• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.7
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• pp.63-70
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• 2004

This paper describes the link layer and physical layer of the Serial ATA which is the next generation for parallel ATA specification that defines data transfer between PC and peripheral storage devices. The link layer consists of CRC generation/error detection, 8b/10b decoding/encoding, primitive generation/detection block. For the physical layer, it includes CDR(Cock Data Recovery), transmission PLL, serializer/de-serializer. It also includes generation and receipt of OOB(Out-Of-Band) signal, impedance calibration, squelch circuit and comma detection/generation. Additionally, this chip includes TCB(Test Control Block) and BIST(Built-In Selt Test) block to ease debugging and verification. It is fabricated with 0.18${\mu}{\textrm}{m}$ standard CMOS cell library. All the function of the link layer operate properly. For the physical layer, all the blocks operate properly but the data transfer is limited to the 1.28Gbps. This is doe to the affection or parasitic elements and is verified with SPICE simulation.

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• The Journal of the Korea institute of electronic communication sciences
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• v.18 no.4
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• pp.641-648
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• 2023

Recently, the rapid growth of artificial intelligence among the 4th industrial revolution has progressed based on the performance improvement of semiconductor, and circuit integration. According to transistors, which help operation of internal electronic devices and equipment that have been progressed to be more complicated and miniaturized, the control of heat generation and improvement of heat dissipation efficiency have emerged as new performance indicators. The DUT(Device Under Test) Shell is equipment which detects malfunction transistor by evaluating the durability of transistor through heat dissipation in a state where the power is cut off at an arbitrary heating point applying the rating current to inspect the transistor. Since the DUT shell can test more transistor at the same time according to the heat dissipation structure inside the equipment, the heat dissipation efficiency has a direct relationship with the malfunction transistor detection efficiency. Thus, in this paper, we propose various method for PCB configuration structure to optimize heat dissipation of DUT shell and we also propose various transformation and thermal analysis of optimal DUT shell using computational fluid dynamics.

• Journal of The Korean Association For Science Education
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• v.22 no.4
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• pp.862-871
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• 2002

We investigated elementary students' conceptions of the simple electric circuit using a battery, a bulb and a wire, and made comparison between the cognitive conflict through peer discussion and the cognitive conflict through physical experience. Two hundred and sixty-four sixth grade students who already had learned about the electric circuit were participated. The questionnaire to investigate the student's conceptions about simple electric circuit consisted of 5 items drawing the wire connections between a battery and a bulb to light the bulb. The students in the discussion group paired randomly with student who had different conceptions, and then each pairs discussed about their ideas freely with each other. After discussion they conducted CCLT(Cognitive Conflict Level Test) which consisted of 4 factors; recognition, interest, anxiety, reappraisal. The physical experience group conducted a task in which they connected a battery and a bulb with a wire, then conducted CCLT. The sixth graders had various misconceptions. Most students were not aware of the scope of negative battery terminal and two electric terminals of a bulb. Many students emphasized the tip of a bulb and positive battery terminal. The score of CCLT in the discussion group was higher than in the physical experience group. This results showed that discussion with peers was more effective than physical experience to arouse cognitive conflict.

• Korean Journal of Materials Research
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• v.8 no.6
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• pp.513-519
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• 1998

Zr-Si binary alloys containing 0.01 to O.lwt.%Si were prepared to investigate the effect of Si on the corrosion behavior of Zr. Corrosion test was performed in pure water at 36$0^{\circ}C$ under a pressure of 2660psi for 100days. The alloys containing 0.01 wt. % and 0.05wt. %Si had the black and uniform oxide film and didn't show the transition of corrosion rate. However. the alloys containing O.lwt.%Si had white oxide film and showed the trasition of corrosion rate at 70 days corrosion test. The weight gain increased with the increasing Si content from 0.01 to 0.1 wt.%. The variation of Si contents had no effect on changing the oxide structure but had significant effect on the electrical resistivity of oxide. The electrical resistivity decreased with increasing Si content. The fraction of precipitates in the Zr-Si binary alloys. identified as tetragonal $Zr_{3}$Si increased with increasing Si content. The increase of the volume fraction of precipitates is thought to be responsible for the increase of weight gain due to short circuit effect of precipitate.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.2
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• pp.184-193
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• 2015

