• 한국정보처리학회:학술대회논문집
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• 한국정보처리학회 2016년도 추계학술발표대회
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• pp.566-567
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• 2016

최근 스마트기기가 발전함에 따라 종이책이 아닌 다양한 전자책뷰어가 등장하고 있다. 애플의 아이패드(iPad), 아마존의 킨들(kindle)과 같은 태블릿, 전자책 또는 스마트폰이 대표적인 예이며 스마트기기의 사용자 증가로 전용 단말기가 아닌 스마트폰 중심의 전자책 시장도 크게 성장하고 있다. 하지만 시니어 또는 스마트기기 사용을 어려워하는 사용자들이 전자책을 사용하는데 어려움을 느끼기 때문에, 전자책은 종이책에 비해 여전히 낮은 이용률을 나타내고 있다. 본 논문에서는 얼굴 표정에 따라서 전자책 설정을 자동으로 변경해 주는 방법을 제안한다. 제안한 방법은 표정감지를 위하여 OpenCV 라이브러리를 이용하여 얼굴을 검출하고, Haar-Like 피처 기법으로 사용자의 눈 모양을 검출한다. 눈이 감겨있는 경우와 찌푸린 경우를 감지하여 이에 맞게 글자크기와 화면을 자동으로 설정해 준다.

• 한국IT서비스학회지
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• 제13권3호
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• pp.309-321
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• 2014

Recently, due to the advent of ubiquitous computing and the spread of intelligent portable device such as smart phone, iPad and PDA has been amplified, a variety of services and the amount of information has also increased fastly. It is becoming a part of our common life style that the demands for enjoying the wireless internet are increasing anytime or anyplace without any restriction of time and place. And also, the demands for e-commerce and many different items on e-commerce and interesting of associated items are increasing. Existing collaborative filtering (CF), explicit method, can not only reflect exact attributes of item, but also still has the problem of sparsity and scalability, though it has been practically used to improve these defects. In this paper, using a implicit method without onerous question and answer to the users, not used user's profile for rating to reduce customers' searching effort to find out the items with high purchasability, it is necessary for us to analyse the segmentation of customer and item based on customer data and purchase history data, which is able to reflect the attributes of the item in order to improve the accuracy of recommendation. We propose the method of recommendation system using association rule and weighted preference so as to consider many different items on e-commerce and to refect the profit/weight/importance of attributed of a item. To verify improved performance of proposing system, we make experiments with dataset collected in a cosmetic internet shopping mall.

• 항공우주기술
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• 제3권1호
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• pp.222-231
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• 2004

우주센터의 발사관제시스템은 우주센터 내에서 이루어지는 발사체에 대한 각종 지상시험과 발사시험시 발사체, 발사대, 추진지상공급계 등 외부 시스템과의 인터페이스를 통한 데이터 모니터링 및 제어를 수행하게 되며 실시간 원격제어 시스템, 시뮬레이션 시스템, 데이터 서버, 외부 네트워크 등으로 이루어져 있다. 발사체 시뮬레이션 시스템 개발의 목적은 발사체를 모사하여 지상 발사관제시스템 구축시 성능시험 및 검증을 수행하는 것이다. 본 논문에서는 시뮬레이터 시스템의 개요, 주요 장비에 대한 개념설계 및 실시간 데이터 처리에 대한 시험평가를 다루었다.

• 한국전기전자재료학회논문지
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• 제19권9호
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• International Journal of Automotive Technology
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• 제8권2호
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• pp.211-217
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• 2007

The wheel slip control systems are able to control the braking force more accurately and can be adapted to different vehicles more easily than conventional ABS (Anti-lock Brake System) systems. In realizing the wheel slip control systems, real-time information such as the tire braking force at each wheel is required. In addition, the optimal target slip values need to be determined depending on the braking objectives such as minimum braking distance and stability enhancement. In this paper, a robust wheel slip controller is developed based on the adaptive sliding mode control method and an optimal target slip assignment algorithm is proposed for maximizing the braking force. An adaptive law is formulated to estimate the braking force in real-time. The wheel slip controller is designed based on the Lyapunov stability theory considering the error bounds in estimating the braking force and the brake disk-pad friction coefficient. The target slip assignment algorithm searches for the optimal target slip value based on the estimated braking force. The performance of the proposed wheel slip control system is verified in HILS (Hardware-In-the-Loop Simulator) experiments and demonstrates the effectiveness of the wheel slip control in various road conditions.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• Geomechanics and Engineering
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• 제30권3호
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• pp.273-280
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• 2022

