• 소프트웨어공모대전
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• 통권9호
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• pp.14-23
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• 2004

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.585-589
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• 2004

This paper deals with the algorithm development that inspects defects such as Lens Focus, Black Defect, Dim Defect, Color Defect, White Balance, and Line Defect caused by the process of Compact Camera Module (CCM). These days the demand of CCM goes on increasing in various types like PDA, a cellular phone and PC camera every year. However, owing to the defect inspection of CCM by the semiskilled work the average inspection time of CCM takes about 40 to 50 seconds. As time goes by the efficiency takes a sudden turn for the worse because workers must inspect with seeing a monitor directly. In this paper, to solve these problems, we developed the imaging processing algorithm to inspect the defects in captured image of assembled CCM. The performances of the developed inspection system and its algorithm are tested on many samples. Experimental results reveal that the proposed system can focus the lens of CCM within 5s and we can recognize various types of defect of CCM modules with good accuracy and high speed.

• 전기학회논문지P
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• 제60권4호
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• pp.206-213
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• 2011

Line sleeves, which used to connect ACSR cables when transmission lines were constructing, sometimes cause power transmission failure due to deterioration and corrosion. Therefore, power transmission line should be inspected regularly to prevent national disaster. Current inspection tool detects insertion length of transmission line on line sleeves, the inspection tool includes enormous error by operator. Moreover, the system is not controlled remotely, negligent accident would be caused while inspecting. To deal with those problems, KEPCO reviewed several ways to inspect line sleeves and proposes new method to inspect line sleeve by measuring magnetic flex which penetrate junction of steel and aluminum sleeve. The developed inspection tool is reliable enough to detect eccentric sleeves. Also, the developed inspection device was applied on actual transmission line and verified its effectiveness.

• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 2000년도 춘계공동학술대회 논문집
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• pp.469-472
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• 2000

Replacement policy of a degradation of system is investigated by incorporating the loss function defined by the deviation of the value of quality characteristic from its target value, which determines the loss cost . Two cost minimization problems are formulated : 1)determination of an optimal inspection period given the state for the replacement and 2)determination of an optimal state for replacement under fixed inspect ion period. Simulation analysis is performed to observe the variation of total cost with respect to the variation of the parameters of loss function, inspection cost, respectively. As a result, parameters of loss function are seen to be the most sensitive to the total cost. On the contrary, inspect ion cost is observed to be insensitive.

• 해양환경안전학회:학술대회논문집
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• 해양환경안전학회 2005년도 추계학술대회지
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• pp.191-196
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• 2005

칩의 마크는 종류별로 다르고 매우 작아서 작업자가 육안 검사로 처리하기에는 매우 어려운 작업이다. 본 논문에서는 칩의 마크를 인식하여 잘못된 마크를 판별하는 마크 자동 검사 시스템에 대하여 제안한다. 불량 항목을 검사하기 위해서 템플릿 매칭 방법과 다양한 불량 판별 조건을 사용한다. 그리고 불량판별 조건은 문자 ROI 명암도, 문자 ROI 매칭, 문자 명암도, 브로컨, 브렌치로 분류된다. 제안된 방법은 마크 불량 판별에 커다란 성능향상이 보임을 일련의 실험들을 통하여 보여준다.

• 한국항행학회논문지
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• 제15권3호
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• pp.405-411
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• 2011

현재의 정보화 사회에서는 정보의 가치는 매우 높아졌으며, 정보를 획득, 관리, 사용하는 것에 대한 많은 연구 개발이 이루어지고 있다. 특정 기업(또는 기관)에서는 기업 내의 정보가 담긴 문서들의 보안 레벨을 엄격하게 규정하고 이에 대한 보안을 철저히 지키고 있다. 본 논문에서는, 상위 보안 레벨의 보안 문서를 하위 보안 레벨로 변환할 경우를 위해, 효과적으로 문서를 검열하고 특정 보안 키워드를 일반적인 단어로 변경하는데 필요한 요소 기술에 대해 소개한다.

• Tribology and Lubricants
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• 제26권6호
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• pp.341-345
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• 2010

The NAUT(Non contact Air coupled Ultrasonic Testing) is one of the ultrasonic wave inspection methods. It compensates High power ultrasound Pulser Receiver, pre-amp, air probe of high sensitivity in air to generate loss energy by NAUT methods. Generally, in case of ultrasound inspection, it applies contact methods by using couplant. However it can inspect of UT without couplant by this NAUT. The ultrasound transmission reception is composed in stable condition in NAUT. It can inspect high low material or the specimen of rough part, the narrow spot, too. The spot welding is applying the inosculation of automobile component, car body, all boards. The CFRP is necessity of NDE because of the solidity changes material according to lamella tearing. Therefore it checked on realization whether and commercialization in the spot welding and CFRP inspection that the NAUT would be applied them.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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• pp.109-112
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• 1996

The more integrated and smaller SMD are needed, new solder joints packaging technologies are developed in these days such as BGA(Ball Grid Array), Flip Chip, J-lead etc. But, it's unable to inspect solder joints in those devices by visual inspection methods, because they are hided by it's packages. To inspect those new SMD packages, an X-ray system for acquiring a cross-sectional image of a arbitrary plane is necessary. In this paper, an analysis for designing X-ray cross sectional imaging system is presented including the way for correcting the distortion of image intensifier. And we show computer simulation of that system with a simple PCB model to show it's usefulness in applying PCB solder joint inspection.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.771-774
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• 2000

Coiling processes of filaments need precise work and standardization. It is important to maintain equal pitch of filaments. Uniform pitch of filaments is one of the dominant elements of life time and efficiency of bulbs. First coiling process of filament wires is modeled by nonlinear contact problem between filaments and mandrel. Analysis of coiling process using finite element method is conducted to consider manufacturing parameters and pitch distance is calculated under the given conditions. Also image detecting system is developed to inspect uniformity of pitch. This system will be used to inspect quality of filaments during coiling processes.

• International Journal of Fuzzy Logic and Intelligent Systems
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• 제6권2호
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• pp.95-99
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• 2006

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and to inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++ on Windows with easily usable GUI. Using this system, we can automatically measure and inspect the quality of ail feeders in production process by analyzing the measurement results statistically.