• 제목/요약/키워드: high-throughput process

검색결과 267건 처리시간 0.032초

Throughput-efficient Online Relay Selection for Dual-hop Cooperative Networks

  • Lin, Yuan;Li, Bowen;Yin, Hao;He, Yuanzhi
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • 제9권6호
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    • pp.2095-2110
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    • 2015
  • This paper presents a design for a throughput-efficient online relay selection scheme for dual-hop multi-relay cooperative networks. Problems arise with these networks due to unpredictability of the relaying link quality and high time-consumption to probe the dual-hop link. In this paper, we firstly propose a novel probing and relaying protocol, which greatly reduces the overhead of the dual-hop link estimation by leveraging the wireless broadcasting nature of the network. We then formulate an opportunistic relay selection process for the online decision-making, which uses a tradeoff between obtaining more link information to establish better cooperative relaying and minimizing the time cost for dual-hop link estimation to achieve higher throughput. Dynamic programming is used to construct the throughput-optimal control policy for a typically heterogeneous Rayleigh fading environment, and determines which relay to probe and when to transmit the data. Additionally, we extend the main results to mixed Rayleigh/Rician link scenarios, i.e., where one side of the relaying link experiences Rayleigh fading while the other has Rician distribution. Numerical results validate the effectiveness and superiority of our proposed relaying scheme, e.g., it achieves at least 107% throughput gain compared with the state of the art solution.

Full validation of high-throughput bioanalytical method for the new drug in plasma by LC-MS/MS and its applicability to toxicokinetic analysis

  • Han, Sang-Beom
    • 한국독성학회:학술대회논문집
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    • 한국독성학회 2006년도 추계학술대회
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    • pp.65-74
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    • 2006
  • Modem drug discovery requires rapid pharmacokinetic evaluation of chemically diverse compounds for early candidate selection. This demands the development of analytical methods that offer high-throughput of samples. Naturally, liquid chromatography / tandem mass spectrometry (LC-MS/MS) is choice of the analytical method because of its superior sensitivity and selectivity. As a result of the short analysis time(typically 3-5min) by LC-MS/MS, sample preparation has become the rate- determining step in the whole analytical cycle. Consequently tremendous efforts are being made to speed up and automate this step. In a typical automated 96-well SPE(solid-phase extraction) procedure, plasma samples are transferred to the 96-well SPE plate, internal standard and aqueous buffer solutions are added and then vacuum is applied using the robotic liquid handling system. It takes only 20-90 min to process 96 samples by automated SPE and the analyst is physically occupied for only approximately 10 min. Recently, the ultra-high flow rate liquid chromatography (turbulent-flow chromatography)has sparked a huge interest for rapid and direct quantitation of drugs in plasma. There is no sample preparation except for sample aliquotting, internal standard addition and centrifugation. This type of analysis is achieved by using a small diameter column with a large particle size(30-5O ${\mu}$m) and a high flow rate, typically between 3-5 ml/min. Silica-based monolithic HPLC columns contain a novel chromatographic support in which the traditional particulate packing has been replaced with a single, continuous network (monolith) of pcrous silica. The main advantage of such a network is decreased backpressure due to macropores (2 ${\mu}$m) throughout the network. This allows high flow rates, and hence fast analyses that are unattainable with traditional particulate columns. The reduction of particle diameter in HPLC results in increased column efficiency. use of small particles (<2 urn), however, requires p.essu.es beyond the traditional 6,000 psi of conventional pumping devices. Instrumental development in recent years has resulted in pumping devices capable of handling the requirements of columns packed with small particles. The staggered parallel HPLC system consists of four fully independent binary HPLC pumps, a modified auto sampler, and a series of switching and selector valves all controlled by a single computer program. The system improves sample throughput without sacrificing chromatographic separation or data quality. Sample throughput can be increased nearly four-fold without requiring significant changes in current analytical procedures. The process of Bioanalytical Method Validation is required by the FDA to assess and verify the performance of a chronlatographic method prior to its application in sample analysis. The validation should address the selectivity, linearity, accuracy, precision and stability of the method. This presentation will provide all overview of the work required to accomplish a full validation and show how a chromatographic method is suitable for toxirokinetic sample analysis. A liquid chromatography/tandem mass spectrometry (LC-MS/MS) method developed to quantitate drug levels in dog plasma will be used as an example of tile process.

