• Magazine of the Korean Society of Agricultural Engineers
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• v.31 no.1
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• pp.96-105
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• 1989

This laboratory study was performed to produce basic data for the estimation of water requirements for desalinization, through analyzing changes of the electrical conductivity and the exchangeable sodium percentage during the desalinization of reclaimed tidelands. Desalinization experiments were carried out by two water management practices, namely, the leaching method by subsurface drainage and the rinsing method by surface drainage, using samples of silt loam soil and silty clay loam soil collected in reclaimed tidelands. The results obtained from this study were summarized as follows : 1. The sample soils used in this study were saline-sodic soils with the high electrical conductivity and the high exchangeable sodium percentage. 2. Changes of the electrical conductivity and the exchangeable sodium percentage with water requirements for desalinization showed a similar tendency in the desalinization experiment by the same water management practice. 3. The regression equation between the relative electrical conductivity(EC/EC) and water requirements for desalinization(Dw/Ds) could be described by Dw/Ds=O. 29x(EC/EC.) -0.982 (Leaching method), Dw/Ds=3. 678X0. 030(EC/EC ) (Rinsing method). 4. The regression equation between the relative exchangeable sodium percentage (ESP/ESP ) and water requirements for desalinization (Dw/Ds) could be expressed in Dw/Ds = 0.039 x (ESP/ESP. ) - 1. 134 (Leaching method), Dw/Ds=7. 197X0. 024(ESP/ESP ) (Rinsing method). 5. It was estimated that water requirements for the adequate desalinization would be Dw/Ds=0.3 (Leaching method) and Dw/Ds=3.0 (Rinsing method)

• Journal of Korea Foundry Society
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• v.28 no.2
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• pp.64-68
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• 2008

The microstructure of Cu-Mg-P base alloys were significantly affected by small amounts of Fe and Co additions, however the tensile properties and electrical conductivity of the Cu alloys were mainly determined by the fabrication process. Relatively high electrical conductivity (> 80% IACS) was obtained in the all Cu-Mg-P based alloys when they were finally aged at $480^{\circ}C$. Tensile properties could be significantly enhanced by final cold rolling, especially at extremely low temperatures. Softening of cold-rolled alloys took place at about $450^{\circ}C$ owing to recovery and recrystallization, but it was delayed up to $500^{\circ}C$ in the Fe-added alloy.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.988-989
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• 2006

The ultrasonic welding is with features of high electric conductivity and hot conductivity when it is used in metallic bond, high electric conductivity and hot conductivity when it is used in various metallic bonds, excellent quality when it is used for advanced junction, easiness when it is used in various metallic bonds, being needless for the exhaustive material and being benefit for the environment. Currently the use of ultrasonic welding is increasing in the industrial fields such as the automobile battle, the refrigerator, the air conditioner, the battery and the solar cell junction. But the production ability is insufficient in our country and it is necessary to explore the core technology of the ultrasonic welding. In this paper, the output LC resonance filter and 35kHz squal wave onion occurrence Full Bridge plans was designed. The output examination of the ultrasonic oscillator and the ultrasonic welding examination were done. The method for getting more smooth result in the ultrasonic welding machine system was researched.

• Korean Journal of Materials Research
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• v.30 no.2
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• pp.93-98
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• 2020

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10^-6/℃) than did the monolithic synthesized Cu sintered body.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.379-380
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• 2008

Molecular Dynamics (MD) simulations have been used to model the dynamics of the charge-compensating sodium ions in the non-stoichiometric hollandite Nax$(Ti_{8-x}Cr_x)O_{16}$. These interstitial ions reside in 'tunnels' in the crystal structure and move under the forces of both the ions making up the cage structure and the many body interactions of the other sodium ions in the tunnel. The Velocity Autocorrelation Function (VAF) of the sodium ions is calculated for a range of temperature from 250K to 1000K and converted into the linear ac-conductivity and ac-susceptibility response via Fourier transformation. A peak is found in the conductivity around $6\times10^{12}$ Hz that has some of the character of a Poley absorption. Here it is shown to be due to an harmonically coupled site vibrations of the sodium atoms, which extend only over a limited range. At frequencies below the peak the conductivity tends towards a constant i.e. dc value corresponding to a constant flow of ions through the simulation cell. At high temperatures the conductivity due to this ion transport process behaves like a metal with an insulator to metal transition occurring around a specific temperature.