A certain amount of random vibration excitation to subway track is caused by subway operation. This excitation is transmitted through track foundation, tunnel, soil medium, and ground building to the ground and ground structure, causing vibration. The vibration affects ground building. In this study, the results of ANSYS numerical simulation was used to establish back-propagation (BP) neural network model. Moreover, a back-propagation neural network model consisting of five input neurons, one hidden layer, 11 hidden-layer neurons, and three output neurons was used to analyze and calculate the vertical Z-vibration level of New Capital's ground buildings of Qingdao Metro phase I Project (Line M3). The Z-vibration level under different working conditions was calculated from monolithic roadbed, steel-spring floating slab roadbed, and rubber-pad floating slab roadbed under the working condition of center point of 0-100 m. The steel-spring floating slab roadbed was used in the New Capital area to monitor the subway operation vibration in this area. Comparing the monitoring and prediction results, it was found that the prediction results have a good linear relationship with lower error. The research results have good reference and guiding significance for predicting vibration caused by subway operation.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.219-225
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• 2002

This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to $25-50{\mu}{\textrm}{m}$ line/space is fabricated to fan-in and fan-out of the bond pads without using bumps or substrate. Various types of joint methods can be applied to connect the fine trace and the bond pad directly. The resin-filled terminal provides excellent compliancy between package and the assembled board. More interestingly, the thin film routing is similar to wafer level packaging whereas the fan-out feature enables high lead count devices to be accommodated in the BGA format. Details of the design concepts and processing technology for this novel package are discussed. Trade offs to meet various cost or performance goals for selected applications are suggested. Finally, the importance of design integration early in the technology development cycle with die-level and system-level design teams is highlighted as critical to an optimal design for performance and cost.

• 대한인간공학회지
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• 제31권1호
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• pp.261-269
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• 2012

Objective: The aim of this study is to develop an analysis method to extract plausible types of errors when using a smart mobile in nuclear power plants. Background: Smart mobiles such as a smart-phone and a tablet computer(smart-pad) are to be introduced to the various industries. Nuclear power plant like APR1400 already adopted many up-to-date digital devices within its main control room. With this trend, various types of smart mobiles will be inevitably introduced to the nuclear field in the near future. However nuclear power plants(NPPs) should be managed considering a big risk as a result of the trend not only economically but also socially compared to the other industrial systems. It is formally required to make sure to reasonably prevent the all hazards due to the introduction of new technologies and devices before the application to the specific tasks in nuclear power plants. Method: We define interaction segments(IS) as a main architect of interaction description, and enumerate all plausible error segments(ES) for a part of design evaluation of digital devices. Results: We identify various types of interaction errors which are coped with reasonably by interaction design using smart mobiles. Conclusion: According to the application result of the proposed method, we conclude that the proposed method can be utilized to specify the requirements to the human error hazards in digital devices, and to conduct a human factors review during the design of digital devices. Application: The proposed method can be applied to predict the human errors of the tasks related to the digital devices; therefore we can ensure the safety to apply the digital devices to be introduced to NPPs.

• 한국소음진동공학회논문집
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• 제22권1호
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• pp.22-28
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• 2012

While a dash panel component, close to passengers, plays a very important role to protect heat and noise from a power train, it is also a main path that transfers vibration energy and eventually radiates acoustic noise into the cavity. Therefore, it is important to provide optimal design schemes incorporating sound packages such as a dash isolation pad and a floor carpet, as well as structures. The present study is the extension of the previous investigation how design variables affect sound radiation, which was carried out using the simple plate and framed system. A novel FE-SEA hybrid simulation model is used for this study. The system taken into account is a dash panel component of a sedan vehicle, which includes front pillars, front side members, a dash panel and corresponding sound packages. Design variables such as panel thicknesses and sound packages are investigated how they are related to two main NVH indexes, sound radiation power(i.e. structure-borne) and sound transmission loss(i.e. air borne). In the viewpoint of obtaining better NVH performance, it is shown that these two indexes do not always result in same tendencies of improvement, which suggests that they should be dealt with independently and are also dependent on frequency regions.