• Title/Summary/Keyword: inspection machine

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Bridge Inspection System using Robot (로봇을 이용한 교량검사 시스템 개발에 관한 연구)

  • Lee, An-Yong;Oh, Je-Keun;Choi, Young-Jin
    • The Journal of Korea Robotics Society
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    • v.5 no.1
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    • pp.77-84
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    • 2010
  • This paper proposes a bridge inspection system using a robot to manage the safety status of bridges. A conventional bridge inspection has a lot of problems because inspection is conducted manually by human. As an alternative, we are to develop a robot system having machine vision and this robot system is mounted on an end linkage of specially designed car having seven DOF (Degrees Of Freedom) to inspect cracks beneath bridge. This system is able to check a status of the bridge and record its changes every other year. As a result, the developed robot system offers us the inspection result of quality and reliability about the bridge inspection status. Also, we have tested the effectiveness of the suggested system through outdoor experiments.

The GPU-based Parallel Processing Algorithm for Fast Inspection of Semiconductor Wafers (반도체 웨이퍼 고속 검사를 위한 GPU 기반 병렬처리 알고리즘)

  • Park, Youngdae;Kim, Joon Seek;Joo, Hyonam
    • Journal of Institute of Control, Robotics and Systems
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    • v.19 no.12
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    • pp.1072-1080
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    • 2013
  • In a the present day, many vision inspection techniques are used in productive industrial areas. In particular, in the semiconductor industry the vision inspection system for wafers is a very important system. Also, inspection techniques for semiconductor wafer production are required to ensure high precision and fast inspection. In order to achieve these objectives, parallel processing of the inspection algorithm is essentially needed. In this paper, we propose the GPU (Graphical Processing Unit)-based parallel processing algorithm for the fast inspection of semiconductor wafers. The proposed algorithm is implemented on GPU boards made by NVIDIA Company. The defect detection performance of the proposed algorithm implemented on the GPU is the same as if by a single CPU, but the execution time of the proposed method is about 210 times faster than the one with a single CPU.

Basic research, according to the inspection of crane equipment (크레인 설비의 검사에 따른 기초연구)

  • An, Tae-Keon;Shim, Kyu-Hyung;Rie, Dong-Ho
    • Journal of the Korea Safety Management & Science
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    • v.14 no.4
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    • pp.169-175
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    • 2012
  • Self-Inspection is being used in the workplace hazardous, dangerous machinery and equipment to build capacity for the voluntary safety risks due to use of machinery and prevention of industrial accidents that inspect facilities for safety issues, is to check. However, December 31, 2008 as part of Article 36 of the Occupational Safety and Health Act (safety inspection), the financial vanish as the self-test, Safety inspection program has been changed., In each individual workplace that creates its own standards and regulations to use the existing inspection system is in some cases. This study is located in the southeast industrial complex as a risk reducer manufacturer, machine-based target zones in S Corp owns most of the crane based on the results of the tests is to analyze the problem. Then check the results - to bring its measures and information you need to know for sure is to propose.

Measurement System for Phosphor Dispensing Shape of LED Chip Package Using Machine Vision (머신비전에 의한 LED Chip Package 형광물질 토출형상 측정)

  • Ha, Seok-Jae;Kim, Jong-Su;Cho, Myeong-Woo;Choi, Jong-Myung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.5
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    • pp.2113-2120
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    • 2013
  • In this study, an efficient machine vision based inspection system is developed for the in-line measurement of phosphor resin dispensing shapes on LED chip package. Since the phosphor resin (target material) has semitransparent characteristics, illuminated light beam is reflected from the bottom of the chip as well as from the surface. Since such phenomenon can deteriorate inspection reliability, a white LED and a 635nm laser slit beams are experimentally tested to decide suitable illumination optics. Also, specular and diffuse reflection methods are tested to decide suitable optical triangulation. As a result, it can be known that the combination of a white slit beam source and specular reflection method show the best inspection results. The Catmull-Rom spline interpolation is applied to the obtained data to form smoother surface. From the results, it can be conclude that the developed system can be sucessfully applied to the in-line inspection of LED chip packaging process.

