• 전자통신동향분석
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• 제35권4호
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• ETRI Journal
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• 제36권3호
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• pp.343-351
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• 2014

For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable.

• Elastomers and Composites
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• 제38권3호
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• pp.213-226
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• 2003

Imidazole 촉매의 종류에 따른 bisphenol-F계 에폭시 (Diglycidyl ether of bisphenol-F)/nadic methyl anhydride 수지 시스템의 경화 및 유변학적 거동이 시차주사열량계 (differential scanning calorimeter)와 회전 점도계를 사용하여 연구되었다. 경화반응기구를 분석하기 위해서 몇 개의 등온경화온도에서 등온시험이 수행되었다. Bisphenol-F계 에폭시/anhydride 조성물의 경화곡선은 전환량이 $20{\sim}40 %$일 때 최대 값을 보이는 자체촉매반응을 나타내었다. 속도상수($k_1,\;k_2$)는 온도 의존성을 가지나 반응차수 (m+n)는 온도 의존성이 없었으며, 반응차수는 거의 3으로 계산되었다. 촉매의 종류에 따라 두 개의 반응기구를 가지고 있었다. G'-G" crossover 방법을 통해 겔화 시간을 측정하였으며, 이 결과로부터 활성화에너지를 구하였다. 용융 실리카를 첨가한 조성물의 유변학적 거동으로부터 온도와 충전제 함량에 따른 겔화 시간의 대수 변화가 직선적인 관계를 나타낸다는 것을 알 수 있었다. 고충전된 에폭시 수지 조성물은 전형적인 준소성 거동을 보였으며, 최대충전밀도가 클수록 점도는 낮아졌다.