• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.621-622
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• 2010

• Transactions on Electrical and Electronic Materials
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• 제18권1호
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• pp.35-41
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• 2017

This study looks at optimizinge light redistribution to improve the overall illuminance uniformity of commercial IRED modules. To obtain uniform illumination over a prescribed rectangular area, a freeform surface lens was evaluated using TracePro. The LED light overall illuminance uniformity regulated in KSC 7658 was verified using Relux software. Experimental test results showed 0.81 overall illuminance uniformity for rectangular light distribution of LED lights having a radiation angle of $80^{\circ}$. After fabricating prototype IRED lights based on these simulation results, illuminance performance was observed when used as actual IRED lighting with a nighttime CCTV system. Image observation photographs of the prototype $80^{\circ}$ rectangular IRED lights confirmed that object images can be seen clearly owing to high overall illuminance uniformity, and that dark regions of the CCTV screen were not shown.

• 반도체디스플레이기술학회지
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• 제7권1호
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• pp.35-40
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• 2008

In OLED vacuum evaporation process, the essential requirements include good uniformity of the film thickness over a glass substrate. And, it is commercially significant to improve the consuming efficiency of material of the evaporant which is deposited on the substrate because of high price of organic materials. In this paper, to achieve the better thickness uniformity and the better organic material consuming rate, a process optimization algorithm was developed by understanding vacuum evaporation process parameters that affect the material consuming efficiency and the uniformity of film thickness. Based on the method developed in this study, the vacuum evaporation process of OLED was successfully controlled. The developed method allowed the manufacture of high quality OLED displays with cheaper fabrication cost.

• 한국전기전자재료학회논문지
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• 제23권1호
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• pp.38-41
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• 2010

Compared to conventional molding technology, the color uniformity of light direction emitted from LED is improved with PCB type lead frame technology in which metal thin film is used and transfer molding technology which makes the density of phosphor uniform by manufacturing high density LED lamp. The light efficiency and the color uniformity of the LED are improved by molding the phosphor layer outside of chip and controlling the thickness of the phosphor layer. CIE x,y difference of LED in major axis is also improved uniformly from 0 to 90 degrees.

• Agribusiness and Information Management
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• 제6권1호
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• pp.37-44
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• 2014

This study was conducted to evaluate light intensity and uniformity of two SMD (surface-mount device) type LEDs for protected crop production. A low-power (0.1 W) and a high-power (1 W) LEDs were selected and the intensity and uniformity was evaluated at different vertical (height) and horizontal (distance) intervals. When the horizontal interval of the LED bar was fixed, the light intensity increased and the uniformity decreased as the height decreased. At the 30~40 cm heights, 20~30% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. As the horizontal distance of the LED bars increased, while the uniformity increased as well, the light intensity decreased. At the distances of 6~10 cm, 17~23% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. When the LED bars were added to the sides, the light intensity and uniformity were generally improved. Results showed that the light intensity and uniformity depended on the height and interval of the LED bulbs; therefore, optimum arrangement for the crops interested should be determined through experiments.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.19-25
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• 2023

With an attempt to investigate the correlation between the internal pressure distribution of slit nozzle and the thickness uniformity of slot-coated thin films, we have performed computational fluid dynamics (CFD) simulations of slit nozzles and slot coating of high-viscosity (4,800 cPs) polydimethylsiloxane (PDMS) using a gantry slot-die coater. We have calculated the coefficient of variation (CV) to quantify the pressure and velocity distributions inside the slit nozzle and the thickness non-uniformity of slot-coated PDMS films. The pressure distribution inside the cavity and the velocity distribution at the outlet are analyzed by varying the shim thickness and flow rate. We have shown that the cavity pressure uniformity and film thickness uniformity are enhanced by reducing the shim thickness. It is addressed that the CV value of the cavity pressure that can ensure the thickness non-uniformity of less than 5% is equal to and less than 1%, which is achievable with the shim thickness of 150 ㎛. It is also found that as the flow rate increases, the average cavity pressure is increased with the CV value of the pressure unchanged and the maximum coating speed is increased. As the shim thickness is reduced, however, the maximum coating speed and flow rate decrease. The highly uniform PDMS films shows the tensile strain as high as 180%, which can be used as a stretchable substrate.

