• Transactions of the Korean Society of Mechanical Engineers B
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• v.24 no.4
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• pp.608-613
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• 2000

The present study has proposed a novel aerosol CVD utilizing an internal jet in the conventional MCVD reactor for the purpose of enhancing the deposition efficiency(and rate) and the uniformity of deposited film. The use of impingement of high temperature jet through a thin inner tube ensures the reduction of non-uniform particle deposition zone as well as higher thermophoretic particle deposition. It is shown that significant improvements have been achieved for both aspects of deposition efficiency and uniformity. As jet temperatures increase, the tapered length is reduced and deposition efficiency is significantly increased.

• Journal of Surface Science and Engineering
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• v.41 no.6
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• pp.279-286
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• 2008

Numerical analysis is done to investigate which would be the most influencing process parameter in determining the uniformity of deposition thickness in TiN ICP-CVD(inductively coupled plasma chemical vapor deposition). Two configurations of ICP antenna are modeled; side and top planar. Side and top gas inlets are considered with each ICP antenna geometries. Precursor for TiN deposition was TDMAT(Tetrakis Diethyl Methyl Amido Titanium). Two step volume dissociation of TDMAT is used and absorption, desorption and deposition surface reactions are included. Most influencing factors are H and N concentration dissociated by electron impact collisions in plasma volume which depends on the relative positions of gas inlet and ICP antenna generated hot plasma region. Low surface recombination of N shows hollow type concentration, but H gives a bell type distribution. Film thickness at substrate edges is sensitive to gas flow rate and at high pressures getting more dependent on flow characteristics.

• Transactions of the Society of Information Storage Systems
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• v.1 no.1
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• pp.73-77
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• 2005

In this paper, a new silicon nitride cantilever integrated with silicon heater and piezoelectric sensor has been firstly developed to improve the uniformity of the initial bending and the mechanical stability of the cantilever array for thermo-piezoelectric SPM(scanning probe microscopy) -based data storages. This nitride cantilever shows thickness uniformity less than $2\%$. Data bits of 40 nm in diameter were recorded on PMMA film. The sensitivity of the piezoelectric sensor was 0.615 fC/nm after poling the PZT layer. For high speed operation, 128${\times}$128 probe array was developed.

• Applied Science and Convergence Technology
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• v.23 no.4
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• pp.161-168
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• 2014

A real-time monitoring of immersed antenna type inductively coupled plasma (ICP) was done with a homemade 2 dimensional voltage probe array to check the uniformity of the plasma. Measured voltage values with a high impedance voltmeter are close to the floating potential of the plasma. As the substrate carrier was moving into a magnetron sputtering plasma diffusive from a $125mm{\times}625mm$ size cathode, measured results showed reliably separation of plasma into the upper and lower empty space over the carrier. Infra red thermal imaging camera was used to observe the cross corner effect in situ without eroding a target to the end of the usage. 3 dimensional particle trace model was used to analyze the magnetron discharge's behavior.

• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.49-54
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• 2020

The voltage drop due to the thin cathode film at the large size top emission OLED panel was successfully compensated with making electrical contact between thin cathode and anode auxiliary electrode by 355nm wavelength of laser. It was found that the luminance uniformity dramatically increased from around 15% to more than 80% through this electrical compensation between thin cathode and anode auxiliary electrode. Moreover, the removing process for EL materials on the anode auxiliary electrode process by laser was very reliable and stable. Therefore, it is thought that the EL removal method using laser to make electrical contacts is very appropriate to mass production for such a large size top emission OLEDs to obtain high uniformity of luminance.

• Journal of Astronomy and Space Sciences
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• v.10 no.1
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• pp.86-93
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• 1993

We experiment of the method to obtain the uniform gas multiplication in multiwire proportional counter. The general techenique of anode wire connection for the high voltage supply could not secure the uniformity of multiplication because of the edge effect at the outer anode wires. We found that the variation of the multiplication could be corrected in the accuracy of $\pm$1.6% rms using the voltage compansation method.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.72-77
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• 2016

As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.

• Journal of the Optical Society of Korea
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• v.19 no.2
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• pp.159-164
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• 2015

In the injection-molded light guide plate the replication quality, i.e. the reproduction accuracy, of micro-patterns should be high and uniform over the entire surface area. However technical difficulty in meeting the necessary replication quality arises as the plate size becomes large for TV applications. We propose a simulation technique to optimize the distribution of micro-patterns on a 55-inch injection molded light guide plate considering non-ideal replication quality of micro-patterns. The luminance uniformity could be improved by more than 16% by optimizing the pattern distribution in spite of the same replication quality.

• Journal of the Optical Society of Korea
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• v.4 no.1
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• pp.30-36
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• 2000

In this paper, a method based on the Genetic Algorithm(GA) for phase optimization is proposed. The programmable hybrid optical interconnection system implemented by the spatial light modula-tor is tested for a near-real-time optical processing. Designed diffractive grating has a 74.7[%] high diffraction efficiency and a $1.73 {\times}10^{-1}$ uniformity quantitatively. The dependence of characteris-tics on several parameters in the grating design are analyzed. Also, as a result of the geometrical transformation to obtain quantitative data for $3 {\times} 3$ spot beams, an objective optical experiment using CCD array detector produces the mean of beam intensity as a gray level of 202, the maximum value is 225, the minimum value is 186, and uniformity is quantitatively $1.93 {\times} 10^{-1}$, similar to the simulation result.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.132-133
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• 2007

2개의 주파수가 인가된 유도결합 플라즈마(ICP)를 이용하여 주파수 조합(13.56 or 27.12/2MHz)과 안테나의 캐패시턴스 변화에 따른 $SiO_2$ 와 poly-Si 의 식각특성을 연구하였다. 본 실험의 결과로, 27.12 MHz에서 plasma density가 높다는 것과 13.56 MHz에서 center high profile이 쉽게 형성됨을 알 수 있었다. $SiO_2$ 식각에서는 non-uniformity와 etch rate모두 27.12 MHz가 13.56 MHz보다 높다는 것을 알 수 있었고, poly-Si 식각에서는 non-uniformity와 etch rate모두 비슷한 경향을 나타낸다는 것을 알 수 있었다.