References
- Andersen, T.M., and Mudawar, I., 1989, 'Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon Liquid,' J. Heart Transfer, Vol. 111, pp. 752-759 https://doi.org/10.1115/1.3250747
- Bar-Cohen, A., Mudawar, I., Whalen, B., 1986, 'Future Challenges for Electronic Cooling,' Research Needs in Electronic Cooling, F.P. Incropera, ed., published by the National Science Foundation and Perdue University, West Lafayette, IN, pp. 70-77
- Bergles, A.E. and Chyu, M.C., 1982, 'Characteristics of Nucleate Pool Boiling from Porous Metallic Coatings,' J. Heart Transfer, Vol. 104, pp. 279-285 https://doi.org/10.1115/1.3245084
- Bhavnani, S.H., Tsai, C., Jaeger, R.L. and Eison, D.L., 1993, 'An Integral Heat Sink for Cooling Microelectronic Components,' J. Heart Trasnfer, Vol. 115, pp. 284-291
- Chang, J.Y. and You, S.M., 1997, 'Enhanced Boiling Heat Transfer from Micro-Porous Surfaces-Effects of a coating composition and method,' Int. J. Heat Mass Transfer, Vol. 40, pp. 4449-4460 https://doi.org/10.1016/S0017-9310(97)00057-4
- Chu, R.C. and Simon, R.E., 1984, 'Thermal Management of Larger Scale Digital Computers,' The International Society for Hybrid Micro Electronics, Vol. 7, pp. 35-43
- Cstello, R. and Antognetti, P., 1978, IEEE J. of Solid-State Circuits, Vol. SC-13, pp. 363-366 https://doi.org/10.1109/JSSC.1978.1051054
- Eades, H.H. and Nelson, D.J., 1991, 'Thermal Interaction of High-Density Heat Sources on Ceramic Substrates,' in ASME/JSME Thermal Engineering Proceedings, Vol. 2, pp. 349-356
- Gu, C.B., Chow, L.C. and Beam, J.E., 1989, 'Flow Boiling in Curved Channel,' in Heat Transfer in High Energy/High Heat flux Applications, HTD-Vol. 119, Goldstein, R.J., et al ed., pp. 25-33
- Hijikata, K., Yamamoto, N. and Takagi, S., 1997, 'Boiling Heat Transfer from a Micro Heater,' in DSC-Vol. 62, HTD-Vol. 354, Micro Electromechanical Systems(MEMS), pp. 135-142
- Jeon, J., Na, J., Park, H. and Kwak, H., 2001, 'An Experiment on Thermosyphone Boiling in Uniformly Heated Vertical Tube and Asymmetrically Heated Vertical Channel,' KSME Int. J., Vol. 15, pp. 98-107 https://doi.org/10.1007/BF03184803
- Kadambi, V. and Abuaf, N., 1983, 'Axisymmetric and Three Dimensional Chip-Spreader Calculations,' Proceedings of the 1983 National Heat Transfer Conference, AIChe Symposium Series No. 225, Vol. 79, pp. 130-139
- Marto, P.J. and Lepere, V.J., 1982, 'Pool Boliling Heat Transfer from Enhanced Surfaces to Dielectric Fluids,' J. Heat Transfer, Vol. 104, pp. 292-299 https://doi.org/10.1115/1.3245086
- Mudawar, I. and Maddox, D.E., 1990, 'Enhancement of Critical Heat Flux from High Power Microelectronic Heat Sources in a Flow Channel,' J. Electronic Packaging, Vol. 112, pp. 241-248 https://doi.org/10.1115/1.2904373
- Nakayama, W., Daikoku, T. and Nakajima, T., 1982, 'Effects of Pore Diameters and System Pressure on Saturated Pool Nuclcate-Boiling Heat Transfer from Porous Surfaces,' J. Heat Transfer, Vol. 104, pp. 286-291 https://doi.org/10.1115/1.3245085
- Nakayama, W., Nakajima, T. and Hirasawa, S., 1984, 'Heat Sink Studs Having Enchanced Boiling for Cooling of Microelectronic Components,' ASME Paper No. 84-WA/HT-89
- Simon, R.E., 1983, 'Thermal Management of Electronic Packages,' Solid State Technology, pp. 131-137
- Simon, R.E., 1987, 'Direct Liquid Immersion Cooling, Past Present and Future,' IBM Technical Report, No.TR 00. 3465, Poughkeepise, N.Y.
- Sturgis, J.C. and Mudawar, I., 1999, 'Assessment of CHF Enhancement Mechanisms in a Curved, Rectangular Channel Subjected to Concave Heating,' J. Heat. Transfer, Vol. 121, pp. 394-404 https://doi.org/10.1115/1.2825992
- You, S.M., Bar-Cohen, A., Simon, T.W., 1990, 'Boiling Incipience and Nucleate Boiling Heat Transfer of Highly Wetting Dielectric Fluids from Electric Materials,' IEEE CHMT Trans., Vol. 13, pp. 1032-1039 https://doi.org/10.1109/33.62545
- You, S.M., Simon, T.W. and Bar-Cohen, A., 1990, 'Experiment on Nucleate Boiling Heat Transfer with a Highly-Wetting Dielectric Fluid : Effect of Pressure, Subcooling and Dissolved Gas Contents,' Heat Transfer, Vol. 2, pp. 337-342, Hemisphere Publishing Corp.
- Heat Transfer v.2 Experiment on Nucleate Boiling Heat Transfer with a Highly-Wetting Dielectric Fluid : Effect of Pressure, Subcooling and Dissolved Gas Contents You,S.M.;Simon,T.W.;Bar-Cohen,A.