• Title/Summary/Keyword: interface roughness

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Effect of Cu Containing Solders on Shear Strength of As-soldered BGA Solder Joints (BGA 솔더 조인트의 전단강도에 미치는 Cu 첨가 솔더의 영향)

  • 신창근;정재필;허주열
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.2
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    • pp.13-19
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    • 2000
  • Shear strengths of BGA solder joints on Cu pads were studied for Cu-containing Sn (0, 1.5, and 2.5 wt.% Cu) and Sn-40Pb (0 and 0.5wt.% Cu) solders, with emphasis on the roles of the Cu-Sn intermetallic layer thickness and the roughness of the interface between the intermetalic layer and solder. The shear strength test was performed for as-soldered solder joints with various soldering reaction times up to 4 min. The addition of Cu to the pure Sn solder results in an enhanced growth of the intermetallic layer whereas the effect of Cu addition to the Sn-40Pb solder is primarily on the reduction of the roughness of the intermetallic/solder interface. The critical thickness of the intermetallic layer for a maximum shear strength depends on the solder materials, which was measured to be ~ 2.3 $\mu\textrm{m}$ for Sn-Cu solders and ~ 1.2 $\mu\textrm{m}$ for Sn-Pb-Cu solders. The shear strength at the critical intermetallic layer thickness seems to increase as the intermetallic/solder interface becomes rougher. This is in accordance with the observation that the sheared fracture occurred initially within the solder tends to shift towards the intermetallic/solder interface as the intermetallic layer grows above the critical thickness.

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A Numerical Study on Shear Behavior of the Interface between Blasted Rock and Concrete (발파 암반-콘크리트 경계면에서의 전단거동특성에 대한 수치해석적 연구)

  • Min, Gyeong-Jo;Ko, Young-Hun;Fukuda, Daisuke;Oh, Se-Wook;Kim, Jeong-Gyu;Chung, Moon-Kyung;Cho, Sang-Ho
    • Explosives and Blasting
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    • v.37 no.4
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    • pp.26-35
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    • 2019
  • In designing a gravity-type anchorage of earth-anchored suspension bridge, the contact friction between a blasted rock mass and the concrete anchorage plays a key role in the stability of the entire anchorage. Therefore, it is vital to understand the shear behavior of the interface between the blasted rock mass and concrete. In this study, a portable 3D LiDAR scanner was utilized to scan the blasted bottom surfaces, and rock surface roughness was quantitatively analyzed from the scanned profiles to apply to 3D FEM modelling. In addition, based on the 3D FEM model, a three-dimensional dynamic fracture process analysis (DFPA-3D) technique was applied to study on the shear behavior of the interface between blasted rock and concrete through direct shear tests, which was analyzed under constant normal load (CNL). The effects of normal stress and the joint roughness on shear failure behavior are also analyzed.

Analysis of Shear Resistance Characteristics in Pile-Soil Interface using Large-Scale Direct Shear Test (대형직접전단시험을 통한 말뚝과 지반 경계면의 전단특성 분석)

  • You, Seung-Kyong;Hong, Gigwon
    • Journal of the Korean Geosynthetics Society
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    • v.21 no.3
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    • pp.61-69
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    • 2022
  • In this study, a large-scale direct shear test was performed to evaluate the shear characteristics of the pile-soil interface according to the fines content and confining pressure conditions as a reasonable evaluation method of the pullout resistance performance of pile considering the soil conditions. It was found that the shear stress was greatly generated under the conditions of high normal stress and low fines content. In addition, the maximum shear stress was found to be rather large under the conditions of the same normal stress and fines content, when pile surface had high roughness. The internal friction angle decreased at the pile-soil interface, when the fines content in the ground increased. On the other hand, the cohesion decreased under the condition of high fines content. And the internal friction angle and cohesion were large regardless of the fines content in the model ground, when the roughness of the pile surface was high.