This paper proposes a cost-efficient and automatic method for large data acquisition from a test chip without expensive equipment to characterize random process variation in an integrated circuit. Our method requires only a test chip, a personal computer, a cheap digital-to-analog converter, a controller and multimeters, and thus large volume measurement can be performed on an office desk at low cost. To demonstrate the proposed method, we designed a test chip with a current model logic driver and an array of 128 current mirrors that mimic the random process variation of the driver's tail current mirror. Using our method, we characterized the random process variation of the driver's voltage due to the random process variation on the driver's tail current mirror from large volume measurement data. The statistical characteristics of the driver's output voltage calculated from the measured data are compared with Monte Carlo simulation. The difference between the measured and the simulated averages and standard deviations are less than 20% showing that we can easily characterize the random process variation at low cost by using our cost-efficient automatic large data acquisition method.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.2
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• pp.277-281
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• 2007

We investigated fault current limitation characteristics of the resistive superconducting fault current limiter (SFCL) which consisted of a Bi-2212 bulk coil and a shunt coil. The Bi-2212 bulk coil and the shunt coil were connected in parallel. The Bi-2212 bulk coil was placed inside the shunt coil to induce field-assisted quench. The fault test was conducted at an input voltage of $200V_{rms}$ and fault current of $12kA_{rms}\;and\;25kA_{rms}$. The fault conditions were asymmetric and symmetric, and the fault period was 5 cycles. The test results show that the SFCL successfully limited the fault current of $12kA_{rms}\;and\;25kA_{rms}$ to below $5.5{\sim}6.9kA_{peak}\;within\;0.64{\sim}2.17$ msec after the fault occurred. Limitation was faster under symmetric fault test condition due to the larger change rate of current. We concluded that the speed of fault current limitation was determined by the speed of current rise rather than the amplitude of a short circuit current. These results show that the Bi-2212 bulk coil is suitable for distribution-class SFCLS.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.639-640
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• 2006

We investigated fault current limitation characteristics of the resistive superconducting fault current limiter(SFCL) which consisted of a Bi-2212 bulk coil and a shunt coil. The Bi-2212 bulk coil and the shunt coil were connected in parallel. The Bi-2212 bulk coil was placed inside the shunt coil to induce field-assisted quench. The fault test was conducted at an input voltage of 200 $V_{rms}$ and fault current of 12 $kA_{rms}$ and 25 $kA_{rms}$. The fault conditions were asymmetric and symmetric, and the fault period was 5 cycles. The test results show that the SFCL successfully limited the fault current of 12 $kA_{rms}$ and 25 $kA_{rms}$ to below $5.5{\sim}6.9kA_{peak}$ within $0.64{\sim}2.17$ msec after the fault occurred. Limitation was faster under symmetric fault test condition due to the larger change rate of current. We concluded that the speed of fault current limitation was determined by the speed of current rise rather than the amplitude of a short circuit current. These results show that the Bi-2212 bulk coil is suitable for distribution-class SFCLs.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.19 no.2
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• pp.77-86
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• 2005

The DC protection and control device for the feeding system of a Light Rail Transit(LRT) system is developed. For the development, the short circuit characteristics in the system are analyzed. As a result a protection algorithm for the DC fault selective relay (50F) is newly proposed, and principles of the DC fault selective relay, Line Test Device (LTD), DC Over Current Relay (DC OCR) are introduced From the development, the specifications and codes used to be unclear have become clarified and summarized. Moreover, the methods to examine the protective characteristics and Electromagnetic Compatibility (EMC) are established Finally, the performance and the effectiveness of the developed protective relay have been verified with the test based on IEC. For the reliability of the system, the relay has been installed and is being operated at the test track of the LRT system at Gyeong-San.

• Journal of IKEEE
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• v.20 no.3
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• pp.310-313
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• 2016

In this paper, we propose the tester apparatus for 48 channel GM Tube sensor. The proposed apparatus can test up to 48 channel GM tube simultaneously to detect the defect and analyze the sensor characteristic. 300-1000V variable high voltage generation circuit is utilized for the apparatus suitable for the sensor characteristic. Thus, the proposed system is useful for various GM Tube sensor characteristic analysis. Multiple sensor testing environment is established for the early detection of the defect and the analysis to reduce the costs for manufacturing and rework. Developed 48 channel GM Tube sensor test is evaluated with certified testing equipment and shows excellent performance with respect to the uncertainty of the sensor test results.