• Restorative Dentistry and Endodontics
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• v.17 no.2
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• pp.343-354
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• 1992

The purpose of this study was to analyze the relationship between linear and volumetric measurements of apical dye penetration in canals obturated by various kinds of methods. The canals of 108 roots without crown were conventionally prepared and randomly assigned to four group. The canals of group I a2 were obturated by lateral condensation with sealer, group II a2 by thermoplasticized low-temperature ($70^{\circ}C$) gutta-percha with sealer, group III by Thermafil endodntic obturation with sealer and group IV by injection-molded thermop-lasticized guttapercha One mm of root apex was exposed to a 2 % methylene blue solution at $7^{\circ}C$or 10 days, and the quality of apical seals was assessed by measuring the leakage linearly and volumetrically. The obtained results were as follows: In linear measurements, group II showed significanty less leakage than group III, I and group III also showed less than group N, but no statistically significant difference was demonstrated between the others. In volumetric measurements, group II showed significantly less leakage than group I and II, and no significant differnce from group III. There was a weak significant correlation between the linear measurement and the volumetric measurement(r=0.3391, P<0.001).

• Fire Science and Engineering
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• v.28 no.5
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• pp.8-13
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• 2014

The purpose of this study is to analyze the damage pattern when overcurrent is applied to a thermal magnetic type molded case circuit breaker (MCCB) using a Primary Current Injection Test System (PCITS). When an overcurrent of 150 A was applied to the PCITS for 5 seconds with the trip bar of an MCCB being damaged, it was found that the surface of the temperature control device (bimetallic strip) positioned at the right was significantly carbonized. When an overcurrent of 300 A was applied to the PCITS for 5 s under the same conditions, the entire temperature control device was deteriorated, becoming flattened and in close contact with the MCCB. When an overcurrent of 450 A was applied to the PCITS for 5 s, the coil of the temperature control device was melted and disconnected. In addition, it was observed that the contacts, the enclosure and upper cover were deformed and there was a trace of carbonization on them. When approximately 3 s had elapsed after an overcurrent of 600 A was applied, white smoke occurred inside the MCCB and a flame was radiated out, after which the overcurrent supply stopped with "phutt" (whomp) sound. It was observed that when the same type of MCCB is damaged by a general flame, the surfaces of its handle, terminal, arc divider (extinguisher) and temperature control device were carbonized uniformly. In addition, it was found that the trip bar of the operating mechanism was melted down and the metal operation pin was moved while being tripped.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.1-12
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• 2023

In the current era of the global mobile smart device revolution, electronic devices are required in all spaces that people interact with. The establishment of the internet of things (IoT) among smart devices has been recognized as a crucial objective to advance towards creating a comfortable and sustainable future society. In-mold electronic (IME) processes have gained significant industrial significance due to their ability to utilize conventional high-volume methods, which involve printing functional inks on 2D substrates, thermoforming them into 3D shapes, and injection-molded, manufacturing low-cost, lightweight, and functional components or devices. In this article, we provide an overview of IME and its latest advances in application. We review biomimetic nanomaterials for constructing self-supporting biosensor electronic materials on the body, energy storage devices, self-powered devices, and bio-monitoring technology from the perspective of in-mold electronic devices. We anticipate that IME device technology will play a critical role in establishing a human-machine interface (HMI) by converging with the rapidly growing flexible printed electronics technology, which is an integral component of the fourth industrial revolution.