• 제목/요약/키워드: immersion cooling

검색결과 27건 처리시간 0.021초

ESS(Energy Storage System) 열관리를 위한 액침 냉각 활용에 대한 수치해석 연구 (Numerical Study on using Immersion Cooling for Thermal Management of ESS (Energy Storage System))

  • 함정균;유나영;신명재;조홍현
    • 한국지열·수열에너지학회논문집
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    • 제20권2호
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    • pp.1-10
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    • 2024
  • The introduction of the sector coupling concept has expanded the scope of ESS utilization, resulting in the importance of thermal management of ESS. To ensure the safe use of the lithium-ion batteries that are used in ESS, it is important to use the batteries at the optimal temperature. To examine the utilization of liquid cooling in ESS, numerical study was conducted on the thermal characteristics of 21700 battery modules (16S2P array) during liquid cooling using Novec-649 as insulating fluid. The NTGK model, an MSMD model in ANSYS fluent, was used to investigate thermal characteristics on the battery modules with liquid immersion cooling. The results show that the final temperature of the battery module discharged at 5 C-rate is 68.9℃ using natural convection and 48.3℃ using liquid cooling. However, the temperature difference among cells in the battery module was up to 0.5℃ when using natural convection cooling and 5.8℃ when using liquid cooling, respectively, indicating that the temperature difference among cells was significantly increased when liquid cooling was used. As the mass flow rate increased from 0.01 kg/s to 0.05 kg/s, the average temperature of the battery module decreased from 48.3℃ to 38.4℃, confirming that increasing the mass flow rate of the insulating fluid improves the performance of liquid immersion cooling. Although partial liquid immersion cooling has a high cooling performance compared to natural convection cooling, the temperature difference between modules was up to 8.9℃, indicating that the thermal stress of the battery cells increased.

Cryogenic cooling system for HTS cable

  • Yoshida, Shigeru
    • 한국초전도ㆍ저온공학회논문지
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    • 제19권2호
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    • pp.1-8
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    • 2017
  • Recently, Research and development activity of HTS (High Temperature Superconducting) power application is very progressive worldwide. Especially, HTS cable system and HTSFCL (HTS Fault current limiter) system are proceeding to practical stages. In such system and equipment, cryogenic cooling system, which makes HTS equipment cooled lower than critical temperature, is one of crucial components. In this article, cryogenic cooling system for HTS application, mainly cable, is reviewed. Cryogenic cooling system can be categorized into conduction cooling system and immersion cooling system. In practical HTS power application area, immersion cooling system with sub-cooled liquid nitrogen is preferred. The immersion cooling system is besides grouped into open cycle system and closed cycle system. Turbo-Brayton refrigerator is a key component for closed cycle system. Those two cooling systems are focused in this article. And, each design and component of the cooling system is explained.

Enhancement of the Critical Heat Flux by Using Heat Spreader

  • Yoon, Young-Sik;Hyup Yang;Kwak, Ho-Young
    • Journal of Mechanical Science and Technology
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    • 제17권7호
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    • pp.1063-1072
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    • 2003
  • Direct immersion cooling has been considered as one of the promising methods to cool high power density chips. A fluorocarbon liquid such as FC-72, which is chemically and electrically compatible with microelectronic components, is known to be a proper coolant for direct immersion cooling. However, boiling in this dielectric fluid is characterized by its small value of the critical heat flux. In this experimental study, we tried to enhance the critical heat flux by increasing the nucleate boiling area in the heat spreader (Conductive Immersion Cooling Module). Heat nux of 2 MW/㎡ was successfully removed at the heat source temperature below 78$^{\circ}C$ in FC-72. Some modified boiling curves at high heat flux were obtained from these modules. Also, the concept of conduction path length is very important in enhancing the critical heat flux by increasing the heat spreader surface area where nucleate boiling occurs.

단상계 침지냉각 기술이 적용된 Li-ion계 배터리 발열특성에 관한 연구 (A Study on Heating Characteristics of Li-ion Battery Applicated Single-phase Immersion Cooling Technology)

  • 김운학;강석원;신기석
    • 한국재난정보학회 논문집
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    • 제18권1호
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    • pp.163-172
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    • 2022
  • 연구목적: Li-ion 배터리의 효율적인 열관리 기술을 확보하기 위하여 Single&-phase 침지 냉각 기술을 적용한 시스템의 실험을 통하여 적용가능성을 확인하고자 하였다. 연구방법: LG-Chem에서 생산된 JH3 파우치 셀을 사용하여 14S2P 모듈을 제조하여 미국 카길사에서 생산된 식물성계 냉각유체에 침지한 후 0.3C~1C 속도로 충방전을 시행하여 열분포를 확인하였다. 연구결과: 침지냉각 기술로 배터리 모듈을 40℃ 이하의 온도로 관리할 수 있으며, 침지액의 분자구조 변화가 없다는 결과를 도출하였다. 결론: 침지냉각 방식이 Li-ion 배터리 열관리에 적용 가능함을 확인하였다.