• 한국자기공명학회논문지
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• 제7권1호
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• pp.25-36
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• 2003

The performance of radio frequency (RF) coils, used in MRI units, is determined by the image uniformity and the signal-to-noise ratio (SNR). Birdcage and surface coils are commonly used. A birdcage coil provides a good image uniformity while a surface coil produces a high SNR. In this study, therefore, a staircase coil was designed from a standard version of a birdcage coil, with some structural changes to increase SNR while maintaining image uniformity. In phantom experiments, the improvement of the image to uniformity and the SNR increase of the staircase coil compared with the values for the birdcage coil were about 3.5% and 35%, respectively. In clinical experiment, the SNR increase of the staircase coil, compared with the value for the birdcage coil was about 40% in bone, muscle and blood-vessel tissues. These results show that the performance of the staircase coil was very improved over the standard birdcage coil in terms of SNR, and that image uniformity was maintained. Therefore, the staircase coil designed by this study should be useful in experimental and clinical l.5T MRI systems, and this coil offers an alternative method of quadrature detection.

• 반도체디스플레이기술학회지
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• 제20권2호
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• pp.19-24
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• 2021

As the size of semiconductor devices decreases, the etching pattern becomes very narrow and a deep high aspect ratio process becomes important. The cryogenic etching process enables high aspect ratio etching by suppressing the chemical reaction of reactive ions on the sidewall while maintaining the process temperature of -100℃. ESC is an important part for temperature control in cryogenic etching equipment. Through the cooling path inside the ESC, liquid nitrogen is used as cooling water to create a cryogenic environment. And since the ESC directly contacts the wafer, it affects the temperature uniformity of the wafer. The temperature uniformity of the wafer is closely related to the yield. In this study, the cooling path was designed and analyzed so that the wafer could have a uniform temperature distribution. The optimal cooling path conditions were obtained through the analysis of the shape of the cooling path and the change in the speed of the coolant. Through this study, by designing ESC with optimal temperature uniformity, it can be expected to maximize wafer yield in mass production and further contribute to miniaturization and high performance of semiconductor devices.

• 한국수소및신에너지학회논문집
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• 제33권5호
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• pp.550-556
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• 2022

In this study, the flow uniformity was analyzed by performing numerical analysis on the 1 kWe internal manifold type solid oxide fuel cell stack according to the channel height of the separator. Also, it was examined by varying the fuel utilization rate and oxygen utilization rate. From the calculation results, we found that as the channel height of the separator decreased, the pressure drop increased exponentially. In addition, it was found that as the channel height of the separator decreased, the gas flow resistance inside the unit cell increased, and the flow resistance increased the pressure drop, thereby improving the flow uniformity inside the stack. Finally, the calculation results showed that as the fuel and oxygen utilization increased, the flow uniformity also improved.

• 한국전기전자재료학회논문지
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• 제37권2호
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• pp.148-153
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• 2024

As complementary metal-oxide semiconductor (CMOS) is scaled down to achieve higher chip density, thin-film layers have been deposited iteratively. The poor film uniformity resulting from deposition or chemical mechanical planarization (CMP) significantly affects chip yield. Therefore, the development of novel fabrication processes to enhance film uniformity is required. In this context, high-pressure deuterium annealing (HPDA) is proposed to reduce the surface roughness resulting from the CMP. The HPDA is carried out in a diluted deuterium atmosphere to achieve cost-effectiveness while maintaining high pressure. To confirm the effectiveness of HPDA, time-of-flight secondary-ion mass spectrometry (ToF-SIMS) and atomic force microscopy (AFM) are employed. It is confirmed that the absorbed deuterium gas facilitates the diffusion of silicon atoms, thereby reducing surface roughness.