• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.146-153
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• 2003

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to the combined influence of temperature change and moisture absorption. A boundary element analysis is employed to investigate the behavior of interface stresses. The film is assumed to be thermorheologically simple. It is further assumed that moisture effects are analogous to thermal effects. Numerical results are presented for a given viscoelastic model, indicating the singular residual stresses induced during cooling down from the curing temperature, and how they can be altered by subsequent moisture absorption at room temperature.

• Fashion & Textile Research Journal
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• v.18 no.3
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• pp.363-373
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• 2016

This study aims to develop an all-fabric integrated smart jacket in order to create a temperature-regulating system based on a user experience design. For this research, previous research technologies of a textile switch interface and a temperature-regulating system were utilized and a unifying technology for the all-fabric integrated smart jacket was developed which can provide the appropriate temperature environments to the human body. A self-heating textile was applied at the areas of the back and hood in the final tested jacket, and an embroidery circuit was developed in the form of a rectangle in the back and in both ears of the hood, taking into account the pattern of the jacket part where it was be applied and the embroidery production method. The textile switch interface was designed in a three-layer structure: an embroidery circuit line in a conductive yarn, an interval material, and a conductive sensing material, and it was made to work with the input and output sensors through the multiple input method. After the all-fabric integrated smart jacket was produced according to the pattern, all of the textile band lines for transmission were gathered and connected with a miniature module for controlling temperature and then integrated into the inside of the left chest pocket of the jacket. After the users put on this jacket, they were asked to assess the wearing satisfaction. Most of them reported a very low level of irritation and discomfort and said that the jacket was as comfortable as everyday clothing.

• Korean Journal of Food Science and Technology
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• v.19 no.2
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• pp.129-133
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• 1987

To develop a microcomputer-based data acquisition system for measurement of variables such as temperature and weight in food process, a low-cost data acquisition system was developed using an Apple II microcomputer. The system consisted of a microcomputer, a temperature sensor made of pt-100, a strain gauge load cell for weighing, a preamplifier for signal conditionings and an interface device. Interface device was built with programmable interface chip MC 6821, tristate buffer 74244 and analog-to-digital converter ADC 0809. The analog signals of temperature and weight were serially acquisited upon the program. The BASIC language was used for operating the data acquisition and data handling programs. The system successfully measured the variables such as temperature and weight with various sampling intervals in food dehydration process.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.2
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• pp.378-384
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• 2013

In this paper, a CMOS temperature sensor is proposed to measure the internal temperature of a chip. The temperature sensor consists of a proportional-to-absolute-temperature (PTAT) circuit for a temperature sensing part and a 4-bit analog-to-digital converter (ADC) for a digital interface. The PTAT circuit with the compact area is designed by using a vertical PNP architecture in the CMOS process. To reduce sensitivity of temperature variation in the digital interface circuit of the proposed temperature sensor, a 4-bit successive approximation (SA) ADC using the minimum analog circuits is used. It uses a capacitor-based digital-to-analog converter and a time-domain comparator to minimize power consumption. The proposed temperature sensor was fabricated by using a $0.25{\mu}m$ 1-poly 6-metal CMOS process with a 2.5V supply, and its operating temperature range is from 50 to $150^{\circ}C$. The area and power consumption of the fabricated temperature sensor are $130{\times}390{\mu}m^2$ and $868{\mu}W$, respectively.

• Journal of Powder Materials
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• v.2 no.2
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• pp.158-164
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• 1995

Synthesis of the NiTi shape memory alloy using the thermal explosion mode of the self-propagating high-temperature synthesis has been investigated. The significant fractions of intermetallics phases were found to form at the Ti/Ni powder interface during the heating to the ignition temperature and seemed to influence the relative fraction of phases in the final products. As the heating rate to the ignition temperature was increased, the combustion temperature and the fraction of NiTi in the final reaction products were increased. The synthesis reaction under 70 MPa compressive pressure yielded a reaction product with 98% theoretical density.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.14 no.1
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• pp.15-23
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• 2018

A compact heat exchanger is one of critical components in a very high temperature gas-cooled reactor (VHTR). Alloy 617 (Ni-Cr-Co-Mo) is considered as one of leading candidates for this application due to its excellent thermal stability and strengths in anticipated operating conditions. On the basis of current ASME code requirements, sixty sheets of this alloy are prepared for diffusion welding, which is the key technology to have a reliable compact heat exchanger. Optical microscopic analysis show that there are no cracks, incomplete bond, and porosity at/near the interface of diffusion weldment, but Cr-rich carbides and Al-rich oxides are identified through high resolution electron microscopic analysis. In high-temperature tensile testing, superior yield strengths of the diffusion weldment compared to the code requirement are obtained up to 1223 K ($950^{\circ}C$). However, both tensile strength and ductility drop rapidly at higher temperature due to the insufficient grain boundary migration across the interface of diffusion weldment. Best fit curves for minimum yield strength and average tensile strength are drawn from the experimental tensile results of this study.

