• Title/Summary/Keyword: high voltage stress

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Computation of Beam Stress and RF Performance of a Thin Film Based Q-Band Optimized RF MEMS Switch

  • Singh, Tejinder
    • Transactions on Electrical and Electronic Materials
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    • v.16 no.4
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    • pp.173-178
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    • 2015
  • In lieu of the excellent radio frequency (RF) performance of microelectromechanical system ( MEMS) switches, these micro switches need higher actuation voltage for their operation. This requirement is secondary to concerns over the swtiches’ reliability. This paper reports high reliability operation of RF MEMS switches with low voltage requirements. The proposed switch is optimised to perform in the Q-band, which results in actuation voltage of just 16.4 V. The mechanical stress gradient in the thin micro membrane is computed by simulating von Mises stress in a multi-physics environment that results in 90.4 MPa stress. The computed spring constant for the membrane is 3.02 N/m. The switch results in excellent RF performance with simulated isolation of above 38 dB, insertion loss of less than 0.35 dB and return loss of above 30 dB in the Q-band.

A Characteristic of Alternative Flyback Multi-Resonant Converter (AT 플라이백 다중 공진형 컨버터의 동작특성)

  • Jeong, Jin-Beom;Kim, Hee-Jun;Kim, Chang-Sun;Woo, Seung-Hoon;Park, Woo-Chul
    • Proceedings of the KIEE Conference
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    • 2005.07b
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    • pp.1380-1382
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    • 2005
  • The multi-resonant converter minimizes a parasitic oscillation by using the resonant tank circuit absorbed parasitic reactance existing in a converter circuit. So it is possible that the converter operated at a high frequency has a high efficiency because the losses are reduced. However, the resonant voltage stress across a switch is four or five times a input voltage. This high voltage stress increases the conduction loss. In this paper, we proposed the AT flyback multi-resonant converter. The proposed converter can reduce the voltage stress to two or three times by using two series input capacitors. The operational principle of the proposed converter was verified through the experimental converter.

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A Novel Three Level DC/DC Converter for High power applications operating from High Input Voltage (대용량 및 높은 입력전압에 적합한 새로운 Three Level DC/DC 컨버터)

  • Han S.K.;Oh W.S.;Moon G.W.;Youn M.J.
    • Proceedings of the KIPE Conference
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    • 2003.07a
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    • pp.317-322
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    • 2003
  • A novel three-level DC/DC converter (TLC)for high power applications operating from high input voltage Is proposed. Its switch voltage stress can be ensured to be only one-half of the Input voltage. Nevertheless, since all input voltage is applied to the transformer primary side, it has good turns ratio. The driving method of each module is same as those of the conventional phase-shifted ZVS full bridge PWM converter (PSFB) and the zero-voltage-switching (ZVS) of the leading leg are achieved exactly in the same manner as that of the PSFB. Moreover, its three-level operation can considerably reduce the current ripple through the output inductor and it has no problems of the DC-link voltage unbalance. Therefore, it features a low voltage stress, high efficiency, low EMI, high power density, and small sized filter. To confirm the operation, validity, and features of the proposed circuit, experimental results from a 200W, 600V/DC-48V/DC prototype are presented.

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Alternately Zero Voltage Switched Multi Resonant Converter Topology (교번으로 영전압 스위칭 되는 다중공진형 컨버터 토폴로지)

  • Kim Chang-Sun;Park Hyo-Sik;Oh Yong-Seung;Kim Hee-Jun
    • Proceedings of the KIPE Conference
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    • 2002.07a
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    • pp.360-363
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    • 2002
  • In the resonant converters which can provide high efficiency and high power density, the resonant voltage stress is about $4\~5$ times the input voltage. It needs the power switch with high ratings. This is a reason why the conduction loss is increased. In this paper, it proposes the alternately zero voltage switched forward, flyback multi resonant converter topology for reducing the voltage stress using alternately zero voltage switching technique. And the proposed AT forward MRC Is experimentally considered about the loop gain with HP4194A network analyzer

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Breakdown Characteristics and Lifetime Estimation of Rubber Insulating Gloves Using Statistical Models

  • Kim, Doo Hyun;Kang, Dong Kyu
    • International Journal of Safety
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    • v.1 no.1
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    • pp.36-42
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    • 2002
  • This paper is aimed at predicting the life of rubber insulating gloves under normal operating stresses from relatively rapid test performed at higher stresses. Specimens of rubber insulating gloves are subject to multiple stress conditions, i.e. combined electrical and thermal stresses. Two modes of electrical stress, step voltage stress and constant voltage stress are used in specimen aging. There are two types of test for electrical stress in this experiment: the one is Breakdown Voltage (BDV) test under step voltage stress and thermal stress and the other is lifetime test under constant voltage stress and temperature stress. The ac breakdown voltage defined as the break-down point of insulation that leakage current excesses a limit value, l0mA in this experiment, is determined. Because the very high variability of aging data requires the application of statistical model, Weibull distribution is used to represent the failure times as the straight line on Weibull probability paper. Weibull parameters are deter-mined by three statistical methods i.e. maximum likelihood method, graphical method and least squares method, which employ SAS package, Weibull probability paper and FORTRAN, respectively. Two chosen models for predicting the life under simultaneous electrical and thermal stresses are inverse power model and exponential model. And the constants of life equation for multistress aging are calculated using numerical method, such as Gauss Jordan method etc.. The completion of life equation enables to estimate the life at normal stress based on the data collected from accelerated aging test. Also the comparison of the calculated lifetimes between the inverse power model and the exponential model is carried out. And the lifetimes calculated by three statistical methods with lower voltage than test voltage are compared. The results obtained from the suggested experimental method are presented and discussed.