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Development of Rapid Thermal Processor for Large Glass LTPS Production

  • Kim, Hyoung-June;Shin, Dong-Hoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.533-536
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    • 2006
  • VIATRON TECHNOLOGIES has developed Field-Enhanced Rapid Thermal Processor (FERTP) system that enables LTPS LCD and AMOLED manufacturers to produce poly-Si films at low cost, high throughput, and high yield. The FE-RTP allows the diverse process options including crystallization, thermal oxidation of gate oxides and fast pre-compactions. The process and equipment compatibility with a-Si TFT lines is able to provide a viable solution to produce poly-Si TFTs using a-Si TFT lines.

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LED용 Si 기판의 저비용, 고생산성 실리콘 관통 비아 식각 공정 (Developing Low Cost, High Throughput Si Through Via Etching for LED Substrate)

  • 구영모;김구성;김사라은경
    • 마이크로전자및패키징학회지
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    • 제19권4호
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    • pp.19-23
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    • 2012
  • 최근 발광다이오드(LED)의 출력 성능을 높이고, 전력 소비를 줄이기 위해 LED 패키지 분야에서 실리콘 기판 연구가 집중되고 있다. 본 연구에서는 공정 비용이 낮고 생산성이 높은 습식 식각을 이용하여 실리콘 기판의 실리콘 관통 비아 식각 공정을 살펴보았다. KOH를 이용한 양면 습식 식각 공정과 습식 식각과 건식 식각을 병행한 두 가지 공정 방법으로 실리콘 관통 비아를 제작하였고, 식각된 실리콘 관통 비아에 Cu 전극과 배선은 전기도금으로 증착하였다. Cu 전극을 연결하는 배선의 전기저항은 약 $5.5{\Omega}$ 정도로 낮게 나타났고, 실리콘 기판의 열 저항은 4 K/W으로 AlN 세라믹 기판과 비슷한 결과를 보였다.

네트워크 장비 성능 향상을 위한 네트워크 서브시스템 스케줄링 기법 적용 (Applying scheduling techniques for improving the performance of network equipment network subsystem)

  • 배병민;김민중;이광로;정영준
    • 한국정보통신학회:학술대회논문집
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    • 한국정보통신학회 2013년도 춘계학술대회
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    • pp.65-67
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    • 2013
  • 최근의 네트워크 장비들은 고성능이 요구되고, 또한 높은 네트워크 대역폭의 활용을 요구하고 있다. 이를 위해 점차 멀티 코어 프로세서를 사용한 고성능 네트워크 서버 장비를 개발 하는 추세이다. 이런 고성능과 높은 네트워크 처리율을 향상시키기 위한 방법으로 멀티 코어의 특성을 고려한 네트워크 서브시스템의 성능을 향상시키는 방법을 제시한다. 본 논문에서는 멀티 코어를 최대한 활용함으로 성능을 최적화 하고 통신 성능을 향상시키는 방법을 실험을 통해서 확인한다. 통신 프로세스의 성능 향상은 멀티 코어 프로세서 구조, 프로세스의 네트워크 집중도, 각 코어에 걸리는 오버헤드, 인터럽트 친화도에 따른 네트워크 처리량을 기반으로 해당 프로세스에 최적의 코어를 결정해 주도록 한다. 실험은 리눅스 커널에서 구현하였으며, 실험을 통해 네트워크 처리량을 30%까지 향상 시키고, 프로세서의 오버헤드는 최대 10%까지 줄여 리눅스 통신 프로세스의 성능 향상을 가져옴을 보여준다.

