• Journal of Computing Science and Engineering
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• v.9 no.4
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• pp.190-203
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• 2015

Free and open source software (FOSS) has created a large pool of source codes that can be easily copied to create new applications. However, a copy should preserve copyright notice and license of the original file unless the license explicitly permits such a change. Through software evolution, it is challenging to keep original licenses or choose proper licenses. As a result, there are many potential license violations. Despite the fact that violations can have high impact on protecting copyright, identification of violations is highly complex. It relies on manual inspections by experts. However, such inspection cannot be scaled up with open source software released daily worldwide. To make this process scalable, we propose the following two methods: use machine-based algorithms to narrow down the potential violations; and guide non-experts to manually inspect violations. Using the first method, we found 219 projects (76.6%) with potential violations. Using the second method, we show that the accuracy of crowds is comparable to that of experts. Our techniques might help developers identify potential violations, understand the causes, and resolve these violations.

• Proceedings of the KAIS Fall Conference
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• 2007.05a
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• pp.35-38
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• 2007

본 논문에서는 생산 현장에서 사람이 하고 있는 자동차 부품의 전수(全數) 검사 방법을 대체하기 위한 머신 비전 시스템의 개발 연구이다. 세계 자동차 생산업체간 활발한 합병 및 전략적 제휴로 인한 완성차 업체수의 감소는 부품 업체 간 경쟁을 심화시키고 있다. 외국 업체에 비하여 상대적으로 규모 의 영세성을 보이고 있는 국내 부품 생산 업체는 대규모 생산 설비 투자와 함께 생산 효율성을 증대시켜 국제적인 경쟁력을 갖추도록 하여야 한다. 생산 효율과 품질 향상을 위한 노력의 일환으로 플라스틱 압출 성형에서 생기는 여러 가지 불량품 유형을 PC를 기반한 머신 비전 시스템 (Machine Vision System)을 구축하여 생산된 부품을 실시간 검사하고 불량품을 분류 하는 것이 본 연구의 목적이다. 머신 비전 시스템에 사용된 소프트웨어는 NI-LabVIEW를 사용하였으며, LabVIEW Vision 이미지 함수를 사용하여 검사 프로그램의 개발하였다. 부품 검사에 걸리는 시간은 50ms 내로 완료되기 때문에 생산 부품의 실시간 검사에 적용 될 수 있으며, 검사 영역과 설정 값을 비전 시스템 운용자가 설정할 수 있도록 프로그램이 만들어 졌다.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.21 no.1
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• pp.19-27
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• 2007

In this paper, we develope and implement a TFT-LCD cell defects detection algorithm using morphology. To detect the bright line or dark line defects and the bright pixel or dark pixel defects of the TFT-LCD cells, we determine the shape of the morphology operators considering the shape characteristics of the TFT-LCD sub pixels. Using dilation, erosion, and the subtraction operators, we extract gray level defects information. Then, we apply the optimal threshold method which shows the best results in terms of several criteria. Finally, we determine the defects using labelling method. From various experiments using TFT-LCD panels, the proposed algorithm shows superior results.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10b
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• pp.115-122
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• 2003

This paper presents the development of a virtual forging factory framework. The technologies of virtual reality and relational database had been integrated in the developed framework using Microsoft $Windows^{(R)}$ programming as the main technique so as to emulate a physical forging factory. The developed virtual forging factory consists of forging cells and a forging cell is comprised of forging machine, forging die, and forging operations forming a forging production line. The technology of virtual reality had been successfully adopted in the production simulation of manufacturing such as CNC and robotics. However, the application in virtual forging factory seems to have not been studied yet. Potential application of a virtual forging factory can be beneficial to (1) computer aided instruction, (2) shorten the learning curve of a novice, (3) remote diagnosis and monitoring when remote monitoring and control technology and signal inspection is considered, (4) improve adverse forging environment when remote forging technology is applied, and (5) virtual reality application.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.41-41
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• 2010