담금 냉각되는 LED 조명엔진의 열특성에 대한 연구 (Study on the Thermal Behavior of Immersion Cooled LED Lighting Engines)

  • 김경준
    • 동력기계공학회지
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    • 제18권3호
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    • pp.87-92
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    • 2014
  • This study is aimed at investigating the thermal behavior of immersion-cooled high power LED lighting engines. 3D CFD models have been generated for the numerical analysis. Five cases in terms of the configuration of LED chips have been explored for various passive cooling conditions of the lighting engine, i.e., the natural air convection with a lens, the natural air convection without a lens, the deionized water-immersion cooling condition with a lens. The numerical study reveals that the deionized water-immersion cooled lighting engine has nearly twice better thermal performance than the natural air convection cooled lighting engine containing a lens. The investigation has also demonstrated that the four chips configuration has the better thermal performance than the single chip configuration.

손의 한랭자극이 인체생리반응과 의복의 쾌적성에 미치는 영향 -한랭혈관반응, 온랭감각, 한랭통증을 중심으로- (Effect of Cooling Hands in the Cold Water for the Physiological Responses and Clothing Comfort -Focused on Vascular Hunting Reaction, Thermal Sensation and Pain Sensation-)

  • 이원자
    • 복식문화연구
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    • 제12권2호
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    • pp.279-289
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    • 2004
  • This study was conducted to compare the hunting reaction of finger in the cold water. Finger skin temperature is measured the left middle finger tip immersion in cold water of 5℃ for 30 minutes and measurements were made on finger skin temperature(Ts), thermal comfort, and cold pain sensations during the experiment at the spring (March) and Winter(December). Results were follows. Is before immersion was at the highest in spring and at the lowest in winter and was closely related to the indoor temperature Ts during immersion and recovery. Mean of finger skin temperature(MST), the skin temperature at the first rise(TTR) and amplitude of finger skin temperature reaction during immersion(AT) were significant higher in spring than that in winter(P<.01). The lowest skin temperature(LST) during the cold water immersion were significantly higher in spring than that in winter (P<.05). The frequency of the appearance of cold-Induced vase dilation(CIVD) was higher in spring than that in winter. However, time for the first temperature(TTR) and recovery time(RT) had no seasonal variation. In addition, cold pains during immersion were felt more strongly in spring than in winter. Local thermal sensation, finger thermal sensation in dynamic state during hand immersion was different from that in the Winter. Spring was slowly cold in cold water immersion.

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굴삭기 냉각팬 성능해석 및 슈라우드 특성에 대한 실험적 연구 (Experimental Study of Cooling Fan Performance Analysis and Shroud Characteristics for an Excavator)

  • 이재석;정경남;김진영;이태경;강정원;심재구;손득균
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회B
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    • pp.2597-2602
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    • 2007
  • In this paper, the performance analysis is experimentally carried out in order to select the best cooling fan and shroud considering both cooling performance and noise reduction. 4 cooling fans have been tested in the fan tester and the real excavator. In order to obtain the performance of the cooling fans, flow capacity has been estimated by measuring flow velocity using a hot wire anemometer, and noise radiation has been also measured to estimate the fan noise. Characteristics of a box-type and a streamlined shroud have been examined by changing the immersion depth of cooling fans. Based upon the results, the best cooling fan is selected. Finally, the criterion to select the best cooling fan has been set up.

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반도체 및 전자패키지의 방열기술 동향 (Heat Dissipation Trends in Semiconductors and Electronic Packaging)

  • 문석환;최광성;엄용성;윤호경;주지호;최광문;신정호
    • 전자통신동향분석
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    • 제38권6호
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    • pp.41-51
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    • 2023
  • Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

국부적인 발열부분을 가진 표면에서의 잠김 비등열전달 -전자부품 액침 냉각에서의 응용- (Boiling Heat Transfer from a locally Heated Surface -A Simulated Electronic Device under Liquid Immersion Cooling-)

  • 하광순;최상민
    • 대한기계학회논문집
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    • 제15권2호
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    • pp.685-692
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    • 1991
  • The pool boiling behavior of a heated surface has been investigated experimentally, focusing on the cases when only a part of the contact surface is heated. Characteristic boiling curves are obtained with circular metal surface test pieces heated below while immersed in Refrigerant-113. Locally heated test pieces are fabricated by inserting a heating block at the center inside a larger conducting block. Overall heat transfer rates are measured while the experimental conditions are systematically varied. The local temperature profiles along the radius are measured for conducting blocks. It is found that the conjugated boiling condition exists and the total heat fluxes should be correlated to a suitably defined temperature difference.

고온강재의 담금질 전열에 관한 연구 (A Study on the Heat Transfer of the High Temperature Metals in Quenching - The Latent Heat of Phase Transformation and Cooling Curves -)

  • 윤석훈
    • 수산해양기술연구
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    • 제27권4호
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    • pp.321-327
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    • 1991
  • Experiments of quenching were made with cylindrical specimens of carbon steel S45C of diameters from 12 to 30mm were performed. The specimens were heated by electric furnace and quenched by immersion method. In order to analyze the temperature profile(cooling curves) of carbon steel including the latent heat of phase transformation, nonlinear heat conduction problem was calculated by the numerical method of inverse heat conduction problem using the apparent heat capacity method. The difference between the calculated and the experimented cooling curves was caused by the latent heat of phase transformation, and the effects of the latent heat were especially manifest at the cooling curves of center of specimens. The temperature and the quantity of the latent heat of phase transformation depend on the cooling speed at A sub(1) transformation point, and the region for cooling speed to become zero was caused by the latent heat of phase transformation.

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