• Journal of Advanced Marine Engineering and Technology
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• v.31 no.4
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• pp.410-416
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• 2007

PRAM (Phase change random access memory) is one of the most promising candidates for next generation non-volatile memories. However, the high reset current is one major obstacle to develop a high density PRAM. One way of the reset current reduction is to change the heater electrode material. In this paper, to reduce the reset current for phase transition, we have investigated the effect of heater electrode material parameters using finite element analysis. From the simulation. the reset current of PRAM cell is reduced from 2.0 mA to 0.72 mA as the electrical conductivity of heater is decreased from $1.0{\times}10^6\;(1/{\Omega}{\cdot}m$) to $1.0{\times}10^4\;(1/{\Omega}{\cdot}m$). As the thermal conductivity of heater is decreased, the reset current is slightly reduced. But the reset current of PRAM cell is not changed as the specific heat of heater is changed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.8
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• pp.535-540
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• 2014

Because of the development of LED technology, products due to high output and compact, the material with high thermal conductivity has been developed. Now that heat radiating part of the LED lamp is currently used for die casting of aluminum. The development of aluminum with excellent thermal conductivity is required. In this study, we measured the thermal properties and compared them while we produced the alloy by changing the component of die casting aluminum. From this study, the thermal conductivity and thermal resistance of the developed alloy were superior to die casting aluminum.

• Journal of Ceramic Processing Research
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• v.20 no.1
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• pp.48-53
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• 2019

Carbon fiber reinforced SiC composites (C/SiC) have high-temperature stability and excellent thermal shock resistance, and are currently being applied in extreme environments, for example, as aerospace propulsion parts or in high-performance brake systems. However, their low thermal conductivity, compared to metallic materials, are an obstacle to energy efficiency improvements via utilization of regenerative cooling systems. In order to solve this problem, the present study investigated the bonding strength between carbon fiber and matrix material within ceramic matrix composite (CMC) materials, demonstrating the relation between the microstructure and bonding, and showing that the mechanical properties and thermal conductivity may be improved by treatment of the carbon fibers. When fiber surface was treated with a nitric acid solution, the observed segment crack areas within the subsequently generated CMC increased from 6 to 10%; moreover, it was possible to enhance the thermal conductivity from 10.5 to 14 W/m·K, via the same approach. However, fiber surface treatment tends to cause mechanical damage of the final composite material by fiber etching.

• Nuclear Engineering and Technology
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• v.54 no.7
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• pp.2359-2366
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• 2022

Selecting graphite grades with superior irradiation characteristics is important task for designers of graphite moderation reactors. To provide reference information and data for graphite selection, the effects of irradiation on three fine-grained, iso-molded nuclear grade graphites, ETU-10, IG-110, and NBG-25, were compared based on irradiation-induced changes in volume, thermal conductivity, dynamic Young's modulus, and coefficient of thermal expansion. Data employed in this study were obtained from reported irradiation test results in the high flux isotope reactor (HFIR)(ORNL) (ETU-10, IG-110) and high flux reactor (HFR)(NRL) (IG-110, NBG-25). Comparisons were made based on the irradiation dose and irradiation temperature. Overall, the three grades showed similar irradiation-induced property change behaviors, which followed the historic data. More or less grade-sensitive behaviors were observed for the changes in volume and thermal conductivity, and, in contrast, grade-insensitive behaviors were observed for dynamic Young's modulus and coefficient of thermal expansion changes. The ETU-10 of the smallest grain size appeared to show a relatively smaller VC to IG-110 and NBG-25. Drastic decrease in the difference in thermal conductivity was observed for ETU-10 and IG-110 after irradiation. The similar irradiation-induced properties changing behaviors observed in this study especially in the DYM and CTE may be attributed to the assumed similar microstructures that evolved from the similar size coke particles and the same forming method.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.