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나노임프린트 공정에서의 냉각성능 개선에 대한 수치해석 (Numerical Analysis for Improvement of Cooling Performance in Nanoimprint Lithography Process)

  • 이기연;전상범;김국원
    • 반도체디스플레이기술학회지
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    • 제10권4호
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    • pp.89-94
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    • 2011
  • In recent years there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. A major disadvantage of thermal NIL is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to improve the cooling performance in NIL process. In this paper, a numerical analysis model of cooling system in thermal NIL was development by CAD/CAE program and the performance of the cooling system was analyzed by the model. The calculated temperatures of nanoimprint device were verified by the measurements. By using the analysis model, the case that the cooling material is replaced by liquid nitrogen is investigated.

Characterization of Al2O3 Thin Film Encasulation by Plasma Assisted Spatial ALD Process for Organic Light Emitting Diodes

  • Yong, Sang Heon;Cho, Sung Min;Chung, Ho Kyoon;Chae, Heeyeop
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.234.2-234.2
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    • 2014
  • Organic light emitting diode (OLED) is considered as the next generation flat panel displays due to its advantages of low power consumption, fast response time, broad viewing angle and flexibility. For the flexible application, it is essential to develop thin film encapsulation (TFE) to protect oxidation of organic materials from oxidative species such as oxygen and water vapor [1]. In many TFE research, the inorganic film by atomic layer deposition (ALD) process demonstrated a good barrier property. However, extremely low throughput of ALD process is considered as a major weakness for industrial application. Recently, there has been developed a high throughput ALD, called 'spatial ALD' [2]. In spatial ALD, the precursors and reactant gases are supplied continuously in same chamber, but they are separated physically using a purge gas streams to prevent mixing of the precursors and reactant gases. In this study, the $Al_2O_3$ thin film was deposited by spatial ALD process. We characterized various process variables in the spatial ALD such as temperature, scanning speed, and chemical compositions. Water vapor transmission rate (WVTR) was determined by calcium resistance test and less than $10-^3g/m^2{\cdot}day$ was achieved. The samples were analyzed by x-ray photoelectron spectroscopy (XPS) and field emission scanning electron microscope (FE-SEM).

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기계화학적 연마를 이용한 트렌치 구조의 산화막 평탄화 (Oxide Planarization of Trench Structure using Chemical Mechanical Polishing(CMP))

  • 김철복;김상용;서용진
    • 한국전기전자재료학회논문지
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    • 제15권10호
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    • pp.838-843
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    • 2002
  • Chemical mechanical polishing(CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for deep sub-micron technology. The reverse moat etch process has been used for the shallow trench isolation(STI)-chemical mechanical polishing(CMP) process with conventional low selectivity slurries. Thus, the process became more complex, and the defects were seriously increased. In this paper, we studied the direct STI-CMP process without reverse moat etch step using high selectivity slurry(HSS). As our experimental results show, it was possible to achieve a global planarization without the complicated reverse moat process, the STI-CMP process could be dramatically simplified, and the defect level was reduced. Therefore the throughput, yield, and stability in the ULSI semiconductor device fabrication could be greatly improved.

미세 핫엠보싱 공정에서 폴리머의 유동특성 (Flow Behaviors of Polymers in Micro Hot Embossing Process)

  • 반준호;신재구;김병희;김헌영
    • 한국정밀공학회지
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    • 제22권8호
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    • pp.159-164
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    • 2005
  • The Hot Embossing Lithography(HEL) as a method fur the fabrication of the nanostructure with polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this paper, we carried out experimental studies and numerical simulations in order to understand the viscous flow of the polymer (PMMA) film during the hot embossing process. To grasp the characteristics of the micro patterning rheology by process parameters (embossing temperature, pressure and time), we have carried out various experiments by using the nickel-coated master fabricated by the deep RIE process and the plasma sputtering. During the hot embossing process, we have observed the characteristics of the viscoelastic behavior of polymer. Also, the viscous flow during the hot embossing process has been simulated by the continuum based FDM(Finite Difference Method) analysis considering the micro effect, such as a surface tension and a contact angle.