• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.5
• /
• pp.7-12
• /
• 2002

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2008.06a
• /
• pp.545-546
• /
• 2008

• Journal of ILASS-Korea
• /
• v.15 no.2
• /
• pp.94-99
• /
• 2010

The object of this investigation is to study the thermal properties and spray characteristics of kerosene fuel in high temperature and pressure conditions. In order to investigate the thermal properties and spray characteristics, KIVA3 and SUPERTRAPP have been used at the same time. The thermal properties of kerosene has been calculated in high temperature and pressure condition using SUPERTRAPP. The study of spray characteristics has been conducted at both original properties of KIVA3 and calculated properties. The evaporation rate was increased in proportion to pressure when the calculated properties were used. However, the effect of pressure was not shown in the case of using original properties. So the calculated properties are more effective than original properties in high temperature and high pressure condition.

• Journal of the Korean Society for Precision Engineering
• /
• v.28 no.4
• /
• pp.505-512
• /
• 2011

Linear permanent magnet synchronous motors utilize high-energy product permanent magnet to produce high thrust, velocity and acceleration. Such motors are finding applications requiring high positioning accuracy and speed response, for example, machine tools, in the absence of mechanical gears and ball screw systems. A disadvantage of the linear motors is high power loss in comparison with rotary motors. For the application of the linear motors to machine tools, it is required to use water coolers and to improve the thermal behavior through insulation and structure optimization or control strategies. This paper presents the function of the secondary part of the linear synchronous motor as to the thermal behavior and the improving method. The result shows cooling pipe combined with an insulation layer is a suitable design for improving of the thermal behavior.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.4
• /
• pp.91-95
• /
• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• Journal of Mechanical Science and Technology
• /
• v.17 no.9
• /
• pp.1380-1387
• /
• 2003

When a cold HPSI (High pressure Safety Injection) fluid associated with an overcooling transient, such as SGTR (Steam Generator Tube Rupture), MSLB (Main Steam Line Break) etc., enters the cold legs of a stagnated primary coolant loop, thermal stratification phenomena will arise due to incomplete mixing. If the stratified flow enters the downcomer of the reactor pressure vessel, severe thermal stresses are created in a radiation embrittled vessel wall by local overcooling. As general thermal-hydraulic system analysis codes cannot properly predict the thermal stratification phenomena, RG 1.154 requires that a detailed thermal-mixing analysis of PTS (pressurized Thermal Shock) evaluation be performed. Also. previous PTS studies have assumed that the thermal stratification phenomena generated in the stagnated loop side of a partially stagnated primary coolant loop are neutralized in the vessel downcomer by the strong flow from the unstagnated loop. On the basis of these reasons, this paper focuses on the development of a 3-dimensional thermal-mixing analysis model using PHOENICS code which can be applied to both partial and total loop stagnated cases. In addition, this paper verifies the fact that, for partial loop stagnated cases, the cold plume generated in the vessel downcomer due to the thermal stratification phenomena of the stagnated loop is almost neutralized by the strong flow of the unstagnated loop but is not fully eliminated.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.15 no.3
• /
• pp.130-134
• /
• 2016

Due to the need for advanced technologies in the automotive industry, the demand for lighter and safer vehicles has increased. Even though various nonferrous metals, like Aluminum, Magnesium and also Carbon Fiber Reinforced Plastic (CFRP), have been implemented in the automotive industry, a lot of technical research and development is still focused on ferrous metals. In particular, the market volume of High Strength Steel (HSS) parts and Ultra High Strength Steel (UHSS) by hot press forming parts has expanded significantly in all countries' automotive industries. A new tool steel, High Thermal-Conductivity Tool Steel (HTCS), for stamping punches and dies has been developed and introduced by Rovalma Company (Spain), and it is able to support better productivity and quality during hot press forming. The HTCS punches and dies could help to reduce cycle time due to their high thermal conductivity, one of the major factors in hot press forming operation. In this study, test dies were manufactured in order to verify the high thermal conductivity of HTCS material compared to SKD6. In addition, thermal deformation was inspected after the heating and cooling process of hot press forming. After heating and cooling, the test dies were measured by a 3D scanner and compared with the original geometry. The results showed that the thermal deformation and distortion were very small even though the cooling time was reduced by 2 seconds.

• Macromolecular Research
• /
• v.12 no.1
• /
• pp.78-84
• /
• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Elastomers and Composites
• /
• v.55 no.1
• /
• pp.59-66
• /
• 2020

Herein, we investigated the thermal conductivity and thermal stability of natural rubber composite systems containing hybrid fillers of boron nitride (BN) and aluminum nitride (AlN). In the hybrid system, the bimodal distribution of polygonal AlN and planar BN particles provided excellent filler-packing efficiency and desired energy path for phonon transfer, resulting in high thermal conductivity of 1.29 W/mK, which could not be achieved by single filler composites. Further, polyethylene glycol (PEG) was compounded with a commonly used naphthenic oil, which substantially increased thermal conductivity to 3.51 W/mK with an excellent thermal stability due to facilitated energy transfer across the filler-filler interface. The resulting PEG-incorporated hybrid composite showed a high thermal degradation temperature (T₂) of 290℃, a low coefficient of thermal expansion of 26.4 ppm/℃, and a low thermal distortion parameter of 7.53 m/K, which is well over the naphthenic oil compound. Finally, using the Fourier's law of conduction, we suggested a modeling methodology to evaluate the cooling performance in thermal management system.

• Fire Science and Engineering
• /
• v.27 no.3
• /
• pp.72-79
• /
• 2013

Recently, building constructions have been developed toward high-rise, long span, and multi-complexed using the high strength materials, optimized section. But the structural behavior of steel structural members built with a high strength steel at fire condition is not clarified because of lacking of information of related references such as mechanical and thermal properties at high temperature situation. In this paper, to evaluate the structural stability of member or frame of steel framed building at fire situation through the engineering method, the mechanical and thermal experimental coupon tests have conducted at various high temperatures and the comparison to those of ordinary strength steels were done.