• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.1141-1144
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• 2003

For proper communication with various types of IC-Card, multiple IC-Card interface complying with the IC-Card standard (ISO7816) is embedded and realized as a peripheral on the 32-bit RISC based system-on-a-chip. It provides the generation of either 3.3V or 5V power supply for the operation of the inserted IC-Card as well. IC-Card interface is divided into an analog front-end (AFE) and a digital back-end (DBE). The embedded DC-DC converters suitable for driving IC-Cards are incorporated in the AFE. The chip design for multiple IC-Card interface is implemented on a standard 0.35${\mu}{\textrm}{m}$ triple-metal double-poly CMOS process and is packaged in a 352-pin plastic ball grid array (PBGA). The total gate count is about 400,000, excluding the internal memory. Die area is 7890${\mu}{\textrm}{m}$ $\times$ 7890${\mu}{\textrm}{m}$.

• Journal of KIISE:Computer Systems and Theory
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• v.30 no.9
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• pp.494-503
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• 2003

In this paper, we propose the implementation techniques of IC card chipset that is compatible with international standard ISO-7816 and supports WindowsCE operating system to expropriate various electronic cash and credit card. This IC card interface chip set is composed with 32 bit ARM720T Core and AES(Advanced Encryption System) cryptography module for electronic commerce. Six IC card interfaces support T=0, T=1 protocol and two of them are used to interface with user card directly, the others are used for interface with SAM card. In addition, It supports a LCD controller and USB interface for host. We improved the performance about 70% than software based It card chip set and verified using Hynix 0.35um process.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.6 s.360
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• pp.83-88
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• 2007

In this paper, we propose the function verification method of the OLED(Organic Light Emitting Diode) drive IC using PLI verification method. This method uses the HDL(Hardware Description Language) simulator, PLI(Programing Language Interface), and GUI (Graphic User Interface) image viewer. This method improves the execute efficiency 40 times than conventional function verification methods. The proposed method can be used efficiently for function verification of DDI(display driver IC) design step.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.288-290
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• 2014

In this paper, Escape and BTA(Bus Turn Around) modes of master bridge IC are implemented, which supports MIPI(Mobile Industry Processor Interface) DSI(Display Serial Interface) standard. MIPI DSI master bridge IC sends RGB data and various commands to display module(slave) in order to test it. The Escape mode is designed to implement LPDT, ULPS and trigger message transmissions. The BTA mode is designed to obtain various status information from slave in reverse direction. Functional simulation results show that the designed Escape and BTA modes work correctly for various conditions defined in MIPI DSI standard.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.291-292
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• 2014

High-speed video transmission modes of master bridge IC are implemented, which supports MIPI (Mobile Industry Processor Interface) DSI (Display Serial Interface) standard. MIPI DSI master bridge IC sends RGB data and various commands to display module (slave) in order to test it. The master bridge IC consists of buffers storing video data of two lines, packet generation block, and D-PHY layer that distributes packets to data lanes and transmits them to slave. In addition, it supports four bpp (bit per pixel) formats and three transmission modes including Burst and Non-Burst (Sync Events, Sync Pulses types). The designed bridge IC is verified by RTL simulations showing that it functions correctly for various operating parameters.

• Journal of Convergence for Information Technology
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• v.11 no.12
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• pp.90-96
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• 2021

In this paper, we designed manufactured and design an integrated interface control unit that has compatibility with brightness control unit, color control unit, and existing control unit. As the implementation method the standard of DVI/HDMI transmission method is applied to the data transmission method, and the Sil 1169 IC is used as the applied IC. Brightness control is programmed to have eight levels of brightness control using the AT89C2051. Also, EPM240T100C5 IC was used for image and dimming data processing. As a result, it is compatible with the control unit using the DVI/HDMI transmission method manufactured by each company and can reproduce clear high quality full HD video according to the surrounding brightness through the full color LED display system.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• Journal of the Institute of Convergence Signal Processing
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• v.7 no.4
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• pp.195-200
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• 2006

The conventional discrete circuit for ABS/TCS system was examined and the problems of the system were analyzed by computer simulation. In order to improve the performance of ABS/TCS system, interface IC which has error compensation, comparator and under voltage lock-out circuit was designed and their electrical characteristics were investigated. The voltage regulator was included to compensate the temperature variation in the temperature range from $-20^{\circ}C$ to $120^{\circ}C$ for automobile environment. ABS and brake signal were separated using the duty factor of same frequency or different frequencies. UVLO(Under Voltage Lock-Out) circuit and constant current circuit were applied for the elimination of noise, and protection circuit was applied to cut the excess current off. Layout for IC fabrication was designed to enhance the electrical performance of ABS/TCS system. Layout was consisted of 11 masks, arrayed effectively 8 pads to reduce the current loss. We can see that the result of layout simulation was better than the result of bread board.

• Steel and Composite Structures
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• v.8 no.6
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• pp.457-473
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• 2008

Yielding of the internal steel reinforcement is an important mechanism that influences the Intermediate Crack-induced debonding (IC debonding) behavior in FRP-strengthened RC members since the FRP is required to carry additional forces beyond the condition of steel yielding. However, rational design practice dictates an appropriate limit state is defined when steel yielding is assured prior to FRP debonding. This paper proposes a criterion which correlates the occurrence of IC debonding to the formulation of a critical steel yielding length. Once this length is exceeded the average bond stress in the FRP/concrete interface exceeds its threshold value, which proves to correlate with the average bond resistance in an FRP/concrete joint under simple shear loading. This proposed IC debonding concept is based on traditional sections analysis which is conventionally applied in design practice. Hence complex bond stress-slip analyses are avoided. Furthermore, the proposed model incorporates not only the bond properties of FRP/concrete interface but also the beam geometry, and properties of steel and FRP reinforcement in the analysis of IC debonding strength. Based upon a solid database, the validity of the proposed simple IC debonding criterion is demonstrated.

• Proceedings of the IEEK Conference
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• 2002.06e
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• pp.107-110
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• 2002

Soft masks mean that part or all of the program code for operating system or applications are located in the EEPROM or flash ROM. Since Soft masks allow errors to be corrected and programs to be modified quickly and at minimal cost, they are used primarily during testing and in the field trials. This paper introduces a hardware architecture of IC card for soft masks. We suggest a new down loading scheme for soft-mask ROM connected by an I/O interface. This scheme saves the new IC card development cost and time.