Ray Tracing-based Simulation of Image Formation in an Equipment for Automated Optical Inspection (광선 추적법에 의한 자동 광검사 장비의 결상 과정 전산모사)

  • Jung, Sang-Chul;Lee, Yoon-Suk;Kim, Dae-Chan;Park, Se-Geun;O, Beom-Hoan;Lee, El-Hang;Lee, Seung-Gol;Park, Sung-Chan;Choi, Tae-Il
    • Korean Journal of Optics and Photonics
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    • v.20 no.4
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    • pp.223-229
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    • 2009
  • This paper describes the development of a simulator which can numerically calculate an image to be acquired in a machine vision system for automated optical inspection. The simulator is based on a ray tracing technique and composed of three modules which are an illuminating system, a specimen and an imaging system. Kinds of model parameters for modules and their values are carefully chosen from the direct measurement and the observation of related phenomena. Finally, the validity of the simulator is evaluated by logical analysis and by comparison with measured images.

NC Technology for High-Precision Machining in Machining Centers (머시닝센터에서 고정밀 가공을 위한 NC 기술)

  • 정성종
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1994.10a
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    • pp.748-754
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    • 1994
  • This paper deals with a geometric error simulator, measurement and inspection of workpiece errors on the machine tools, and identification and compensation methodology of thermal errors in machining centers. In order to raise the machining accuracy of workpieces a measurement and inspection system on the machine tool is developed. By using MPPGT module Manual and CNC type CMMs are realized on the machining centers. To compensate for geometric and thermal deformation errors of machining centers, a real time and an off line geometric adaptive control system were developed on the machining centers. A vertical and a horizontal machining center equipped with FANUC 0MC were used for experiments. Performance of the systems were confirmed with a large amount of experiment.

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A study on the automatic wafer alignment in semiconductor dicing (반도체 절단 공정의 웨이퍼 자동 정렬에 관한 연구)

  • 김형태;송창섭;양해정
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.12
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    • pp.105-114
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    • 2003
  • In this study, a dicing machine with vision system was built and an algorithm for automatic alignment was developed for dual camera system. The system had a macro and a micro inspection tool. The algorithm was formulated from geometric relations. When a wafer was put on the cutting stage within certain range, it was inspected by vision system and compared with a standard pattern. The difference between the patterns was analyzed and evaluated. Then, the stage was moved by x, y, $\theta$ axes to compensate these differences. The amount of compensation was calculated from the result of the vision inspection through the automatic alignment algorithm. The stage was moved to the compensated position and was inspected by vision for checking its result again. Accuracy and validity of the algorithm was discussed from these data.

Development of Remocon Appearance Inspection System Using Automated Machine Vision (자동화된 머신비전을 이용한 리모컨 외관 검사 시스템 개발)

  • Kang, Su-Min;Park, Se-Hyuk;Huh, Kyung-Moo
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.389-390
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    • 2006
  • The goal of this paper is automation of a remocon inspection process using machine vision system. This system prevents error that is occurred by physical and spirit condition of human. Also this system has been developed to raise the reliability of remocon inspection. This system has been developed only using PC, CCD Camera and Visual C++ for universal workplaces. The performance of this system is an accuracy improvement of $2{\sim}3[%]$ and a processing time reduction of about 100[ms] against existing pattern matching method.

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Study on Machine Vision Algorithms for LCD Defects Detection (LCD 결함 검출을 위한 머신 비전 알고리즘 연구)

  • Jung, Min-Chul
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.3
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    • pp.59-63
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    • 2010
  • This paper proposes computer visual inspection algorithms for various LCD defects which are found in a manufacturing process. Modular vision processing steps are required in order to detect different types of LCD defects. Those key modules include RGB filtering for pixel defects, gray-scale morphological processing and Hough transform for line defects, and adaptive threshold for spot defects. The proposed algorithms can give users detailed information on the type of defects in the LCD panel, the size of defect, and its location. The machine vision inspection system is implemented using C language in an embedded Linux system for a high-speed real-time image processing. Experiment results show that the proposed algorithms are quite successful.

Towing Tank Test assuming the Collision between Ice-going Ship and Ice Floe and Measurement of Ice Floe's Motion using Machine Vision Inspection (내빙선과 유빙의 충돌을 가정한 예인수조실험 및 머신비전검사를 이용한 유빙의 운동 계측)

  • Kim, Hyo-Il;Jun, Seung-Hwan
    • Proceedings of the Korean Institute of Navigation and Port Research Conference
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    • 2015.10a
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    • pp.33-34
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    • 2015
  • The voyage and cargo volume passing through the Arctic route (NSR) have been gradually increased. The ship-ice collision is one of the most biggest factors threatening the safety navigation of ice-going ships. A lot of researchers are trying to reveal the ship-ice collision mechanism. In this study, some tests that a model ship is forced to collide with disk-shaped synthetic ice are carried out in a towing tank. Then, ice floe's motion (velocity and trajectory) is measured by machine vision inspection.

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