In this research, to study tungsten carbide alloy(Co 0.5%) ultra precision turning possibility that is used Glass Molding Press(GMP) using conventional (Rake angle $-25^{\circ}$) single crystal diamond bite observed machining surface condition, surface roughness($R_a$), diamond bite cutting edge after tungsten carbide alloy ultra precision turning. Suggested and designed optimum chamfer bite shape to suggest ultra precision optimum bite using Finite Element Analysis(FEM). After machining tungsten carbide alloy ultra precision turning using optimum chamfer bite and comparing with conventional bite machine result and studied optimum chamfer bite design inspection and also tungsten carbide ultra precision turning possibility for high temperature compression glass lens molding.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.3
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• pp.100-106
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• 2017

A universal outer diameter measurement module was developed using a linear variable differential transformer (LVDT). This outer diameter measurement module enables simultaneous measurement of outer diameter, displacement, and perpendicularity of bench-type high-precision products by combining analogue and digital measurement principles with mechanically precise and fine adjustment functions. The developed module showed a performance of 0.001mm in measurement resolution, 0.001mm in measurement accuracy, reference surface abrasion lower than Ra 0.1864, and measurement stability of 0.002mm. Therefore, we have acquired domestic measurement technology to improve productivity by securing technical competitiveness for universal diameter measurement technology, lower production costs through import substitution, and increased quality of products with more precise measurement technology. Furthermore, a substitution effect is expected for expensive import measurement system equipment used in production, research, and inspection sites in industries that produce precision processing products such as automobile and machine components.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.7
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• pp.1047-1054
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• 2004

Internal defects in the glass, like-as micro-voids, micro-cracks, or inclusions, easily cause the failure when the glass is exposed to the shock or the thermal variation. In order to produce the highly reliable glass product, the precision inspection of the defect in the glass is required. For this purpose, this paper proposes a machine vision technique based on the auto-focusing method, which searches the defect and measures the location under the fact that the edge image of defect must be the most clear when the focal plane of CCD camera is coincided with the defect. As for the search index, the gradient indicator is presented. The basic principles are verified through the simulations for the computer-generated defect images, where the affects of defect shape, gray level of background, and the brightness of the defect image are also analyzed. Finally, experimental results for actual glass specimens are shown to confirm the applicability of this method to the actual field.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.9
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• pp.831-838
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• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.1
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• pp.133-140
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• 2001

Recently, to assure the integrity of a structural components such as piping pressure vessels and thinning structure, Lamb wave inspection technique has been used in material evaluation. It is very important to select the optimal Lamb wave mode and to analyze the signal accurately because of its unique dispersion properties grnerating several modes within the speci-men. It this study, the feasibility of material evaluation applications using wavelet analysis of Lamb wave has been veir-fied experimentally. These results show as follows; 1)dispersion characteristic of each mode in dispersion curve is demon-strated that A0 mode propagating material surface is useful mode having the lest energy loss and not sensitive to surface condition. 2) it can be detected even the micro defect ($1\times2mm$) fabricated in ultrasonic probe flaw distance (290mm) to axis direction. 3) the wavelet transform which is called "time-frequency analysis" shows the Lamb wave propagation due to the change of materials characterization can be evaluated at each frequency and experimental group velocity of Lamb wave agrees quite well with that of simulated dispersion curve.ion curve.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.151-156
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• 2007

In this paper, the creep characteristics of lead and lead-free solder joint were investigated using the QFP(Quad Flat Package) creep test. Two kind of solder pastes(Sn-3Ag-0.5Cu, Sn-0.2Sb-0.4Ag-37.4Pb) were applied to the QFP solder joints and each specimen was checked the external and internal failures(i.e., wetting failure, void, pin hole, poor-heel fillet) by digital microscope and X-ray inspection. The creep test was conducted at the temperatures of $100^{\circ}C$ and $130^{\circ}C$ under the load of 15$\sim$20% of average pull strength in solder joints. The creep characteristics of each solder joints were compared using the creep strain-time curve and creep strain rate-stress curves. Through the comparison, the Sn-3Ag-0.5Cu solder joints have higher creep resistance than that of Sn-0.3Sb-0.4Ag-37.4Pb. Also, the grain boundary sliding in the fracture surface and the necking of solder joint were observed by FE-SEM.