Heat Dissipation Analysis of High Voltage Diode Package for Microwave oven (전자레인지용 고압다이오드의 방열특성)

  • Kim, Sang-Cheol;Kim, Nam-Kyun;Bahng, Wook;Seo, Gil-Soo;Moon, Seoung-Ju;Oh, Bang-Won
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.205-208
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    • 2001
  • Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of $25{\mu}m$ and $3700{\mu}m$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

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Heat Dissipation Analysis of High Voltage Diode Package for Microwave oven (전자레인지용 고압다이오드의 방열특성)

  • Kim, Sang-Cheol;Kim, Nam-Kyun;Bahng, Wook;Seo, Gil-Soo;Moon, Seoung-Ju;Oh, Bang-Won
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.205-208
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    • 2001
  • Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of 25$\mu\textrm{m}$ and 3,700$\mu\textrm{m}$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

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The Modeling Analysis of the AT Forward Multi-Resonant Converter (AT 포워드 다중공진형 컨버터의 모델링 해석)

  • 김창선
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.14 no.3
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    • pp.6-14
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    • 2000
  • The high efficiency multi-resonant converter(MRC) is capable of operating at a high frequency because the losses are decreased due to the resonant tank circuit. Such a few MHz high frequency applications provide high power density[W/inch3] of the converter. However, the resonant voltage stress across the switch of the resonant tank circuit is 4∼5 times input voltage. This high voltage stress increases the conduction losses because of on-resistance of a MOSFET with higher rating. In this paper, the modeling analysis for the AT Forward MRC suggested to solve the these problems is discusses. The operational modes of the AT Forward MRC are divided to 8 equivalent modes according to the two switching sequences. Each mode analysis is covered using the equivalent circuits modeled over all of the paper. The operational principle of the resonant converter was verified through the experimental converter with 48[V] input voltage, 5[V]/50[W] output voltage/power and PSpice simulation. The measured maximum voltage, 5[V]/50[W] output voltage/power and PSpice simulation. The measure maximum voltage stress is 170[V] of 2.9 times the input voltage and the maximum efficiency is measured to 81.66%.

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Novel High Step-Up DC/DC Converter Structure Using a Coupled Inductor with Minimal Voltage Stress on the Main Switch

  • Moradzadeh, Majid;Hamkari, Sajjad;Zamiri, Elyas;Barzegarkhoo, Reza
    • Journal of Power Electronics
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    • v.16 no.6
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    • pp.2005-2015
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    • 2016
  • A high-step-up DC/DC converter for renewable energy systems is proposed. The proposed structure provides high voltage gain by using a coupled inductor without the need for high duty cycles and high turn ratios. The voltage gain is increased through capacitor-charging techniques. In the proposed converter, the energy of the leakage inductors of the coupled inductor is reused. This feature reduces the stress on the switch. Therefore, a switch with low ON-state resistance can be used in the proposed converter to reduce losses and increase efficiency. The main switch is placed in series with the source. Therefore, the converter can control the energy flow from the source to the load. The operating principle is discussed in detail, and a steady state analysis of the proposed converter is conducted. The performance of the proposed converter is verified by experimental results.

A Novel Switched-Capacitor Based High Step-Up DC/DC Converter for Renewable Energy System Applications

  • Radmand, Fereshteh;Jalili, Aref
    • Journal of Power Electronics
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    • v.17 no.6
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    • pp.1402-1412
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    • 2017
  • This paper presents a new high step-up dc/dc converter for renewable energy systems in which a high voltage gain is provided by using a coupled inductor. The operation of the proposed converter is based on a charging capacitor with a single power switch in its structure. A passive clamp circuit composed of capacitors and diodes is employed in the proposed converter for lowering the voltage stress on the power switch as well as increasing the voltage gain of the converter. Since the voltage stress is low in the provided topology, a switch with a small ON-state resistance can be used. As a result, the losses are decreased and the efficiency is increased. The operating principle and steady-states analyses are discussed in detail. To confirm the viability and accurate performance of the proposed high step-up dc-dc converter, several simulation and experimental results obtained through PSCAD/EMTDC software and a built prototype are provided.