. Conclusion: The more rough surface increases the wettability, but the sintered exclusive binder decreases the wettability.

• Journal of Adhesion and Interface
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• v.5 no.3
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• pp.10-17
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• 2004

We investigated the effect of stabilization processing parameters on the thermal shrinkage, thermal stability and microstructure of rayon fabrics stabilized under various conditions such as heating rate, stabilization temperature, atmosphere gas, and chemical treatment. The presence and absence of phosphoric acid treatment and the heating rate have most importantly influenced the thermal shrinkage and the weight change of rayon fabrics. Especially, the phosphoric acid treatment decreases the reduction of thickness, length, and weight of the fabrics by about 80%, 20%, and 26%, respectively, in comparison with the untreated counterparts, showing the protective effectiveness of the thermal shrinkage involved. The thermal stability of stabilized rayon fabrics is also affected by all the processing conditions used: stabilization temperature, phosphoric acid treatment, atmosphere gas, and heating rate. In addition, the surface and diameter of the stabilized fiber significantly depend on the treatment of phosphoric acid prior to stabilization process.

• Journal of Adhesion and Interface
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• v.8 no.3
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• pp.1-8
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• 2007

An atmospheric plasma pre-treatment method was applied to polyurethane foam to improve its contact angle and adhesion. In order to investigate the optimum reaction condition of plasma treatment, type of reaction gas (nitrogen, argon, oxygen, air), rate of gas flow (30~150 mL/min), and reaction time (0~30 sec) were examined in a plate plasma reactor. Also, the effects were compared to those of a conventional vacuum plasma pre-treatment system. The result of the surface modification with respect to the treatment procedure was characterized by using SEM and ATR-FTIR. Due to a decrease of the contact angle of polyurethane foam, the greatest adhesion strength was achieved at a flow rate of 100 mL/min and at a reaction time of 10s for N2 gas. Consequently, the atmospheric plasma treatment reduced the contact angle of the polyurethane foam and also resulted in the improvement of the peel strength.

• Journal of Adhesion and Interface
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• v.9 no.4
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• pp.1-11
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• 2008

In the present study, kenaf fibers were treated with sodium hydroxide using soaking and ultrasonic methods prior to biocomposite processing, respectively. The effect of alkali treatment on the kenaf-PLA interfacial adhesion and mechanical and thermal characteristics of kenaf/poly(lactic acid) biocomposites was investigated in terms of their interfacial shear strength, flexural properties, dynamic mechanical properties and thermal stability and also microscopic observations of kenaf fibers and the composite fracture surfaces. As a result, use of both soaking and ultrasonic methods for treating kenaf fiber surfaces played a role in increasing the fiber-matrix adhesion and the mechanical properties of the biocomposites. Their characteristics depended not only on the fiber surface treatment method but also on the treatment condition like alkali concentration and treatment time.

• Journal of Adhesion and Interface
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• v.12 no.1
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• pp.26-33
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• 2011

Phosphoric acid treatments were conducted to improve the adhesion property of polyketone film to rubber. The effects of phosphoric acid treatments were characterized by using a contact angle analyzer and a XPS (X-ray photoelectron spectroscopy). Morphological changes were observed by using a scanning electron microscope (SEM) and an atomic force microscope (AFM) as the acid treatment condition varied in concentration and time. The contact angle was found to significantly decrease with the acid treatment. According to the XPS, increased wettability was attributed to the inclusion of oxygen containing groups such as hydroxyl, carbonyl and carboxyl by acid treatments. Cracks and pores were produced on the polyketone film surface and thus, roughness increased with the acid treatment. Interfacial adhesion strength between polyketone and natural rubber was largely improved by acid treatment due to the increased wettability and roughness of the polyketone surface. However, the higher level of acid treatment caused the degradation of the polyketone surface, and thus, its interfacial adhesion consequently decreased.

• Journal of Adhesion and Interface
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• v.9 no.1
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• pp.9-15
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• 2008

EVA foam was treated by oxygen plasma under a various treatment time for surface modification. The effect of plasma treatment on surface properties of EVA foam was investigated in terms of FT-IR ATR, XPS, contact angle, and SEM analysis and the adhesion characteristic of the EVA foam was studied in peel strength. As a results, EVA foam treated by plasma led to an elimination of organic compound, an increase of oxygen content, and an increase of surface roughness, resulting in improving the adhesion properties of the EVA foam. As the plasma treatment time increased, the hydrophilicity and physical change of surface of the EVA foam were increased and showed maximum value at 180 s and 420 s, respectively. The maximum adhesion strength appeared at plasma treatment time of 420 s and therefore, in this study the physical change was thought to be a major factor for improving the adhesion of the EVA foam.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.33-35
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• 2006

The interactions between Cu/Sn-Ag-(Cu) and Sn-Ag-(Cu)/Ni interfacial reactions were studied during isothermal aging at $150^{\circ}C$ for up to 1000h using Cu(ENIG)/Sn-3.5Ag-(0.7Cu)/Cu(ENIG) sandwich solder joints. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing, whereas a $(Cu,Ni)_6Sn_5$ IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni side was sourced from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment was performed at $150^{\circ}C$, no Ni was detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the $(Cu,Ni)_6Sn_5$ IMC layer of the Cu/sn-Ag/ENIG sandwich joint effectively retarded the Ni consumption from the electroless Ni-P layer.