• 대한치과보철학회지
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• 제33권3호
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• pp.584-609
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• 1995

The purpose of this study was to evaluate the difference of the galvanic corrosion behaviour of the titanium in contact with gold alloy, silva-palladium alloy, and nickel-chromium alloy using the immersion and electrochemical method. And the effects of galvallit couples between titanium and the dental alloys were assessed for their usefulness as materials for superstructure. The immersion method was performed by measuring the amount of metal elementsreleased by Inductivey coupled plasma emission spectroscopy(ICPES) The specimen of fifteen titanium plates, the five gold alloy, five silver-palladium, five nickel-chromium plates, and twenty acrylic resin plates ware fabricated, and also the specimen of sixty titanium plugs, the thirty gold alloy, thirty silver-palladium, and nickelc-hromium plugs were made. Thereafter, each plug of gold alloy, silver-palladium, and nickel-chromium inserted into the the titanium and acrylic resin plate, and also titanium plug inserted into the acrylic resin plate. The combination specimens uf galvanic couples immersed in 70m1 artificial saliva solution, and also specimens of four type alloy(that is, titanium, gold, silver-palladium and nickel-chromium alloy) plugs were immersed solely in 70m1 artificial sativa solution. The amount of metal elements released was observed during 21 weeks in the interval of each seven week. The electrochemical method was performed using computer-controlled potentiosta(Autostat 251. Sycopel Sicentific Ltd., U.K). The wax patterns(diameter 11.0mm, thickness,in 1.5mm) of four dental casting alloys were casted by centrifugal method and embedded in self-curing acrylic resin to be about $1.0cm^2$ of exposed surface area. Embedded specimens were polished with silicone carbide paper to #2,000, and ultrasonically cleaned. The working electrode is the specimen of four dental casting alloys, the reference electrode is a saturated calmel electrode(SCE) and the ounter electrode is made of platinum plate. In the artificial saliva solution, the potential scanning was carried out starting from-700mV(SCE) TO +1,000mV(SCE) and the scan rate was 75mV/min. Each polarization curve of alloy was recorded automatically on a logrithmic graphic paper by XY recorder. From the polarization curves of each galvanic couple, corrosion potential and corrosion rates, that is, corrosion density were compared and order of corrosion tendency was determined. From the experiments, the following results were obtained : 1. In the case of immersing titanium, gold alloy, silver-palladium alloy, and nickel-chromium alloysolely in the artificial saliva solution(group 1, 2, 3, and 4), the total amount of metal elements released was that group 4 was greater about 2, 3 times than group 3, and about 7.8 times than group 2. In the case of group 1, the amount of titanium released was not found after 8 week(p<0.001). 2. In the case of galvanic couples of titanium in contact with alloy(group 5, 6), the total amount of metal elements released of group 5 and 6 was less than that of group 7, 8, 9, and 10(p<0.05). 3. In the case of galvanic couples of titanium in contact with silver-palladium alloy(group 7, 8), the total amount of metal elements released of group 7 was greater about twice than that of group 5, and that of group 8 was about 14 times than that of group 6(p<0.05). 4. In the case of galvanic couples of titanium in contact with nickel-chromium alloy(group 9, 10), the total amount of metal elements released of group 9 and 10 was greater about 1.8-3.2 times than that of group 7 and 8, and was greater about 4.3~25 times than that of group 5 and 6(p<0.05). 5. In the effect of galvanic corrosion according to the difference of the area ratio of cathode and anode, the total amount of metal elements released was that group 5 was greater about 4 times than group 6, group 8 was greater about twice than group 7, and group 10 was greater about 1.5 times than group 9(p<0.05). 6. In the effect of galvanic corrosion according to the elasped time during 21 week in the interval of each 7 week, the amount of metal elements released was decreased markedly in the case of galvanic couples of the titanium in contact with gold alloy and silver-palladium alloy but the total amount of nickel and beryllium released was not decreased markedly in the case of galvanic couples of the titanium in contact with nickel-chromium alloy(p<0.05). 7. In the case of galvanic couples of titanium in contact with gold alloy, galvanic current was lower than any other galvanic couple. 8. In the case of galvanic couples of titanium in contact with nickel-chromium alloy, galvanic current was highest among other galvanic couples.