Experimental study for application of the punch shear test to estimate adfreezing strength of frozen soil-structure interface

  • Park, Sangyeong;Hwang, Chaemin;Choi, Hangseok;Son, Youngjin;Ko, Tae Young
    • Geomechanics and Engineering
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    • v.29 no.3
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    • pp.281-290
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    • 2022
  • The direct shear test is commonly used to evaluate the shear behavior of frozen soil-structure interfaces under normal stress. However, failure criteria, such as the Mohr-Coulomb failure criterion, are needed to obtain the unconfined shear strength. Hence, the punch shear test, which is usually used to estimate the shear strength of rocks without confinement, was examined in this study to directly determine the adfreezing strength. It is measured as the shear strength of the frozen soil-structure interface under unconfined conditions. Different soils of silica sand, field sand, and field clay were prepared inside the steel and concrete ring structures. Soil and ring structures were frozen at the target temperature for more than 24 h. A punch shear test was then conducted. The test results show that the adfreezing strength increased with a decrease in the target temperature and increase in the initial water content, owing to the increase in ice content. The adfreezing strength of field clay was the smallest when compared with the other soil specimens because of the large amount of unfrozen water content. The field sand with the larger normalized roughness showed greater adfreezing strength than the silica sand with a lower normalized roughness. From the experiment and analysis, the applicability of the punch shear test was examined to measure the adfreezing strength of the frozen soil-structure interface. To find a proper sample dimension, supplementary experiments or numerical analysis will be needed in further research.

A Molecular Simulation on the Adhesion Control of Metal Thin Film-Carbon Nanotube Interface based on Thermal Wetting (Thermal wetting 현상이 탄소나노튜브-금속박막 계면의 응착력에 미치는 영향에 관한 분자 시뮬레이션 연구)

  • Sang-Hoon Lee;Hyun-Joon Kim
    • Tribology and Lubricants
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    • v.39 no.1
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    • pp.8-12
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    • 2023
  • This study presents a molecular simulation of adhesion control between carbon nanotube (CNT) and Ag thin film deposited on silicon substrate. Rough and flat Ag thin film models were prepared to investigate the effect of surface roughness on adhesion force. Heat treatment was applied to the models to modify the adhesion characteristics of the Ag/CNT interface based on thermal wetting. Simulation results showed that the heat treatment altered the Ag thin film morphology by thermal wetting, causing an increase in contact area of Ag/CNT interface and the adhesion force for both the flat and rough models changed. Despite the increase in contact area, the adhesion force of flat Ag/CNT interface decreased after the heat treatment because of plastic deformation of the Ag thin film. The result suggests that internal stress of the CNT induced by the substrate deformation contributes in reduction of adhesion. Contrarily, heat treatment to the rough model increases adhesion force because of the expanded contact area. The contact area is speculated to be more influential to the adhesion force rather than the internal stress of the CNT on the rough Ag thin film, because the CNT on the rough model contains internal stress regardless of the heat treatment. Therefore, as demonstrated by simulation results, the heat treatment can prevent delamination or wear of CNT coating on a rough metallic substrate by thermal wetting phenomena.

Study on the Long Time Breakdown Voltage in the Macro Interface between Epoxy and Rubber (에폭시/고무 거시계면에서 장시간 절연파괴전압에 대한 연구)

  • 박우현;이기식
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.11
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    • pp.1003-1008
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    • 2002
  • In this paper, the estimation of lifetime with the various conditions of the interface between toughened epoxy and rubber which are consisting materials of underground power delivery system has been studied. After the measurement of the short time AC interfacial breakdown strength on macro interfaces at room temperature, the breakdown time at several voltages were measured under the constant voltages lower than the short time breakdown voltage. The long time breakdown voltage was calculated by using Inverse Power Law. Two types of interfaces was studied. One was the interface between toughened epoxy and EPDM(Ethylene Prorylene Diene Terpolymer). The other was the interface between toughened epoxy and silicon rubber. Interfacial pressure and roughness of interfaces was determined through the characteristic of short time AC interfacial breakdown strength. Oil condition was no oiled, low viscosity oiled and high viscosity oiled. High viscosity oiled interface between Toughened epoxy and silicon rubber had the best lifetime exponent, 20.69. and the breakdown voltage of this interface after 30 years was evaluated 19.27㎸.

