Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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A study on the automatic wafer alignment in semiconductor dicing

반도체 절단 공정의 웨이퍼 자동 정렬에 관한 연구

  • 김형태 (한양대학교 대학원 정밀기계공학과) ;
  • 송창섭 (한양대학교 기계공학부) ;
  • 양해정 (한국산업기술대학교 기계설계학과)
  • Published : 2003.12.01
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Abstract

In this study, a dicing machine with vision system was built and an algorithm for automatic alignment was developed for dual camera system. The system had a macro and a micro inspection tool. The algorithm was formulated from geometric relations. When a wafer was put on the cutting stage within certain range, it was inspected by vision system and compared with a standard pattern. The difference between the patterns was analyzed and evaluated. Then, the stage was moved by x, y, $\theta$ axes to compensate these differences. The amount of compensation was calculated from the result of the vision inspection through the automatic alignment algorithm. The stage was moved to the compensated position and was inspected by vision for checking its result again. Accuracy and validity of the algorithm was discussed from these data.

Keywords

References

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