• International Journal of Advanced Culture Technology
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• v.10 no.4
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• pp.569-575
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• 2022

This is a research thesis on the development of a monitoring and diagnosis device that prevents the risk of an accident through monitoring and diagnosis of a modular Main Circuit Breaker (MCB) using Vacuum Interrupter (VI) for Korean high-speed rolling stock. In this paper, a comprehensive MCB monitoring and diagnosis was performed by converging vacuum level diagnosis of interrupter, operating coil monitoring of MCB and environmental temperature/humidity monitoring of modular box. In addition, to develop an algorithm that is expected to have a similar data processing before the actual field test of the MCB monitoring and diagnosis device in 2023, the cluster analysis and factor analysis were performed using the WEKA data mining technique on the big data of Korean railroad transformer, which was previously researched by Tae Hee Evolution with KORAIL.

• Progress in Superconductivity and Cryogenics
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• v.8 no.4
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• pp.22-25
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• 2006

This paper deals with the computation of the current limiting behavior of high-temperature superconducting (HTS) modules for the superconducting fault current limiter (SFCL). The SFCL module consists of a monofilar type BSCCO-2212 tube and a shunt coil made of copper or brass. The shunt coil is connected to the monofilar superconducting tube in parallel. Through analysis of the quench behavior of the monofilar component with shunt coils, it is achieved to drive an equivalent circuit equation from the experimental circuit structure. In order to analyze the quench behavior of the SFCL module, we derived a partial differential equation technique. Inductance of the monofilar component and the impedance of the shunt coil are calculated by Bio-Savart and Ohm's formula, respectively. We computed the quench behavior using the calculated values, and compared the results with experimental results for the quench characteristics of a component. The results of computation and test agreed well each other, and it was concluded that the analytic result could be applied effectively to design of the distribution-level SFCL system.

• Journal of Applied Reliability
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• v.12 no.2
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• pp.67-78
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• 2012

An electric double-layer capacitor(EDLC) is an electrochemical capacitor with relatively high energy density, typically hundreds of times greater than conventional electrolytic capacitors. EDLCs are widely used for energy storage rather than as general-purpose circuit components. They have a variety of commercial applications, notably in energy smoothing and momentary-load devices, and energy-storage and kinetic energy recovery system devices used in vehicles, etc. This paper presents an accelerated degradation test of an EDLC with rated voltage 2.7V, capacitance 100F, and usage temperature $-40^{\circ}C{\sim}65^{\circ}C$. The EDLCs are tested at $50^{\circ}C$, $60^{\circ}C$, and $70^{\circ}C$, respectively for 1,750hours, and their capacitances are measured at predetermined times by constant current discharge method. The failure times are predicted from their capacitance deterioration patterns, where the failure is defined as 30% capacitance decrease from the initial one. It is assumed that the lifetime distribution of EDLC follows Weibull and Arrhenius life-stress relationship holds. The life-stress relationship, acceleration factor, and $B_{10}$ life at design condition are estimated by analyzing the accelerated life test data.

• Proceedings of the KIEE Conference
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• 1999.07a
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• pp.232-234
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• 1999

A 30kVA superconducting generator (S.G.) has been designed, developed and successfully tested in KERI before the end of last year. The design is based on 2-dimensional electromagnetic field analysis of cylindrical coordinate. The field winding of rotor has been wound with superconducting wire of Nb-Ti alloy and tested after assembled with other rotor components. The stator has air-gap type armature windings which allow higher terminal voltage and more sinusoidal voltage waveform than conventional iron cored machines. Steady-state open & short-circuit test and lamp load test have been conducted also. The results of tests are given in this paper and compared with design quantities. Moreover the cooling scheme and characteristics of test system is included.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.9
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• pp.1858-1864
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• 2009

In this paper, we design a non-volatile memory IP, 1-kb one-time programmable (OTP) memory, used for power management ICs. Since a conventional OTP cell uses an isolated NMOS transistor as an antifuse, there is an advantage of it big cell size with the BCD process. We use, therefore, a PMOS transistor as an antifuse in lieu of the isolated NMOS transistor and minimize the cell size by optimizing the size of a OTP cell transistor. And we add an ESD protection circuit to the OTP core circuit to prevent an arbitrary cell from being programmed by a high voltage between the terminals of the PMOS antifuse when the ESD test is done. Furthermore, we propose a method of turning on a PMOS pull-up transistor of high impedance to eliminate a gate coupling noise in reading a non-programmed cell. The layout size of the designed 1-kb PMOS-type antifuse OTP IP with Dongbu's $0.18{\mu}m$ BCD is $129.93{\times}452.26{\mu}m^2$.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.49-56
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• 2012

Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.723-728
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• 2011

Since the performance of a vacuum circuit breaker (VCB) mainly depends on the spring operating mechanism, an analysis of the spring operating mechanism is required in order to improve the design of a VCB. In this study, the static stiffness of the spring was determined by using a material testing machine, and the test results were used to model the spring through computer simulation. The multi-body dynamic model of the spring was established by using the RecurDyn program. The dynamic model was verified by comparing the results of stem displacements and rotating angles of the brake shaft obtained from the simulation and from the experiments. After verification of the dynamic model of VCB, the cam profile of the VCB was optimized through multi-body dynamics simulation in order to improve the performance of the closing mechanism.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.9
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• pp.1189-1194
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• 2013

The Intermediate Heat Exchanger (IHX) of a Very High Temperature Reactor (VHTR) is a core component that transfers the high heat of $950^{\circ}C$ generated in the VHTR to a hydrogen production plant. The Korea Atomic Energy Research Institute manufactured a lab-scale prototype of a Printed Circuit Heat Exchanger (PCHE) as a candidate for an IHX. In this study, as a part of a high-temperature structural integrity evaluation of the lab-scale PCHE prototype made of SUS316L, we carried out high temperature structural analysis modeling and macroscopic thermal and elastic structural analysis for the lab-scale PCHE prototype under helium experimental loop (HELP) test conditions as a precedent study prior to the performance test in HELP.

• Journal of IKEEE
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• v.24 no.1
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• pp.52-58
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• 2020

This paper describes a hardware implementation of a true random number generator (TRNG) for information security applications. A new approach for TRNG design was proposed by adopting random transition rules in cellular automata and applying different transition rules at every time step. The TRNG circuit was implemented on Spartan-6 FPGA device, and its hardware operation generating random data with 100 MHz clock frequency was verified. For the random data of 2×10⁷ bits extracted from the TRNG circuit implemented in FPGA device, the randomness characteristics of the generated random data was evaluated by the NIST SP 800-22 test suite, and all of the fifteen test items were found to meet the criteria. The TRNG in this paper was implemented with 139 slices of Spartan-6 FPGA device, and it offers 600 Mbps of the true random number generation with 100 MHz clock frequency.