Growth environments depends interface and surface characteristics of yttria-stabilized zirconia thin films

  • Bae, Jong-Seong;Park, Su-Hwan;Park, Sang-Sin;Hwang, Jeong-Sik;Park, Seong-Gyun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.309-309
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    • 2011
  • There have been large research activities on the high quality oxide films for the realization oxide based electronics. However, the interface interdiffusion prohibits achieving high quality oxide films, when the oxide films are grown on non-oxide substrates. In the case of Si substrates, there exist lattice mismatch and interface interdiffusion when oxide films deposited on direct Si surface. In this presentation, we report the interface characteristics of yttria-stabilized zirconia films grown on silicon substrates. From x-ray reflectivity analysis we found that the film thickness and interface roughness decreased as the growth temperature increased, indicating that the growth mechanism varies and the chemical reaction is limited to the interface as the growth condition varies. Furthermore, the packing density of the film increased as the growth temperature increased and the film thickness decreased. X-ray photoelectron spectroscopy analysis of very thin films revealed that the amount of chemical shift increased as the growth temperature increased. Intriguingly, the direction of the chemical shift of Zr was opposite to that of Si due to the second nearest neighbor interaction.

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Evaluation of soil-concrete interface shear strength based on LS-SVM

  • Zhang, Chunshun;Ji, Jian;Gui, Yilin;Kodikara, Jayantha;Yang, Sheng-Qi;He, Lei
    • Geomechanics and Engineering
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    • v.11 no.3
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    • pp.361-372
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    • 2016
  • The soil-concrete interface shear strength, although has been extensively studied, is still difficult to predict as a result of the dependence on many factors such as normal stresses, surface roughness, particle sizes, moisture contents, dilation angles of soils, etc. In this study, a well-known rigorous statistical learning approach, namely the least squares support vector machine (LS-SVM) realized in a ubiquitous spreadsheet platform is firstly used in estimating the soil-structure interface shear strength. Instead of studying the complicated mechanism, LS-SVM enables to explore the possible link between the fundamental factors and the interface shear strengths, via a sophisticated statistic approach. As a preliminary investigation, the authors study the expansive soils that are found extensively in most countries. To reduce the complexity, three major influential factors, e.g., initial moisture contents, initial dry densities and normal stresses of soils are taken into account in developing the LS-SVM models for the soil-concrete interface shear strengths. The predicted results by LS-SVM show reasonably good agreement with experimental data from direct shear tests.

Influence of in-situ remote plasma treatment on characteristics of amorphous indium gallium zinc oxide thin film-based transistors

  • Gang, Tae-Seong;Gu, Ja-Hyeon;Hong, Jin-Pyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.257-257
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    • 2011
  • The amorphous indium-gallium-zinc-oxide (a-IGZO) materials for use in high performance display research fields are strongly investigated due to its good performance, such as high mobility and better transparency. However, the stability of a-IGZO materials is increasingly becoming one of critical issues due to the sub-gap electron trap sites induced by rough interfaces during deposition processing. It is well-known that the threshold voltage shift is related to interface roughness and oxygen vacancy formed by breaking weak chemical bonds. Here, we report the better properties of transparent oxide transistors by reducing the threshold voltage shift with an external rf plasma supported magnetron sputtering system. Mainly, our sputtering method causes the surface of sample to be sleek, so that it prevents the formation of various defects, such as shallow electron trap sites in the interface. External rf power was applied from 0 to 50W during RF sputtering process to enhance the stability of our oxide transistor without having a large voltage shift. To observe the effects of external rf-plasma source on the properties of our devices, Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), Transmission Electron Microscopy (TEM) are carried out to observe surface roughness and morphology of sputtered thin film. In addition, typical electrical properties, such as I-V characteristics are analyzed.

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