• The Transactions of the Korean Institute of Electrical Engineers B
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• v.48 no.12
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• pp.686-691
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• 1999

In a switching power supply, the high frequency switching makes the passive components small, but the losses and the stresses of switches are increased by the switching frequency. Therefore, zero crossing technology using resonant is used to improve defect in high switching. In generally, zero crossing switching consists of Zero Current Switching(ZCS) and Zero Voltage Switching(ZVS). This paper proposes A Buck ZC-ZVS Converter with Reduced Conduction Losses. Comparing with a conventional Buck ZC-ZVS Converter, the proposed converter operates with the smaller rated power. This is achieved by changing the auxiliary switch position, which reduces its rating power. Simulation results using Pspice program about test circuit with rated 160W(30V, 5.3A) at 30kHz and experiment result under same condition were described in the paper.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.5
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• pp.61-66
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• 2011

An accidental disconnection of power supply for operating theatres may result in fatal accidents. Thus, it is necessary to import the electric safety system in medical locations. This paper shows an analysis of simulation for the safety in medical IT system based on KS C IEC 60364-7-710(Electrical Installations of Buildings - Requirements for special installations or locations - Medical locations). The analysis was progressed by measuring leakage currents according to variation of volts, circuits and loads. And it was made database for calculation the reasonable length of branch circuit.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.11a
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• pp.541-544
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• 2005

In this paper, admittance is introduced to represent electro-mechanical characteristics of piezoelectric structures and to predict the performance of piezoelectric shunt system. Finite element method is used to obtain numerical admittance. In order to illuminate the effect of noise reduction in the shunt system, two experimental setups were constructed. One is for matching the resonant shunt damping. The other is a standard test setup according to SAE J1400 used to measure the transmission loss for the smart panel with shunt circuit. Shunt performance and noise reduction of smart panel are realized by these two experiments.

• Journal of Hydrogen and New Energy
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• v.33 no.4
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• pp.353-362
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• 2022

In this study, water diffusion in proton exchange membrane fuel cell at open circuit voltage (OCV) was analyzed through experiment. First, the reliability of the micro-sensor (SHT31) was verified. It was concluded the micro-sensor has an excellent reliability at 60℃ and 70℃. After the sensor reliability test, the temperature and relative humidity measurement in bipolar-plate was conducted at OCV. To analyze water distribution and water flux, the temperature and relative humidity was converted into dew point. To the end, it was found water concentration affects water diffusion.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.9
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• pp.44-53
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• 1999

Generating diagnostic test patterns for combinational circuits remain to be a very difficult problem. For example, ISCAS85 c7552 benchmark circuit has 100 million fault pairs, Thus, we need more sophisticated algorithm to get more information. A new diagnostic algorithm for test pattern generation is suggested and implemented in this paper. DIATEST algorithm based on PODEM is also implemented for comparison to the new algorithm. These two algorithms have been applied to ISCAS85 benchmark circuits. Experimental results show that (1) both algorithms achieve fault pair coverage over 99%, (2) total test length of the new algorithm is much shorter than that of DIATEST, and (3) the new algorithm gives much more information used for making diagnostic dictionary, diagnostic decision tree or diagnostic test system despite DIATEST is faster than the new algorithm.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.7
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• pp.34-41
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• 1999

In this paper, hot carrier induced performance degradation of peripheral circuits in memory devices such as static type imput buffer, latch type imput buffer and sense amplifier circuit has been measured and analyzed. The used design and fabrication of the peripheral circuits were $0.8 {\mu}m$ standard CMOS process. The analysis method is to find out which device is most significantly degraded in test circuits by using spice simulation, and then to characterize the correlation between device and circuit performance degradation. From the result of the performance degradation of static type input buffer, the trip point was increased due to the transconductance degradation of NMOS. In the case of latch type input buffer, there was a time delay due to the transconductance degradation of NMOS device. Finally, hot carrier induced the decrease of half-Vcc voltage and the increased of sensing voltage in sense amplifier circuits have been measured.

• The Transactions of the Korean Institute of Power Electronics
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• v.12 no.5
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• pp.400-408
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• 2007

In this paper, development of the 8kW parallel module converter is presented. For a effective configuration of FB-PWM converter, this paper proposes 4-parallel operation of 2 kw-module. FB converter of 2-kW module is controlled by phase shut PWM and in order to achieve ZVZCS, the simple auxiliary circuit is applied in secondary side. In order to achieve ZCS, control logic for auxiliary circuit operation is designed to reset the primary current during free-wheeling period. For output current sharing of 4-modules, the charge control is employed. The charge control logic is designed with phase shift PWM logic. Voltage controller is implemented by using DSP(TMS320LF2406) with A/D conversion data of the output current and voltage of each module. The developed converter is installed in PCU(Power Conditioning Unit) for HSG(High Speed Generator) in a vehicle and health monitoring system is implemented for vehicle operation test. Finally, performance of the developed converter is proved under practical operation of HSG.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.7 no.5
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• pp.97-105
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• 2008

The micro capacitors are passive elements necessary to electronic circuits and wireless portable PAN(personal area network) and Mobile Communications device modules in the baseband circuits in combination with another passive and active devices. As capacitance is proportionally increased with dielectric constant and electrode areas, in addition, inversely decreased the thickness of the dielectric material, thus thin film capacitors are generally seen as a preferable means to achieve high performance and thin film capacitors are used in a variety of functional circuit devices. In this paper, propose dielectric material as AIN(Aluminium nitride) to make micro thin film capacitor, and this capacitor has the MIM(metal-insulator-metal) structure. AIN thin films are widespread applied because they had more excellent properties such as chemical stability, high thermal conductivity, electrical isolation and so on. In addition, AIN films show low frequency response for baseband signal ranges, I-V and C-V electrical characterization of a thin film micro capacitor. The above experimental test and estimated results demonstrate that the thin film capacitor has sufficient and efficient functional performance to be the baseband range frequency of general electronics circuit and passive device applications.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.223-223
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• 2009

In this paper, designed and simulated Power Splitter (PS) integrated Mach-Zehnder interferometer (MZI) based planar type optical waveguide devices (which is called here a PS-MZI). The PS-MZI optical waveguide sensor was preceded by a Y-junction, which splits the input power between the sensor, and a reference branch, to minimize the effect of optical power variations. The PS-MZI optical waveguide sensor induced changing phases of the incident beam, which had fallen upon the waveguide through computer simulation, according to the small changes in the index of refraction, thus beam intensity was changed. The waveguide were optimized at a wavelength of 1550 nm and fabricated according to the design rule of 0.45 delta%, which is the difference of refractive index between the core and clad. The fabrication of PS-MZI optical waveguide sensor was performed by a conventional planar lightwave circuit (PLC) fabrication process. The PS-MZI optical waveguide that was fabricated to be applied as a biosensor revealed a low insertion loss and a low polarization-dependent loss. After having etched the over-clad at the sensor part in the MZI optical waveguide that was fabricated, Ti deposition was made on the adhesion layer, and then Au thin-film deposition was carried out thereon. In addition, its optical properties were measured by having changed the index of refraction oil at the sensing part of the MZI. To apply the planar type PS-MZI optical waveguide as a biosensor, a detection test for Staphylococcus aureus was conducted according to changes in concentration, having adopted Ti-alkoxide as ligand. The detection result of the S. aureus by the PS-MZI optical waveguide sensor was possible to the level of $10^1$ CFU/ml.