• Korean Journal of Materials Research
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• v.13 no.6
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• pp.381-388
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• 2003

Directional solidification experiments were carried out at 0.5-150 $\mu\textrm{m}$/s in the Co-base superalloy ECY 768. As increasing solidification rate, the dendrite length increased and it reached the maximum at 150 $\mu\textrm{m}$/s, where the tip temperature is close to the liquidus. The liquidus and eutectic temperatures could be estimated by comparing the dendrite lengths and the temperature gradients at the solid/liquid interface and those were estimated as $1424.6^{\circ}C$ and $1343^{\circ}C$ respectively. Between the dendrites just below final freezing temperature, MC carbide and $M_{23}$$C_{6}$ carbide were found. It was confirmed that the script or blocky shape was Ta or W-rich MC carbide, and the lamellar shape was Cr-rich eutectic carbide. The solid/liquid interface morphology clearly showed that the Cr-rich eutectic carbide formed just after the script type MC carbide.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.172-175
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• 2001

The high temperature deformation behavior of two-phase gamma TiAl alloy has been investigated with the variation of temperature and ${\gamma}/{\alpha}_2$ volume fraction. For this purpose, a series of load relaxation tests and tensile tests have been conducted at temperature ranging from 800 to $1050^{\circ}C$. In the early stage of the deformation as in the load relaxation test experimental flow curves of the fine-grained TiAl alloy are well fitted with the combined curves of two processes (grain matrix deformation and dislocation climb) in the inelastic deformation theory. The evidence of grain boundary sliding has not been observed at this stage. However, when the amount of deformation is large (${\epsilon}{\approx}$ 0.8), flow curves significantly changes its shape indicating that grain boundary sliding also operates at this stage, which has been attributed to the occurrence of dynamic recrystallization during the deformation. With the increase in the volume fraction of ${\alpha}_2$-phase, the flow stress for grain matrix deformation increases since ${\alpha}_2$-Phase is considered as hard phase acting as barrier for dislocation movement. It is considered that cavity initiation is more probable to occur at ${\alpha}_2/{\gamma}$ interface rather than at ${\gamma}/{\gamma}$ interface.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.1
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• pp.114-121
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• 2004

Frictional heating in brakes causes thermoelastic distortion of the contacting bodies and hence affects the contact pressure distribution. The resulting thermo-mechanical coupling can cause thermoelastic instability (TEI) if the sliding speed is sufficiently high, leading to non-uniform heating called hot spots and low frequency vibration known as hot judder. The vibration of brakes to the known phenomenon of frictionally-excited thermoelastic instability is estimated studying the interface temperature and pressure evolution with time. A simple model has been considered where a layer with half-thickness$\alpha$slides with speed V between two half-planes which are rigid and non-conducting. The advantage of this properlysimple model permits us to deduce analytically the critical conditions for the onset of instability, which is the relation between the critical speed and the growth rate of the interface temperature and pressure. Symmetrical component of pressure and temperature distribution at the layer interfaces can be more unstable than antisymmetrical component. As the thickness $\alpha$ reduces, the system becomes more apt to thermoelastic instability. For perturbations with wave number smaller than the critical$m_{cr}$ the temperature increases with m vice versa for perturbations with wave number larges than $m_{cr}$ , the temperature decreases with m.

• Journal of Electrochemical Science and Technology
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• v.15 no.2
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• pp.220-241
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• 2024

Due to its unique advantages, electrochemical machining (ECM) is playing an increasingly significant role in the manufacture of difficult-to-machine materials. Most of the current ECM research is conducted at room temperature, with studies on ECM in a cryogenic environment not having been reported to date. This study is focused on the electrochemical dissolution characteristics of typical iron and nickel base alloys in NaNO₃ solution at low temperature (-10℃). The polarization behaviors and passive film properties were studied by various electrochemical test methods. The results indicated that a higher voltage is required for decomposition and more pronounced pitting of their structures occurs in the passive zone in a cryogenic environment. A more in-depth study of the composition and structure of the passive films by X-ray photoelectron spectroscopy and electrochemical impedance spectroscopy showed that the passive films of the alloys are modified at low temperature, and their capacitance characteristics are more prominent, which makes corrosion of the alloys more likely to occur uniformly. These modified passive films have a huge impact on the surface morphologies of the alloys, with non-uniform corrosion suppressed and an improvement in their surface finish, indicating that lowering the temperature improves the localization of ECM. Together with the cryogenic impact of electron energy state compression, the accuracy of ECM can be further improved.