• Elastomers and Composites
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• 제43권4호
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• pp.264-270
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• 2008

3-아미노프로필메톡시 실란을 처리한 반응성 있는 유리표면 위에 "LbL" 방법을 사용하여 $\alpha$-D-만노실 풀러렌[$C_{60}$]-금 나노입자를 자기조립 하였다. 표면 처리한 유리막을 $\alpha$-D-만노실 풀러렌[$C_{60}$]과 헥산 티올레이트/아미노 티오페녹사이드-금나노입자를 포함하고 있는 용액속에 교대로 담그었다. $\alpha$-D-만노실 풀러렌[$C_{60}$] -금 나노입자 필름을 시간에 따라 다중성(5층)막으로 제조하였다. 자외선-가시광선 분광기를 사용한 자기조립 나노입자 필름의 분석은 530 nm 일 때 금 나노입자의 표면 플라스몬 밴드로 인해 다중성(5층)막이 형성되는 것을 보여주었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.120.2-120.2
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• 2017

본 연구에서는 고신뢰성 인쇄회로기판이나 플립칩 패키지에 적용되는 범프 표면처리에서 널리 사용되는, ENIG나 ENEPIG 대체를 위한 electroless Pd/immersion Au(EPIG)에 대하여 연구하였다. Transmission electron microscopy(TEM) 분석 결과 형성된 Au layer는 crystalline, Pd layer는 amorphous 임을 확인하였으며, 열처리 후 X-Ray photoelectron spectroscopy(XPS)를 통하여 EPIG층이 하부 copper의 확산방지막으로서 효과가 있음을 알 수 있었다. 또한, 비정질 Pd layer가 확산을 방지하기 위하여는 일정수준 이상의 두께가 필요하며, 그 두께는 35~65nm 수준임을 알 수 있었다.

• 한국표면공학회지
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• 제55권5호
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• pp.299-307
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• 2022

Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.

• 마이크로전자및패키징학회지
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• 제15권3호
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• pp.27-33
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• 2008

PDA, 핸드폰과 같은 포터블 제품의 사용이 급증함에 따른 전자 제품의 사용 환경의 변화는 제품의 솔더 조인트 신뢰성을 더욱 필요로 하게 되었다. 무전해 니켈/금 도금 표면 처리는 솔더링 특성이 우수하고, 표면처리 두께가 균일하며 패키징 공정에서 사용되는 광학설비에서 인식이 잘되기 때문에 미세피치 SMT 디바이스와 BGA 기판에 폭넓게 사용되고 있다. 그러나 무전해 니켈/금 도금 표면과 솔더 계면에서 발생되는 취성 파괴가 문제점으로 지적되고 있다. 솔더의 취성 파괴는 솔더링시 금속간 화합물과 무전해 니켈층 사이에 형성된 P-rich 영역의 갈바닉 니켈 부식에 의한 black pad 현상에 기인한다. 이론적으로 평탄한 무전해 Ni표면은 무전해 금도금 과정 중 도금액의 균일하게 순환되기 때문에 black pad 발생을 억제하는 장점을 가지고 있다. 그러나 이러한 장점에도 불구하고 무전해 Ni층의 표면형상을 어떻게 제어 할지에 대한 연구는 충분히 이루어 지지 않고 있다. 본 연구에서는 Cu 하지층의 표면 형상이 무전해 Ni층의 표면 형상에 미치는 영향에 대하여 분석하였다. 이를 위해 Cu 에칭액과 Cu에칭 처리 횟수를 변화시켜 Cu 하지층의 표면 형상을 다양하게 변화시켰다.

• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.57-64
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• 2012

표면처리에 따른 Sn-1.2Ag-0.7Cu-0.4In 솔더범프의 접합 강도 평가를 위하여 전단 속도 및 열처리 시간에 따른 볼 전단강도 시험을 실시하였다. 전반적으로, 전단속도가 증가함에 따라 전단강도는 증가하였지만 인성은 감소하는 경향을 나타내었다. 파괴모드 관찰 결과, 전단 속도가 증가함에 따라 파괴모드의 경우, ENIG(electroless nickel immersion gold) 처리는 취성파괴가 대부분 지배적으로 존재하였고, OSP(organic solderability preservative) 처리는 pad open이 주로 발생하였다. 또한, 500 mm/s의 고속전단시험에서는 열처리 시간이 증가함에 따라 표면처리별 전단강도와 인성 값 모두 감소하는 경향을 보였다. ENIG 표면처리가 OSP 표면처리 보다 좋은 접합강도 특성을 보이는 것은 솔더범프 계면의 금속간화합물의 물성 및 두께와 밀접한 연관이 있는 것으로 판단된다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.624-627
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• 2003

Microcontact printing (uCP) of alkanethiols on gold was the first representative of soft-lithography processes. This is an attempt to enhance the accuracy of classical to a precision comparable with optical lithography, creating a low-cost, large-area, and high-resolution patterning process. Microcontact printing relies on replication of a pattered PDMS stamp from a master to form an elastic stamp that can be inked with a SAM solution(monolayer -forming ink) using either immersion inking or contact inking. The inked PDMS stamp is then used to print a pattern that selectively protects the gold substrate during the subsequent etch.

• Elastomers and Composites
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• 제40권4호
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• pp.272-276
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• 2005

3-aminopropyltrimethoxysilane을 처리한 반응성 있는 유리표면 위에 'dirt-ball' 방법을 사용하여 $C_{70}$-금 나노입자 다중성막 필름을 자기조립하였다. 표면처리한 유리막을 $C_{70}$ 과 ${\omega}$-아미노기를 가진 금 나노입자를 포함하고 있는 용액속에 담그었다. 유기반응(아민화 반응)은 여러층으로 쌓인 다중성막 $C_{70}$-금 나노입자 필름을 용이하게 자기조립 할 수 있었다. $C_{70}$-금 나노입자 필름의 화학적 안정성은 산성용액에 필름을 담근후 흡수도의 변화를 측정함으로 조사되었다. 또한 나노입자 필름의 초음파적 안정성은 초음파 조건에 $C_{70}$-금 나노입자 필름을 노출하여 초음파를 조사 시킨후 고체 표면 위에 부분적인 탈착도의 변화와 작은 정도의 응집성이 일어남을 알 수 있었다.

• 한국재료학회지
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• 제24권3호
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• pp.166-173
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• 2014

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and $170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at $150^{\circ}C$ and $1.5{\times}10^5A/cm^2$, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.

• 마이크로전자및패키징학회지
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• 제16권1호
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• pp.7-11
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• 2009

본 연구에서는 electroless nickel / immersion gold (ENIG) 처리된 printed circuit board (PCB)를 무연 솔더인 Sn-3.5(wt%)Ag로 접합하였다. 리플로우 횟수를 1회부터 10회까지 다양하게 하여 리플로우 횟수가 증가함에 따른 솔더 접합부의 기계적, 전기적 특성의 변화에 대해 연구하였다. 접합부의 미세 조직 관찰을 위해 접합부 단면을 폴리싱 하여 금속간 화합물의 두께를 측정하고 종류를 분석하였다. 접합부의 기계적 특성을 평가하기 위해서 die 전단 시험을 하였는데, 리플로우 횟수가 4-5회일 때까지 전단 강도 값이 증가하다가 5회 이후로 감소하였다. 전기적 특성을 알아보기 위해 전기 저항 값을 측정하였는데, 리플로우 횟수가 증가할수록 접합부의 전기 저항 값은 점점 증가하였다.